Patents by Inventor Koji Hiraoka

Koji Hiraoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131638
    Abstract: An overlay welding method includes irradiating a surface of a metal member with a laser beam while supplying a weld metal powder, and performing overlay welding on the surface of the metal member, and repeatedly performing a weld bead formation step of melting and solidifying the weld metal powder with the laser beam to form a plurality of weld beads on the surface of the metal member. Each of the plurality of weld beads has one portion in a width direction overlapping each other. In the overlay welding method, in a case of forming an adjacent weld bead, which is a weld bead adjacent to a previously formed weld bead, an energy density of the laser beam is adjusted to be higher at a portion of the adjacent weld bead overlapping the previously formed weld bead than at a portion not overlapping the previously formed weld bead.
    Type: Application
    Filed: October 15, 2023
    Publication date: April 25, 2024
    Inventors: Ryoji FUSHINO, Takuya HIRAOKA, Akito HIGASA, Koji TSUKIMOTO
  • Patent number: 11299831
    Abstract: A sewing system which includes a detector for detecting an edge of a cloth installed on an installation table, a cloth conveyor for conveying the cloth from the installation table to a sewing machine, and a controller, wherein the cloth conveyor includes a holding member that holds the cloth, and the controller includes a holding position decision portion that determines a holding position of the cloth based on detection data of the detector, and a conveyance control portion that controls the cloth conveyor such that the holding member holds the holding position. In the sewing system according to the above, it is possible to prevent deterioration in productivity of sewn products.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: April 12, 2022
    Assignee: JUKI CORPORATION
    Inventors: Koji Hiraoka, Takeshi Asami
  • Patent number: 10947663
    Abstract: A seam inspection device includes an imaging device and a processing device. The imaging device shoots a sewing object supported by a throat plate of a sewing machine and having seams formed therein. And the processing device detects an abnormality of the seam based on an image of the sewing object acquired by the imaging device.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: March 16, 2021
    Assignee: JUKI CORPORATION
    Inventors: Kimiko Fujie, Koji Hiraoka
  • Publication number: 20190376217
    Abstract: A sewing system which includes a detector for detecting an edge of a cloth installed on an installation table, a cloth conveyor for conveying the cloth from the installation table to a sewing machine, and a controller, wherein the cloth conveyor includes a holding member that holds the cloth, and the controller includes a holding position decision portion that determines a holding position of the cloth based on detection data of the detector, and a conveyance control portion that controls the cloth conveyor such that the holding member holds the holding position. In the sewing system according to the above, it is possible to prevent deterioration in productivity of sewn products.
    Type: Application
    Filed: June 5, 2019
    Publication date: December 12, 2019
    Applicant: JUKI CORPORATION
    Inventors: Koji HIRAOKA, Takeshi ASAMI
  • Publication number: 20190284750
    Abstract: A seam inspection device includes an imaging device and a processing device. The imaging device shoots a sewing object supported by a throat plate of a sewing machine and having seams formed therein. And the processing device detects an abnormality of the seam based on an image of the sewing object acquired by the imaging device.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 19, 2019
    Applicant: JUKI CORPORATION
    Inventors: Kimiko FUJIE, Koji HIRAOKA
  • Publication number: 20070235503
    Abstract: A solder alloy is provided in which generation of an oxide film of Zn—Sn based or Zn—In based solder alloy, which can be easily oxidized, can be restrained without deteriorating the mechanical characteristics, and a soldering method that causes less joining defects is provided. Soldering is performed in an inert atmosphere or reductive atmosphere, using a solder alloy containing one or more of Sn and In at a maximum of 50% by weight and containing P at 0.0005% by weight or more and less than 0.001% by weight, with the remaining part made of Zn and unavoidable impurities.
    Type: Application
    Filed: September 27, 2006
    Publication date: October 11, 2007
    Applicant: Mitsubishi Electric Corporation
    Inventors: Goro Izuta, Koji Hiraoka, Katsuaki Suganuma