Abstract: A hard film for cutting tools which is composed of (Ti1?a?b?c?d, Ala, Crb, Sic, Bd)(C1?eNe) 0.5?a?0.8, 0.06?b, 0?c?0.1, 0?d?0.1, 0?c+d?0.1, a+b+c+d<1, 0.5?e?1 (where a, b, c, and d denote respectively the atomic ratios of Al, Cr, Si, and B, and e denotes the atomic ratio of N).

Abstract: A hard film for cutting tools which is composed of (Ti1-a-b-c-d, Ala, Crb, Sic, Bd)(C1-eNe) 0.5?a?0.8, 0.06?b, 0?c?0.1, 0?d?0.1, 0?c+d?0.1, a+b+c+d<1, 0.5?e?1 (where a, b, c, and d denote respectively the atomic ratios of Al, Cr, Si, and B, and e denotes the atomic ratio of N.

Abstract: A hard film for cutting tools which is composed of (Ti1?a?b?c?d, Ala, Crb, Sic, Bd) (C1?eNe) 0.5?a?0.8, 0.06?b, 0?c?0.1, 0?d?0.1, 0?c+d?0.1, a+b+c+d<1, 0.5?e?1 (where a, b, c, and d denote respectively the atomic ratios Al, Cr, Si, and B, and e denotes the atomic ratio of N.

Abstract: A hard film for cutting tools which is composed of

Abstract: A hard film for cutting tools which is composed of (Ti1−a−b−c−d, Ala, Crb, Sic, Bd)(C1−aNe) 0.5≦a≦0.8, 0.06≦b, 0≦c≦0.1, 0≦d≦0.1, 0≦c+d≦0.1, a+b+c+d<1, 0.5≦e≦1 (where a, b, c, and d denote respectively the atomic ratios Al, Cr, Si, and B, and e denotes the atomic ratio of N.

Abstract: A hard film for cutting tools which is composed of

Abstract: A vacuum arc deposition apparatus includes arc power sources having cathodes connected to both ends of an evaporation source; exciting coils disposed at positions axially outwardly far from both the ends of the evaporation source so as to be coaxial with the evaporation source; and coil power sources independently connected to the exciting coils. In this apparatus, each of the coil power sources is capable of controlling the exciting current in such a manner that the film thickness and the consumption of the evaporation source are suitably distributed. Moreover, an arc containment device of the vacuum arc deposition apparatus includes an arc containment body having a diameter substantially the same as that of a cylindrical evaporation source, which is disposed at one end portion of the evaporation source.

Abstract: The present invention relates to an arc ion plating device utilizing a vacuum arc discharge to be utilized for the surface process of works and to an arc ion plating system provided with the above-mentioned device, and the present invention offers the device and the system which are able to realize extremely high productivity by an efficient handling of works. The device according to the present invention comprises a rod-shaped evaporation source and works to be coated with a film being disposed so as to surround the rod-shaped evaporation source, The device is so constituted that the works can be moved relative to the rod-shaped evaporation source in the axial direction of the rod-shaped evaporation source.