Patents by Inventor Koji Hayashi

Koji Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250051394
    Abstract: Cyclic compounds that selectively inhibit KRAS were found. Moreover, cyclic compounds were found to interact with an amino acid residue specific to KRAS.
    Type: Application
    Filed: September 10, 2024
    Publication date: February 13, 2025
    Applicant: CHUGAI SEIYAKU KABUSHIKI KAISHA
    Inventors: Hatsuo KAWADA, Koji TAKANO, Tomoya KOTAKE, Mirai KAGE, Satoshi HASHIMOTO, Minoru TAMIYA, Yuma WAKAMIYA, Ryuji HAYASHI, Yuya MORITA
  • Publication number: 20250028811
    Abstract: An information processing system includes a processor configured to recognize a new device administrator as a device administrator in a case where first authentication information and second authentication information for the device administrator are received, reset or overwrite the second authentication information in a case where an instruction to reset or overwrite the second authentication information is given by a user belonging to a predetermined authority group permitted to reset or overwrite the second authentication information for the device administrator, and perform processing of initializing the first authentication information for the device administrator in a case where the second authentication information is reset or overwritten.
    Type: Application
    Filed: March 1, 2024
    Publication date: January 23, 2025
    Applicant: Fujifilm Business Innovation Corp.
    Inventor: Koji HAYASHI
  • Patent number: 12205284
    Abstract: A console includes a CPU that acquires an image to be processed which is an object to be subjected to a support process that is a diagnosis support process or an imaging support process and selects a support process to be applied to the image to be processed from a plurality of processes of the support process on the basis of a part of a subject which is included in the image to be processed.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: January 21, 2025
    Assignee: FUJIFILM CORPORATION
    Inventors: Koji Taninai, Hiromu Hayashi, Akihito Bettoyashiki, Takeyasu Kobayashi, Kazuhiro Makino
  • Patent number: 12017980
    Abstract: Provided are a monofunctional phenolic compound used for producing an active ester resin capable of forming a cured product having excellent dielectric properties and excellent heat resistance, an active ester resin and a method for producing the active ester resin, and a thermosetting resin composition and a cured product of the thermosetting resin composition. Specifically, provided are a monofunctional phenolic compound including one or more vinylbenzyl groups and an active ester resin including a vinylbenzyl structure attached to a terminal group of the molecular chain and derived from the monofunctional phenolic compound. The vinylbenzyl structure preferably includes a vinylbenzyl-modified aryloxycarbonyl group.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: June 25, 2024
    Assignee: DIC Corporation
    Inventors: Masaki Hazama, Koji Hayashi
  • Patent number: 11982687
    Abstract: The present disclosure relates to an IC chip holder capable of alleviating an impact if the IC chip holder is dropped or collides with another object. In the IC chip holder, an upper housing body is provided, on a side of electric contacts of an IC chip, with an elastic deformation portion capable of elastically deforming toward the inside of the upper housing body. Thus, since the elastic deformation portion elastically deforms toward the inside of the upper housing body, if the IC chip holder is dropped or collides with another object, the elastic deformation portion bends and the impact is alleviated. Thus, a possibility of the IC chip being damaged is reduced.
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: May 14, 2024
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Hidekazu Komiya, Koji Hayashi
  • Patent number: 11901249
    Abstract: A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: February 13, 2024
    Assignee: DIC Corporation
    Inventors: Yutaka Satou, Kazuhisa Yamoto, Koji Hayashi
  • Publication number: 20240031505
    Abstract: An information processing apparatus includes: a processor configured to: acquire characteristic information related to a characteristic of each destination information together with an address table including plural destination information from another apparatus; and register, in a case where the number of cases of the destination information included in the acquired address table is larger than the number of cases of destination information that is registrable in an address table of the information processing apparatus, a part of the destination information included in the acquired address table in the address table of the information processing apparatus, by using the characteristic information.
    Type: Application
    Filed: February 8, 2023
    Publication date: January 25, 2024
    Applicant: FUJIFILM Business Innovation Corp.
