Abstract: An object of the present invention is to minimize a fear of damaging parts when they are transferred from a carry-in cassette to a carry-out cassette and to shorten a transferring time. Tip end portions of a thrusting-down pin 30 and a suction collet 50 are brought into contact with a back face of an adhesive sheet 11 of a carry-in cassette 10 to thrust down a semiconductor chip 1 and the thrust-down semiconductor chip 1 is received on a carry-out cassette 20A, 20B, or 20C and stuck on an adhesive sheet 21A, 21B, or 21C of a receiving face 201A, 201B, or 201C of the carry out cassette 20A, 20B, or 20C.