Patents by Inventor Koji Hosaka

Koji Hosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11692947
    Abstract: A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: July 4, 2023
    Assignee: Fasford Technology Co., Ltd.
    Inventors: Yuta Ono, Hideharu Kobashi, Koji Hosaka, Masaaki Yoshiyama
  • Publication number: 20230102414
    Abstract: The present disclosure provides for methods, devices, and compositions for controlling factors involved in the healing of lesions. The methods, devices, and composition include a first therapeutic agent which includes an amount of MCP-1 and/or osteopontin effective to promote recruitment of macrophages to the lesion site. In additional embodiments, there is further provided a second therapeutic agent which includes an inhibitor of at least one of IL-17A, CXCL1, or IL-6 to promote polarization of an amount of the macrophages to M2 phenotype macrophages at the lesion site.
    Type: Application
    Filed: March 11, 2021
    Publication date: March 30, 2023
    Inventors: Brian Lim HOH, Christopher D. BATICH, Koji HOSAKA
  • Publication number: 20220034823
    Abstract: A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.
    Type: Application
    Filed: July 16, 2021
    Publication date: February 3, 2022
    Inventors: Yuta ONO, Hideharu KOBASHI, Koji HOSAKA, Masaaki YOSHIYAMA
  • Patent number: 10601741
    Abstract: Conventionally, high-level communication using the message cannot be achieved. The high-level communication using the message can be achieved by a message transmission device including a component candidate group storage unit capable of storing one or more component candidate groups including two or more groups of component candidates forming a content, an input reception unit configured to receive an input for constituting a content including one or more components determined by the selection of one component candidate from two or more component candidates included in one component candidate group, a content constitution unit configured to constitute the content by using the selected one or more components according to the input, and a message transmission unit configured to transmit a message including the content.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: March 24, 2020
    Assignees: THEONE UNICOM PTE. LTD., Koji Hosaka
    Inventors: Koji Hosaka, Tetsuji Otsuka, Chiyo Morisawa, Manabu Shimizu, Yosuke Magaki
  • Publication number: 20190149091
    Abstract: A vibrator group manufacturing method includes measuring resonance frequencies of first to n-th vibrators with respect to a vibrator group including the first to n-th vibrators arranged in a matrix, n being an integer of 2 or greater, and storing attachment information of the vibrator group in a storage device, the attachment information including identification information imparted to the vibrator group, pieces of first to n-th positional information indicating positions of the first to n-th vibrators, and pieces of first to n-th characteristic information based on measurement results of the resonance frequencies of the first to n-th vibrators.
    Type: Application
    Filed: November 9, 2018
    Publication date: May 16, 2019
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Koji HOSAKA, Atsushi MATSUO
  • Publication number: 20170295116
    Abstract: Conventionally, high-level communication using the message cannot be achieved. The high-level communication using the message can be achieved by a message transmission device including a component candidate group storage unit capable of storing one or more component candidate groups including two or more groups of component candidates forming a content, an input reception unit configured to receive an input for constituting a content including one or more components determined by the selection of one component candidate from two or more component candidates included in one component candidate group, a content constitution unit configured to constitute the content by using the selected one or more components according to the input, and a message transmission unit configured to transmit a message including the content.
    Type: Application
    Filed: June 21, 2017
    Publication date: October 12, 2017
    Inventors: Koji HOSAKA, Tetsuji OTSUKA, Chiyo MORISAWA, Manabu SHIMIZU, Yosuke MAGAKI
  • Patent number: 9577604
    Abstract: An electronic component includes: an oscillation circuit that is electrically connected to a resonator element; and a substrate that includes a first surface on which the oscillation circuit and wiring that is electrically connected with the resonator element and the oscillation circuit to form an oscillation loop are disposed, and a second surface opposite to the first surface. The substrate includes a conductor layer between the first surface and the second surface. The conductor layer overlaps the wiring in a plan view. A distance between the wiring and the conductor layer in a thickness direction as a direction along a direction intersecting the first surface and the second surface is from 0.35 mm to 0.7 mm.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: February 21, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Yuichi Takebayashi, Koji Hosaka, Yoshiyuki Yamaguchi
  • Publication number: 20160254798
    Abstract: An electronic component includes: an oscillation circuit that is electrically connected to a resonator element; and a substrate that includes a first surface on which the oscillation circuit and wiring that is electrically connected with the resonator element and the oscillation circuit to form an oscillation loop are disposed, and a second surface opposite to the first surface. The substrate includes a conductor layer between the first surface and the second surface. The conductor layer overlaps the wiring in a plan view. A distance between the wiring and the conductor layer in a thickness direction as a direction along a direction intersecting the first surface and the second surface is from 0.35 mm to 0.7 mm.
