Patents by Inventor Koji HOJO

Koji HOJO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component mounting apparatus and method
    Patent number: 9603262
    Abstract: An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven in a direction getting close to and from the substrate, a linear scale and a linear scale head detecting the position of the bonding tool in the direction getting close to and from the substrate, and a control unit configured to hold the position of the bonding tool in the direction getting close to and from the substrate when a solder film between an electrode of the electronic component and an electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component. The electronic component mounting apparatus for bonding the electronic component and the substrate with thermally fusible bond metal offers an improvement in the bonding quality.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: March 21, 2017
    Assignee: SHINKAWA LTD.
    Inventors: Koji Hojo, Makoto Takahashi
  • ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD
    Publication number: 20160029494
    Abstract: An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven in a direction getting close to and from the substrate, a linear scale and a linear scale head detecting the position of the bonding tool in the direction getting close to and from the substrate, and a control unit configured to hold the position of the bonding tool in the direction getting close to and from the substrate when a solder film between an electrode of the electronic component and an electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component. The electronic component mounting apparatus for bonding the electronic component and the substrate with thermally fusible bond metal offers an improvement in the bonding quality.
    Type: Application
    Filed: September 30, 2015
    Publication date: January 28, 2016
    Applicant: SHINKAWA LTD.
    Inventors: Koji HOJO, Makoto TAKAHASHI