Abstract: A piston is provided displaceably in the interior of a cylinder tube that constitutes a fluid pressure cylinder, and a piston cover made from an elastic material is disposed so as to cover one end surface of the piston. The piston cover comprises a main body portion confronting a head cover of the cylinder tube, a guide portion covering an outer circumferential surface of the piston and disposed in sliding contact with an inner circumferential surface of a cylinder hole, and a hook portion folded toward an inner circumferential side with respect to the guide portion. Upon displacement of the piston toward the head cover, shocks are absorbed by abutment of the main body portion against the head cover. When the piston is displaced along the cylinder tube, the guide portion serves to guide the piston in the axial direction by sliding contact with the cylinder hole.

Abstract: A method of manufacturing a photoelectric conversion device includes forming, with material containing aluminum, an electrically conductive pattern on a semiconductor substrate including a photoelectric converter, forming, on the electrically conductive pattern, an insulating film containing hydrogen, performing first annealing in a hydrogen-containing atmosphere, forming, on the insulating film, a protective film having lower hydrogen permeability than that of the insulating film after the first annealing, and performing second annealing in the hydrogen-containing atmosphere. Temperature in the first annealing is not less than temperature when forming the insulating film and not more than temperature when forming the protective film.

Abstract: This disclosure discloses a screen device. The screen device includes a screen part used for displaying an image, at least one polyhedron including a plurality of planes used as the screen part for displaying the image, and a first drive device configured to rotate the at least one polyhedron around at least one axis.

Abstract: A method for manufacturing a semiconductor device comprising, forming a first photoresist pattern by exposing and then developing a first photoresist film formed on a substrate, irradiating the first photoresist pattern with UV light to cure its surface, forming a second photoresist film so as to cover the substrate and the first photoresist pattern, forming a second photoresist pattern and performing ion implantation in the substrate using the second photoresist pattern. The second photoresist pattern is not subjected to UV irradiation after the second photoresist film has been developed and before the ion implantation is performed, or is irradiated with the UV light, after the second photoresist film has been developed and before the ion implantation is performed, under a reduced condition relative to that for the first photoresist pattern.

Abstract: A method includes forming a multilayered film including a conductive layer mainly containing aluminum, and a barrier metal layer formed thereon, forming a hard mask layer on the barrier metal layer, patterning a resist on the hard mask layer, patterning the hard mask layer by dry-etching the hard mask layer with the patterned resist as a mask, cleaning a surface of the barrier metal layer with a cleaning solution after the patterning the hard mask layer, and dry-etching the multilayered film with the patterned hard mask layer as a mask after the cleaning the surface of the barrier metal layer. In the patterning the hard mask layer, dry etching is performed with a ratio of a flow rate of an oxidizing gas to a total flow rate of a process gas at less than 1% in a state in which the barrier metal layer is exposed to the process gas.

Abstract: An interposer includes a wiring member including a first inorganic substrate, a reinforcement member including a second inorganic substrate, and an adhesive part interposed between the wiring member and the reinforcement member. Each of the first and second inorganic substrates includes first and second surfaces. Multiple inorganic insulating layers formed on the first surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in a vertical direction with the adhesive part centered therebetween. An inorganic insulating layer and an organic insulating layer formed on the second surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in the vertical direction with the adhesive part. An organic insulating layer formed on the second surface of each of the first and second inorganic substrates is an outermost insulating layer.

Abstract: A coupling structure for a piston used in a fluid-pressure cylinder. The piston in the fluid-pressure cylinder includes a piston hole that runs through a central part of the piston in an axial direction thereof. One end of a piston rod and a coupling body coupled to the one end are inserted into the piston hole. The coupling body includes: a main part that contacts the one end of the piston rod; and an angled part formed around the main part and inclined at a prescribed angle with respect thereto. When the coupling body is subjected to pressure inside the piston hole, the diameter of the coupling body increases and a pointed edge of the angled part engages with an inner surface of the piston hole such that the coupling body couples the piston and the piston rod.

Abstract: A method for manufacturing a semiconductor device comprising, forming a first photoresist pattern by exposing and then developing a first photoresist film formed on a substrate, irradiating the first photoresist pattern with UV light to cure its surface, forming a second photoresist film so as to cover the substrate and the first photoresist pattern, forming a second photoresist pattern and performing ion implantation in the substrate using the second photoresist pattern. The second photoresist pattern is not subjected to UV irradiation after the second photoresist film has been developed and before the ion implantation is performed, or is irradiated with the UV light, after the second photoresist film has been developed and before the ion implantation is performed, under a reduced condition relative to that for the first photoresist pattern.