    Type: Application
    Filed: May 10, 2016
    Publication date: September 1, 2016
    Inventors: Yuichi TAKEBAYASHI, Koji HOSAKA, Yoshiyuki YAMAGUCHI
  • Patent number: 9362886
    Abstract: An electronic component includes: an oscillation circuit that is electrically connected to a resonator element; and a substrate that includes a first surface on which the oscillation circuit and wiring that is electrically connected with the resonator element and the oscillation circuit to form an oscillation loop are disposed, and a second surface opposite to the first surface. The substrate includes a conductor layer between the first surface and the second surface. The conductor layer overlaps the wiring in a plan view. A distance between the wiring and the conductor layer in a thickness direction as a direction along a direction intersecting the first surface and the second surface is from 0.35 mm to 0.7 mm.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: June 7, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Yuichi Takebayashi, Koji Hosaka, Yoshiyuki Yamaguchi
  • Publication number: 20160065170
    Abstract: An electronic component includes: an oscillation circuit that is electrically connected to a resonator element; and a substrate that includes a first surface on which the oscillation circuit and wiring that is electrically connected with the resonator element and the oscillation circuit to form an oscillation loop are disposed, and a second surface opposite to the first surface. The substrate includes a conductor layer between the first surface and the second surface. The conductor layer overlaps the wiring in a plan view. A distance between the wiring and the conductor layer in a thickness direction as a direction along a direction intersecting the first surface and the second surface is from 0.35 mm to 0.7 mm.
    Type: Application
    Filed: September 1, 2015
    Publication date: March 3, 2016
    Inventors: Yuichi TAKEBAYASHI, Koji HOSAKA, Yoshiyuki YAMAGUCHI
  • Patent number: 8384405
    Abstract: A method of the invention for performing burn-in test includes assembling, on a fixture stand, a plurality of light source elements and a plurality of light detectors for monitoring a light output from a corresponding one of the plurality of light source elements; and electrifying the plurality of light source elements in a state where at least the plurality of light source elements and the plurality of light detectors are immersed in an insulation liquid. Thereby, it is realized to hold a stable temperature in a short period of time, to maintain a temperature that does not deviate from normal load conditions, and to perform a sorting test between defect parts and good part for light source unit chips without causing damage to the elements.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: February 26, 2013
    Assignee: TDK Corporation
    Inventors: Koji Shimazawa, Ryo Hosoi, Yasuhiro Ito, Masaaki Kaneko, Takashi Honda, Ryuji Fujii, Koji Hosaka
  • Publication number: 20130014904
    Abstract: A biaxial drive mechanism including a Z axis capable of realizing a high speed elevation axis without an increment in torque on a horizontal drive axes and a die bonder using the biaxial drive mechanism is disclosed. The biaxial drive mechanism includes a handling part; a first linear motor having a first movable part that moves up/down the handling part and a first stationary part; a second linear motor having a second movable part and a second stationary part; a connecting part that directly or indirectly connects the first movable part to the second movable part via the first linear guide; a second linear guide that moves the first movable part; and a support body that fixes the first stationary part and the second stationary part with a predetermined length in parallel to each other in the horizontal direction.
    Type: Application
    Filed: September 6, 2011
    Publication date: January 17, 2013
    Applicant: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Koji HOSAKA, Shingo Fukasawa
  • Publication number: 20130014881
    Abstract: A highly reliable biaxial drive mechanism and a die bonder operating method capable of preventing fall of an elevation axis of a linear motor upon loss of power are disclosed. The biaxial drive mechanism includes a handling part; a biaxial drive axes provided with a first linear motor unit having a first movable part that moves up and down the handling part along a first linear guide and a first stationary part, and a second linear motor unit having a second movable part that moves the handling part in a horizontal direction vertical to a direction of up and down movement and a second stationary part; a main power source that supplies a power source to the biaxial drive axes; and an elevation axis fall prevention unit that prevents fall of a handling part upon loss of power at the main power source.
