Abstract: Provided is a power conversion device which comprises a main circuit board, a first board, and a second board and which has a reduced size. The main circuit board has a rectifier circuit and an inverter circuit which are disposed in a high-power section, the rectifier circuit rectifying AC voltage and The second board is provided with a The first board is connected to the main circuit board and to the second board, and is provided with: a first circuit disposed in a low-power section. The second board is provided with a second circuit disposed in a low-power section. section from each other in a reinforced manner; an insulating transformer disposed in the reinforced insulation region and constituting a constituent component of a power supply circuit for receiving the DC voltage and supplying power to the first circuit and to the second circuit; and an insulating element disposed in the reinforced insulation region and allowing a signal to be exchanged between the first circuit and the second circuit.

Abstract: In the present invention, miniaturization of an electric power conversion system is made possible while the reduction of a rise in temperature is achieved through a cooling operation by a cooling fan. The electric power conversion system is provided with a casing for covering cooling fins for cooling power semiconductors, a main circuit board having a driver circuit for driving the power semiconductors, and a cover for covering up the main circuit board. The system includes a first airflow hole provided at a part of the main circuit board, on the upper side of an air-intake provided in the cover, and a second airflow hole provided on the lower side of the first airflow hole, and on the lower side of the cooling fins, wherein air from the second airflow hole is driven to the cooling fins by a cooling fan.

Abstract: The two-sides in-mold decoration molding die includes a first mold on which the first decoration film is lengthwise movably disposed, and a second mold on which the second decoration film is laterally movably disposed and provided with a sprue and a runner, and a protruding section set higher than a region where the second decoration film passes is provided in a portion surrounding at least the runner, in an area directly confronting the first decoration film when the molds are clamped.

Abstract: In the present invention, miniaturization of an electric power conversion system is made possible while the reduction of a rise in temperature is achieved through a cooling operation by a cooling fan. The electric power conversion system is provided with a casing for covering cooling fins for cooling power semiconductors, a main circuit board having a driver circuit for driving the power semiconductors, and a cover for covering up the main circuit board. The system includes a first airflow hole provided at a part of the main circuit board, on the upper side of an air-intake provided in the cover, and a second airflow hole provided on the lower side of the first airflow hole, and on the lower side of the cooling fins, wherein air from the second airflow hole is driven to the cooling fins by a cooling fan.

Abstract: The two-sides in-mold decoration molding die includes a first mold on which the first decoration film is lengthwise movably disposed, and a second mold on which the second decoration film is laterally movably disposed and provided with a sprue and a runner, and a protruding section set higher than a region where the second decoration film passes is provided in a portion surrounding at least the runner, in an area directly confronting the first decoration film when the molds are clamped.

Abstract: An in-mold decorated molded article wherein a coating layer is formed on a top surface of a transparent molded resin body which is flattened in a thickness direction of the body, thereby covering an edge part of the top surface adjacent to a side face on with a side gate mark formed, in order for the side gate mark not to be seen from the top surface of the molded resin body, and a decorative layer is formed on a bottom surface of a decorative layer of the transparent molded resin body. According to an in-mold decorated molded article, even when the transparent molding resin is employed with the result that an agreeable appearance is not achieved despite of a treatment for the side gate mark, the design property of the in-mold decorated molded article can be maintained, the gate mark of unacceptable appearance being not seen from the top surface.

Abstract: An injection molded article (15) which has a transfer layer (29) bonded onto and integrated with a surface thereof and in which a sectional shape of a part of a corner of a top surface of the injection molded article where a radius r of curvature is the smallest satisfies conditions of R<D and 0.1?rRA/D?10, or R?D and 0.2?rR/D?30, or 0.01?rRR2A/H?1.0, wherein R is a radius of curvature of the corner of the top surface, D is a distance between the top surface and a reference surface, A is a draft at a parting corner, R2 is a radius of curvature at the parting corner, and H is a distance between a top surface of a recessed part and the reference surface.