Abstract: Provided are a monofunctional phenolic compound used for producing an active ester resin capable of forming a cured product having excellent dielectric properties and excellent heat resistance, an active ester resin and a method for producing the active ester resin, and a thermosetting resin composition and a cured product of the thermosetting resin composition. Specifically, provided are a monofunctional phenolic compound including one or more vinylbenzyl groups and an active ester resin including a vinylbenzyl structure attached to a terminal group of the molecular chain and derived from the monofunctional phenolic compound. The vinylbenzyl structure preferably includes a vinylbenzyl-modified aryloxycarbonyl group.

Abstract: The present disclosure relates to an IC chip holder capable of alleviating an impact if the IC chip holder is dropped or collides with another object. In the IC chip holder, an upper housing body is provided, on a side of electric contacts of an IC chip, with an elastic deformation portion capable of elastically deforming toward the inside of the upper housing body. Thus, since the elastic deformation portion elastically deforms toward the inside of the upper housing body, if the IC chip holder is dropped or collides with another object, the elastic deformation portion bends and the impact is alleviated. Thus, a possibility of the IC chip being damaged is reduced.

Abstract: A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.

Abstract: An information processing apparatus includes: a processor configured to: acquire characteristic information related to a characteristic of each destination information together with an address table including plural destination information from another apparatus; and register, in a case where the number of cases of the destination information included in the acquired address table is larger than the number of cases of destination information that is registrable in an address table of the information processing apparatus, a part of the destination information included in the acquired address table in the address table of the information processing apparatus, by using the characteristic information.

Abstract: A curable composition to be cured to a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film. There is a curable composition containing an aromatic ester compound (A) and a maleimide compound (B), the aromatic ester compound (A) being represented by structural formula (1) (where in the formula, Ar1 is a substituted or unsubstituted aromatic ring group, each R1 is a polymerizable unsaturated bond-containing substituent, each 1 is 0 or 1, each R2 is any of an alkyl group, an alkoxy group, an alkyloxycarbonyl group, an alkylcarbonyloxy group, and a halogen atom, each m is 0 or an integer of 1 to 5, and n is 2 or 3, provided that at least one polymerizable unsaturated bond-containing substituent is contained in one molecule as a substituent on Ar1 or as R1).

Abstract: Provided is a technology for imparting a design having a higher degree of freedom than in the related art to a composite material product including a woven fabric, which is formed of a thread made of a specific fiber (carbon fiber, glass fiber, aramid fiber), and a resin. As a first step, a specific fiber cloth (100), which is the woven fabric formed of the thread made of a specific fiber, and a backing sheet (200) formed of a thermoplastic resin are stacked. Subsequently, embroidery is performed with an embroidery thread (300) to form a design on a front surface of the specific fiber cloth (100). The embroidery thread (300) is made of the specific fiber, and penetrates through the specific fiber cloth (100) and the backing sheet (200). Then, the specific fiber cloth (100) and the backing sheet (200) are sandwiched between resin sheets (400) each formed of a thermoplastic resin, and the whole is cured by an RFI method.

Abstract: An information processing apparatus includes a processor configured to: receive an instruction to change an authority of a first user from a first authority to a second authority; and change the authority of the first user from the first authority to the second authority and change an authority of a second user who is under a control of the first user from the first authority.

Abstract: Provided is a tire provided with a mark capable of reducing the air resistance during tire rotation while maintaining good visibility. A tire is provided with a mark on a tire side portion. The mark includes a first mark located on an outer side in a tire radial direction, and a second mark located inward of the first mark in the tire radial direction. Each of the first mark and the second mark includes a recess that is recessed from a side profile surface of the tire side portion. A depth of the recess of the first mark from the side profile surface is smaller than a depth of the recess of the second mark from the side profile surface.

Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.

Abstract: The present disclosure relates to an IC chip holder capable of alleviating an impact if the IC chip holder is dropped or collides with another object. In the IC chip holder, an upper housing body is provided, on a side of electric contacts of an IC chip, with an elastic deformation portion capable of elastically deforming toward the inside of the upper housing body. Thus, since the elastic deformation portion elastically deforms toward the inside of the upper housing body, if the IC chip holder is dropped or collides with another object, the elastic deformation portion bends and the impact is alleviated. Thus, a possibility of the IC chip being damaged is reduced.

