Patents by Inventor Koji Honna

Koji Honna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating semiconductor having through hole
    Publication number: 20010028101
    Abstract: The semiconductor device includes a semiconductor chip, a tape for mounting the semiconductor chip thereto, an adhesive resin layer interposed between the semiconductor chip and the tape, and solder balls attached to the tape. The method of fabricating the semiconductor chip comprises the step of forming at least one hole in the tape, after fixing the semiconductor chip to the tape through the adhesive resin layer. Also, the TAB tape is made of polyimide having high water permeability.
    Type: Application
    Filed: April 18, 2001
    Publication date: October 11, 2001
    Applicant: FUJITSU LIMITED
    Inventors: Fumihiko Taniguchi, Koji Honna, Yoshikazu Kumagaya
  • Method of fabricating semiconductor having through hole
    Patent number: 6291895
    Abstract: The semiconductor device includes a semiconductor chip, a tape for mounting the semiconductor chip thereto, an adhesive resin layer interposed between the semiconductor chip and the tape, and solder balls attached to the tape. The method of fabricating the semiconductor chip comprises the step of forming at least one hole in the tape, after fixing the semiconductor chip to the tape through the adhesive resin layer. Also, the TAB tape is made of polyimide having high water permeability.
    Type: Grant
    Filed: June 18, 1999
    Date of Patent: September 18, 2001
    Assignee: Fujitsu Limited
    Inventors: Fumihiko Taniguchi, Koji Honna, Yoshikazu Kumagaya
  • Resin molded semiconductor device and method of manufacturing semiconductor package
    Patent number: 6166433
    Abstract: The semiconductor device includes a semiconductor chip, an FPC tape for mounting the semiconductor chip thereto, a mold resin for protecting the semiconductor chip, and metal balls provided on the FPC tape for connecting the semiconductor chip to a circuit board. The mold resin has the glass transition temperature not lower than 200.degree. C., the coefficient of linear expansion in the range from 13 to 18 ppm/.degree. C., and Young's modulus in the range from 1500 to 3000 kg/mm.sup.2, whereby warpage of the semiconductor device is mitigated. The semiconductor device can also include a buffer layer. The semiconductor device can be manufactured by collectively molding a plurality of semiconductor chips mounted to the FPC tape and by cutting the molded article into individual semiconductor packages.
    Type: Grant
    Filed: December 24, 1998
    Date of Patent: December 26, 2000
    Assignee: Fujitsu Limited
    Inventors: Akira Takashima, Hidehiko Akasaki, Haruo Kojima, Fumihiko Taniguchi, Kazunari Kosakai, Koji Honna, Toshihisa Higashiyama
  • Method of fabricating semiconductor having through hole
    Patent number: 5953592
    Abstract: The semiconductor device includes a semiconductor chip, a tape for mounting the semiconductor chip thereto, an adhesive resin layer interposed between the semiconductor chip and the tape, and solder balls attached to the tape. The method of fabricating the semiconductor chip comprises the step of forming at least one hole in the tape, after fixing the semiconductor chip to the tape through the adhesive resin layer. Also, the TAB tape is made of polyimide having high water permeability.
    Type: Grant
    Filed: July 28, 1998
    Date of Patent: September 14, 1999
    Assignee: Fujitsu Limited
    Inventors: Fumihiko Taniguchi, Koji Honna, Yoshikazu Kumagaya