Abstract: The electrochemical device includes: a case including a recessed container having a bottom and a side wall, and a cap that covers the opening of the recessed container; a power generation element having a laminate with an electrode layer, an electrode layer and a solid electrolyte layer laminated together and housed in the interior space of the case such that the bottom and electrode layer face each other; and a conductive plate positioned adjacent to the opening of the recessed container and between the electrode layer and cap. The recessed container includes a plurality of supports on the inner peripheral surface of the side wall. The conductive plate includes a plurality of supported portions located on its edges and corresponding in position to the supports. With each supported portion, the power generation element is pushed by a spring piece of the conductive plate toward the bottom of the recessed container.

Abstract: An object of the present invention is to provide an epoxy resin composition which can be suitably used in prepreg and fiber-reinforced composite material applications, and which has an excellent strength, elastic modulus, elastic modulus under hot wet conditions and heat resistance after moisture absorption. The gist of the present invention is an epoxy resin composition including the following components [A], [B] and [C]: [A]: an epoxy resin, [B]: an amine curing agent, and [C]: a phosphate ester compound having a molecular weight of 250 or less; wherein the epoxy resin composition satisfies the following requirements (1) and (2): (1): the epoxy resin composition includes 1 part by mass or more and 15 parts by mass or less of the component [C] with respect to 100 parts by mass of the component [A]; and (2): the component [A] has an average epoxy equivalent of 160 g/eq or less.

Abstract: A first epoxy resin composition is described that includes [A] at least one epoxy resin, [B] at least two hardeners comprising [B-1] at least a first hardener and [B-2] at least a second hardener different from the first hardener, and [C] at least one accelerator, wherein the epoxy resin composition satisfies 5.0>|T1?T2|, where [A], [B], [C], T1 and T2 are as defined. A second epoxy resin composition is described that includes [A] at least one epoxy resin, [B] at least two hardeners comprising [B-1] at least one amine compound and [B-2] at least one organic acid hydrazide compound, and [C] at least one accelerator comprising [C-1] at least one organophosphorus compound, where [A], [B] and [C-1] are as defined. A prepreg comprising reinforcing fiber bundles impregnated with the first epoxy resin or the second epoxy resin is also described as well as a fiber-reinforced composite material.

Abstract: A fiber reinforced prepreg comprising reinforcement fibers; particles (D1) and (D2); and a thermosetting resin composition is provided. The resin includes maleimide compound (A), and co-monomer (B). Co-monomer (B) has least one of an alkenylphenol, an alkenylphenoxy, or a diamine group. Particles (D1) are smaller than (D2) and particles (D1) and (D2) are insoluble in the thermosetting resin. Particles (D1) range in diameter from 1 to 10 microns and have a mode on a volume basis from 3 to 6 microns and are present from 3 to 12 percent by volume of the thermosetting resin. Particles (D2) range from 10 to 100 microns diameter and a mode of 20 to 60 microns and are present from 1 to 6 percent by volume of the thermosetting resin composition. After cure, at least 90% by volume of particles (D1) and (D2) remain in the prepreg interlayers.

Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (4): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): the ratio H/E between the amount by mole, E, of the epoxy group in the component [A] and the amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less. (2): at least a part of the component [C] satisfies 0.10 or more and 0.

Abstract: A prepreg includes composition elements [A], [B], and [C] described below, [A] a reinforcing fiber, [B] a thermosetting resin, and [C] a thermoplastic resin. [C] is present on a surface of the prepreg, [B] contains a first curing agent [b1] and a second curing agent [b2], and the reinforcing fiber of [A] that crosses over a boundary surface between a resin region containing [B] and a resin region containing [C] and that is in contact with both resin regions is present.

Abstract: An object of the present invention is to provide an epoxy resin composition excellent in elastic modulus and strength, and a prepreg and a fiber reinforced composite material with the epoxy resin composition. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or more. (2): at least a part of the component [C] satisfies that the Hansen solubility parameter distance L to the component [A] is 20.0 or less.

Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.

Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications, has high Tg, and is excellent in elastic modulus and strength. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (2): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or less, (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.

Abstract: A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.

Abstract: A prepreg containing the following constituent elements [A] to [C], wherein a resin composition containing the constituent elements [B] and [C] has a higher-order structure derived from a diffraction angle 2? between 1.0° and 6.0° observed with X-ray diffraction after curing: [A]: carbon fibers [B]: epoxy resin [C]: curing agent of [B].

Abstract: A prepreg, which includes a carbon fiber reinforced material, has excellent Mode I interlaminar toughness, Mode II interlaminar toughness, and tensile strength. The prepreg includes the following constituents [A] to [C] and satisfies the following conditions (I) and (II): [A]: a carbon fiber; [B]: an epoxy resin; and [C]: a hardener for [B], and (I) a surface oxygen concentration O/C of [A] measured by X-ray photoelectron spectroscopy is 0.10 or more; and (II) a cured product obtained by curing [B] and [C] includes a resin region having molecular anisotropy exhibiting interference fringes in polarizing microscope observation in a crossed Nicol state.