Abstract: A conveying system includes: a linear induction motor including a stator provided with a plurality of primary coils arranged along a conveying path and a mover provided movably along the conveying path; one or more first inverters that are provided corresponding to at least one of the primary coils in one or more areas requiring positioning on the conveying path to perform vector control with a sensor; one or more second inverters that are provided corresponding to at least of the primary coils in one or more areas requiring no positioning on the conveying path to perform V/F control; and a controller that is configured to output a speed reference to the first second inverters to control electric supply to the primary coils and to output the speed reference based on a feedback position received from a detector to the first inverter, to perform position control.

Abstract: A guide rail is provided on an outer surface of a chuck body. A pair of fingers is disposed on the guide rail. At least one of the pair of fingers is a movable finger that is movable along the guide rail. One or two cylinder apparatuses, each of which has a rod that advances and retracts in the direction of its axial line by the action of air pressure, are provided in the chuck body. The top end of the rod extends from an end of the chuck body to the outside. An end block is attached to the top end of the rod. The end block is linked to the movable finger.

Abstract: A method of manufacturing an image sensor includes forming a resist film with a thickness of not less than 7 ?m on a substrate having an effective region including a pixel array region and a peripheral region, and a non-effective region, forming a resist pattern including first, second and third openings from the resist film, and implanting ions into the pixel array region through the first, second and third openings. The first opening is arranged in the effective region to implant the ions into the pixel array region, the third opening is arranged in the non-effective region, and at least a part of the second opening is arranged between the first opening and the third opening, and a minimum curvature radius of an edge of the second opening is larger than that of the third opening.

Abstract: A method of manufacturing a solid-state image sensor includes forming a resist film with a thickness of not less than 7 ?m on a semiconductor substrate including an active region and an element isolation region, forming a resist pattern including an opening by performing a photolithography process on the resist film, and implanting ions into a pixel array region on the semiconductor substrate through the opening, wherein the opening of the resist pattern includes a corner portion, and the corner portion is positioned not above the element isolation region but above the active region.

Abstract: A semiconductor device includes a support body provided with a wiring layer that includes a first pad; a first semiconductor chip; a first relay substrate stacked on the first semiconductor chip through a first non-conductive adhesion layer and including a first conductive portion and a first protruding electrode electrically connected to the first conductive portion; a second semiconductor chip stacked on the first relay substrate through a second non-conductive adhesion layer, the first protruding electrode of the first relay substrate penetrating the second non-conductive adhesion layer to be connected to the second semiconductor chip; and a first metal wire formed at the first relay substrate to be connected to the first conductive portion for electrically connecting the first conductive portion with the first pad of the wiring layer of the support body.

Abstract: There is provided a wiring board for mounting a light emitting element thereon. The wiring board includes: an insulating layer; a wiring pattern on the insulating layer; a reflecting layer on the insulating layer to cover the wiring pattern, wherein the light emitting element is to be mounted on a surface of the reflecting layer; and a silica film on the surface of the reflecting layer.

Abstract: A pair of penetrating holes are formed along a longitudinal direction in the interior of a cylinder body that constitutes a fluid pressure cylinder. One end of the pair of penetrating holes is sealed by a pair of caps formed in plate-like shapes. The caps, for example, are formed by press molding a plate body made up from a metal material such as aluminum or the like. Outer edge portions of the caps include bent portions, which are inclined at a predetermined angle in a radial outward direction. In addition, the caps are installed by means of the bent portions biting into inner circumferential surfaces of the penetrating holes.

Abstract: A linear actuator includes a cylinder main body. With respect to the cylinder main body, a slide table is disposed for reciprocal displacement through a guide mechanism, which is disposed on the cylinder main body. A stopper mechanism having a stopper bolt is disposed on one end of the slide table centrally in a widthwise direction perpendicular to the longitudinal direction of the slide table. In addition, when the slide table is displaced along the cylinder main body, an end of the stopper bolt comes into abutment with an end of a cover of the guide mechanism, whereupon the slide table becomes engaged therewith and movement of the slide table is stopped.

Abstract: A method of producing a steel product having an excellent internal quality including subjecting a steel raw material of a round section to rolling at 3 or more passes to form a steel product of round section, wherein the rolling is conducted with a pair of upper and lower flat rolls at first pass, a pair of upper and lower same or different caliber rolls at second or more passes until just before a last pass, and a pair of upper and lower round caliber rolls at the last pass, under a condition that an area reduction in the first pass is within a range of less than a total area reduction from the raw material to the product.

Abstract: The present invention relates to a linear actuator. A slide table of the linear actuator includes a table main body and an end plate connected to another end of the table main body. On a base portion of the table main body, four workpiece retaining holes are formed, and fitting seats are disposed respectively about the workpiece retaining holes on radial outer sides thereof. The fitting seats are formed at the same time that the table main body is formed by press molding.