    Inventor: Koji HAYASHI
  • Patent number: 11873356
    Abstract: A curable composition to be cured to a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film. There is a curable composition containing an aromatic ester compound (A) and a maleimide compound (B), the aromatic ester compound (A) being represented by structural formula (1) (where in the formula, Ar1 is a substituted or unsubstituted aromatic ring group, each R1 is a polymerizable unsaturated bond-containing substituent, each 1 is 0 or 1, each R2 is any of an alkyl group, an alkoxy group, an alkyloxycarbonyl group, an alkylcarbonyloxy group, and a halogen atom, each m is 0 or an integer of 1 to 5, and n is 2 or 3, provided that at least one polymerizable unsaturated bond-containing substituent is contained in one molecule as a substituent on Ar1 or as R1).
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: January 16, 2024
    Assignee: DIC Corporation
    Inventors: Kazuhisa Yamoto, Yutaka Satou, Koji Hayashi
  • Patent number: 11745448
    Abstract: Provided is a technology for imparting a design having a higher degree of freedom than in the related art to a composite material product including a woven fabric, which is formed of a thread made of a specific fiber (carbon fiber, glass fiber, aramid fiber), and a resin. As a first step, a specific fiber cloth (100), which is the woven fabric formed of the thread made of a specific fiber, and a backing sheet (200) formed of a thermoplastic resin are stacked. Subsequently, embroidery is performed with an embroidery thread (300) to form a design on a front surface of the specific fiber cloth (100). The embroidery thread (300) is made of the specific fiber, and penetrates through the specific fiber cloth (100) and the backing sheet (200). Then, the specific fiber cloth (100) and the backing sheet (200) are sandwiched between resin sheets (400) each formed of a thermoplastic resin, and the whole is cured by an RFI method.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: September 5, 2023
    Assignee: FUTURE TECHNOLOGY CO., LTD.
    Inventor: Koji Hayashi
  • Publication number: 20230134567
    Abstract: An information processing apparatus includes a processor configured to: receive an instruction to change an authority of a first user from a first authority to a second authority; and change the authority of the first user from the first authority to the second authority and change an authority of a second user who is under a control of the first user from the first authority.
    Type: Application
    Filed: June 5, 2022
    Publication date: May 4, 2023
    Applicant: FUJIFILM Business Innovation Corp.
    Inventor: Koji HAYASHI
  • Patent number: 11584168
    Abstract: Provided is a tire provided with a mark capable of reducing the air resistance during tire rotation while maintaining good visibility. A tire is provided with a mark on a tire side portion. The mark includes a first mark located on an outer side in a tire radial direction, and a second mark located inward of the first mark in the tire radial direction. Each of the first mark and the second mark includes a recess that is recessed from a side profile surface of the tire side portion. A depth of the recess of the first mark from the side profile surface is smaller than a depth of the recess of the second mark from the side profile surface.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: February 21, 2023
    Assignee: SUMITOMO RUBBER INDUSTRIES, LTD.
    Inventors: Ryo Oba, Kenji Ueda, Masatomo Nakamura, Koji Hayashi, Masaki Terashima, Masahiro Nagase, Masahiro Tatsuta, Junya Tamai, Masaya Ito
  • Patent number: 11548977
    Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: January 10, 2023
    Assignee: DIC Corporation
    Inventors: Yutaka Satou, Kazuhisa Yamoto, Koji Hayashi
  • Publication number: 20220413011
    Abstract: The present disclosure relates to an IC chip holder capable of alleviating an impact if the IC chip holder is dropped or collides with another object. In the IC chip holder, an upper housing body is provided, on a side of electric contacts of an IC chip, with an elastic deformation portion capable of elastically deforming toward the inside of the upper housing body. Thus, since the elastic deformation portion elastically deforms toward the inside of the upper housing body, if the IC chip holder is dropped or collides with another object, the elastic deformation portion bends and the impact is alleviated. Thus, a possibility of the IC chip being damaged is reduced.