Abstract: A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.

Abstract: An object of the present invention is to provide an epoxy resin composition capable of providing a carbon fiber-reinforced composite material that is excellent in moldability, heat resistance, and mechanical properties such as tensile strength and compression strength, and a prepreg. The present invention provides an epoxy resin composition containing at least components [A] to [D] shown below: [A]: an epoxy resin having a xylene group; [B]: a glycidyl amine epoxy resin having three or more glycidyl groups in a molecule; [C]: a thermoplastic resin; and [D]: an aromatic polyamine, the epoxy resin composition containing 10 to 80 parts by mass of the component [A] and 20 to 90 parts by mass of the component [B] based on 100 parts by mass in total of epoxy resins, and also 1 to 25 parts by mass of the component [C] based on 100 parts by mass in total of epoxy resins.

Abstract: Provided is a prepreg including the following constituents [A] to [C], the prepreg satisfying the following conditions [I] to [III]: [A]: a sizing agent-coated carbon fiber; [B]: an epoxy resin having a specific structure; and [C]: a hardener for [B], [I]: an epoxy resin composition including the constituents [B] and [C] has a nematic-isotropic phase transition temperature in a temperature range of 130° C. to 180° C.; [II] a prepreg after isothermal holding at 100° C. for 30 minutes does not have a high-order structure originated from a diffraction angle of 2?=1.0° to 6.0° measured by wide angle X-ray diffraction at 100° C.; and [III]: a prepreg after isothermal holding at 180° C. for 2 hours has a high-order structure originated from the diffraction angle of 2?=1.0° to 6.0° measured by wide angle X-ray diffraction at 180° C.

Abstract: A prepreg includes following constituents [A] to [C] and satisfies following conditions (I) and (II): [A]: a carbon fiber; [B]: an epoxy resin; and [C]: a hardener for [B], and (I) a surface oxygen concentration O/C of [A] measured by X-ray photoelectron spectroscopy is 0.10 or more; and (II) a cured product obtained by curing [B] and [C] includes a resin region having molecular anisotropy exhibiting interference fringes in polarizing microscope observation in a crossed Nicol state.

Abstract: Provided are: an epoxy resin composition that gives a carbon fiber-reinforced composite material having excellent moldability, heat resistance, and mechanical properties such as tensile strength and compressive strength; and a prepreg. An epoxy resin composition containing at least the following constituent elements [A]-[D]. The epoxy resin composition contains 5-50 parts by mass of constituent element [A] and 20-95 parts by mass of constituent element [B], as well as 1-25 parts by mass of constituent element [C], relative to 100 parts by mass of the total amount of epoxy resin. Constituent element [A] is an epoxy resin having primarily two epoxy groups and one or more condensed polycyclic aromatic hydrocarbon skeletons within a repeating unit of a specific structure; [B] is a glycidylamine epoxy resin having three or more glycidyl groups in the molecule; [C] is a sulfone or imide thermoplastic resin; and [D] is an epoxy resin curing agent.

Abstract: Provided are a medium conveying device and an inkjet printer that can convey a medium stably. In a case where a paper P is conveyed along a plane in a conveying unit 40, a posture of the paper P is corrected by a posture correction unit 20, and then the paper P is delivered to the conveying unit 40 by a delivery unit 30. The delivery unit 30 holds a leading end portion of the paper P of which the posture is corrected by the posture correction unit 2 with a paper holding bar 31, and delivers the paper P to the conveying unit 40 by moving the paper holding bar 31 linearly along a conveying direction of the paper P by the conveying unit 40.

Abstract: A prepreg containing at least the following components [A]-[F], wherein the ratio Ne/Nd of the number of structures Ne of component [F] present in a range of outside 110% of the particle diameter of component [E] and the number of structures Nd of component [F] present in a range outside 110% of the particle diameter of component [D] is 0.25 or higher. [A]: Carbon fibers, [B] thermosetting resin, [C]: curing agent, [D]: particles composed mainly of thermoplastic resin having a primary particle number-average particle size of 5-50 ?m, [E]: conductive particles different from component [D] and having a primary particle number-average particle size in the range of a specific expression, [F]: filler comprising a carbon material.

Abstract: A prepreg containing the following constituent elements [A] to [C], wherein a resin composition containing the constituent elements [B] and [C] has a higher-order structure derived from a diffraction angle 20 between 1.0° and 6.0° observed with X-ray diffraction after curing: [A]: carbon fibers [B]: epoxy resin [C]: curing agent of [B].