Abstract: The present disclosure relates to an IC chip holder capable of alleviating an impact if the IC chip holder is dropped or collides with another object. In the IC chip holder, an upper housing body is provided, on a side of electric contacts of an IC chip, with an elastic deformation portion capable of elastically deforming toward the inside of the upper housing body. Thus, since the elastic deformation portion elastically deforms toward the inside of the upper housing body, if the IC chip holder is dropped or collides with another object, the elastic deformation portion bends and the impact is alleviated. Thus, a possibility of the IC chip being damaged is reduced.

Abstract: Because an EOP starts operating from when a decrease in discharge flow rate of an MOP is predicted or detected, a PL actual pressure that should be obtained with a PL command pressure set to a value for a required transmission torque is more easily maintained even when the discharge flow rate of the MOP becomes insufficient. After a lapse of a predetermined period of time from the start of operation of the EOP, the PL command pressure is temporarily set to a value higher than the value for the required transmission torque, and a regulator valve is controlled to operate to close a drain port. Therefore, the operation of the EOP in a high PL actual pressure is reduced, and a delay in response of a pressure regulating operation of the regulator valve in the process of reduction of the discharge flow rate of the MOP is reduced.

Abstract: A robot application is executed by executing a plurality of kinds of virtual containers in cooperation with each other. To this end, a robot application management device (100), at least one robot device (300) and at least one computer device (400) are connected to each other via a local area network (600). A group of devices including these devices are managed as a cluster for executing the robot application, and each virtual container is placed and activated in any of the group of devices composing the cluster.

Abstract: A processing system includes a detecting unit that detects an operator operation to set a recording medium onto an image processing apparatus or to move part of the image processing apparatus wherein the operator operation is an operation performed by an operator, and a controller that registers a registration processes and performs, in response to detected operator operation, a registration process among registration processes registered in advance wherein if one or more of the registration processes satisfy a predetermined condition, the controller registers the one or more of the registration processes which are changed not to perform in response to the operator operation or to perform the one or more of the registration processes after performing a particular process.

Abstract: The present invention provides an epoxy resin composition that contains an epoxy resin (A) that is a product of reaction between an epihalohydrin and either catechol, optionally with its aromatic ring methyl-substituted, or pyrogallol, optionally with its aromatic ring methyl-substituted, and an aromatic glycidylamine epoxy resin (B). This epoxy resin composition is suitable for use in fiber-reinforced composite materials, fiber-reinforced plastic articles, etc., by virtue of being liquid at room temperature, being superior in quick curing, and high mechanical properties in its cured form.

Abstract: Provided are a monofunctional phenolic compound used for producing an active ester resin capable of forming a cured product having excellent dielectric properties and excellent heat resistance, an active ester resin and a method for producing the active ester resin, and a thermosetting resin composition and a cured product of the thermosetting resin composition. Specifically, provided are a monofunctional phenolic compound including one or more vinylbenzyl groups and an active ester resin including a vinylbenzyl structure attached to a terminal group of the molecular chain and derived from the monofunctional phenolic compound. The vinylbenzyl structure preferably includes a vinylbenzyl-modified aryloxycarbonyl group.

Abstract: An information processing apparatus includes a controller that performs control so that a specific operation among operations performed on a second operation unit is invalidated in a state where an operation performed on a first operation unit is valid.

Abstract: The present invention provides an epoxy resin including a reaction product of 1,2,4-trihydroxybenzene and an epihalohydrin, the epoxy resin containing a cyclic compound that has a cyclic structure containing, as constitutional atoms, oxygen atoms at 1-position and 2-position derived from 1,2,4-trihydroxybenzene, the cyclic compound being contained in an amount of 0.003 to 0.070 mol based on 100 g of the epoxy resin. The epoxy resin is liquid and is excellent in pyrolysis resistance.

Abstract: A glass composition of the present disclosure includes, in wt %, 50?SiO2?56, 20?B2O3?30, 10?Al2O3?20, 3.5?MgO+CaO?10, and 0?R2O?1.0, further includes Fe2O3, and has a permittivity of less than 5.0 at a frequency of 1 MHz. R is at least one element selected from Li, Na, and K. The glass composition of the present disclosure is a low-permittivity glass composition with which the occurrence of fiber breakage during fiber forming can be reduced even when glass fibers to be formed have a small fiber diameter, and the occurrence of defects such as fiber breakage and fluffing during processing of the glass fibers can be reduced.