    Type: Application
    Filed: August 26, 2022
    Publication date: December 29, 2022
    Inventors: Hidekazu KOMIYA, Koji HAYASHI
  • Patent number: 11499991
    Abstract: The present disclosure relates to an IC chip holder capable of alleviating an impact if the IC chip holder is dropped or collides with another object. In the IC chip holder, an upper housing body is provided, on a side of electric contacts of an IC chip, with an elastic deformation portion capable of elastically deforming toward the inside of the upper housing body. Thus, since the elastic deformation portion elastically deforms toward the inside of the upper housing body, if the IC chip holder is dropped or collides with another object, the elastic deformation portion bends and the impact is alleviated. Thus, a possibility of the IC chip being damaged is reduced.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: November 15, 2022
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Hidekazu Komiya, Koji Hayashi
  • Patent number: 11441670
    Abstract: Because an EOP starts operating from when a decrease in discharge flow rate of an MOP is predicted or detected, a PL actual pressure that should be obtained with a PL command pressure set to a value for a required transmission torque is more easily maintained even when the discharge flow rate of the MOP becomes insufficient. After a lapse of a predetermined period of time from the start of operation of the EOP, the PL command pressure is temporarily set to a value higher than the value for the required transmission torque, and a regulator valve is controlled to operate to close a drain port. Therefore, the operation of the EOP in a high PL actual pressure is reduced, and a delay in response of a pressure regulating operation of the regulator valve in the process of reduction of the discharge flow rate of the MOP is reduced.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 13, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kota Fujii, Yuki Makino, Toshiaki Tamachi, Koji Hayashi, Tooru Matsubara, Ken Fujimoto, Masato Nakano
  • Patent number: 11327856
    Abstract: A robot application is executed by executing a plurality of kinds of virtual containers in cooperation with each other. To this end, a robot application management device (100), at least one robot device (300) and at least one computer device (400) are connected to each other via a local area network (600). A group of devices including these devices are managed as a cluster for executing the robot application, and each virtual container is placed and activated in any of the group of devices composing the cluster.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: May 10, 2022
    Assignee: INTEC INC.
    Inventors: Tatsuya Fukuta, Ruri Hamada, Koji Hayashi
  • Patent number: 11316989
    Abstract: A processing system includes a detecting unit that detects an operator operation to set a recording medium onto an image processing apparatus or to move part of the image processing apparatus wherein the operator operation is an operation performed by an operator, and a controller that registers a registration processes and performs, in response to detected operator operation, a registration process among registration processes registered in advance wherein if one or more of the registration processes satisfy a predetermined condition, the controller registers the one or more of the registration processes which are changed not to perform in response to the operator operation or to perform the one or more of the registration processes after performing a particular process.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: April 26, 2022
    Assignee: FUJIFILM Business Innovation Corp.
    Inventor: Koji Hayashi
  • Patent number: 11286385
    Abstract: The present invention provides an epoxy resin composition that contains an epoxy resin (A) that is a product of reaction between an epihalohydrin and either catechol, optionally with its aromatic ring methyl-substituted, or pyrogallol, optionally with its aromatic ring methyl-substituted, and an aromatic glycidylamine epoxy resin (B). This epoxy resin composition is suitable for use in fiber-reinforced composite materials, fiber-reinforced plastic articles, etc., by virtue of being liquid at room temperature, being superior in quick curing, and high mechanical properties in its cured form.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: March 29, 2022
    Assignee: DIC Corporation
    Inventors: Koji Hayashi, Nana Sugimoto, Kunihiro Morinaga
  • Publication number: 20220033333
    Abstract: Provided are a monofunctional phenolic compound used for producing an active ester resin capable of forming a cured product having excellent dielectric properties and excellent heat resistance, an active ester resin and a method for producing the active ester resin, and a thermosetting resin composition and a cured product of the thermosetting resin composition. Specifically, provided are a monofunctional phenolic compound including one or more vinylbenzyl groups and an active ester resin including a vinylbenzyl structure attached to a terminal group of the molecular chain and derived from the monofunctional phenolic compound. The vinylbenzyl structure preferably includes a vinylbenzyl-modified aryloxycarbonyl group.
    Type: Application
    Filed: September 12, 2019
    Publication date: February 3, 2022
    Applicant: DIC Corporation
    Inventors: Masaki Hazama, Koji Hayashi
  • Patent number: D956138
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: June 28, 2022
    Assignee: BROTHER INDUSTRIES, LTD.
    Inventors: Hidekazu Komiya, Koji Hayashi