    Type: Application
    Filed: September 6, 2011
    Publication date: January 17, 2013
    Applicant: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Shingo FUKASAWA, Koji Hosaka
  • Publication number: 20120269047
    Abstract: A method of the invention for performing burn-in test includes assembling, on a fixture stand, a plurality of light source elements and a plurality of light detectors for monitoring a light output from a corresponding one of the plurality of light source elements; and electrifying the plurality of light source elements in a state where at least the plurality of light source elements and the plurality of light detectors are immersed in an insulation liquid. Thereby, it is realized to hold a stable temperature in a short period of time, to maintain a temperature that does not deviate from normal load conditions, and to perform a sorting test between defect parts and good part for light source unit chips without causing damage to the elements.
    Type: Application
    Filed: April 20, 2011
    Publication date: October 25, 2012
    Applicant: TDK CORPORATION
    Inventors: Koji Shimazawa, Ryo Hosoi, Yasuhiro Ito, Masaaki Kaneko, Takashi Honda, Ryuji Fujii, Koji Hosaka
  • Patent number: 7768281
    Abstract: A probe assembly used to lap a bar, the bar being provided with elements that are to be formed into sliders, is provided. The probe assembly comprises an elastically deflectable probe, and a stopper for applying bending deformation to the probe so as to cause first bending deflection at a leading end of the probe and for maintaining the first bending deflection of the leading end while preventing a bending deformation at the leading end from becoming smaller than the first bending deflection. The leading end of the probe is adapted to be subjected to second bending deflection that is larger than the first bending deflection in a same direction as a direction of the first bending deflection and thereby to abut against an electrode pad to establish electrical connection between the probe and the electrode pad, the electrode pad being provided on a surface of the bar other than a surface to be lapped.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: August 3, 2010
    Assignee: SAE Magnetics (H. K.) Ltd.
    Inventors: Ryuji Fujii, Takashi Honda, Hiroyasu Tsuchiya, Koji Hosaka
  • Patent number: 7539174
    Abstract: The present invention relates to a mobile communication system in which data is transmitted and received through a wireless transmission line between a mobile station device and a network-side device. A receiving-side device includes a retransmission request transmitter configured to transmit, to a transmitting-side device, a retransmission request for requesting retransmission processing on each data unit of the data, when a reception error is detected in the data unit. The transmitting-side device includes a retransmission time storage configured to store a retransmission time at which the retransmission processing is performed on the data unit; and a retransmission controller configured to control so as not to perform the retransmission processing on the data unit related to a received retransmission request, when the retransmission time of the data unit is stored and a difference between the retransmission time and a current time is shorter than a retransmission prohibition period.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: May 26, 2009
    Assignee: NTT DoCoMo, Inc.
    Inventors: Koji Hosaka, Yasuhiro Kato, Yoshifumi Morihiro, Kiyotatsu Suto, Masashi Watanabe
  • Patent number: 7435163
    Abstract: The present invention provides a grinding sheet wherein the width of the ridge in the pattern of abrasive layer is larger than the width of the recess formed between the adjacent portions of the ridge. Its shape is suitable to carry out uniform treatment without causing the workpiece to drop into the recess between ridge portions of the pattern of abrasive layer even when the workpiece is swung while the grinding sheet is rotated during grinding operation.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: October 14, 2008
    Assignees: TMP Co., Ltd., SAE Magnetics (H.K.) Ltd., SAE Technologies (H.K.) Ltd.
    Inventors: Hideaki Natsui, Makoto Saito, Kazuya Orii, Ryuji Fujii, Koji Hosaka
  • Publication number: 20080223155
    Abstract: A probe assembly used to lap a bar, the bar being provided with elements that are to be formed into sliders, is provided. The probe assembly comprises an elastically deflectable probe, and a stopper for applying bending deformation to the probe so as to cause first bending deflection at a leading end of the probe and for maintaining the first bending deflection of the leading end while preventing a bending deformation at the leading end from becoming smaller than the first bending deflection. The leading end of the probe is adapted to be subjected to second bending deflection that is larger than the first bending deflection in a same direction as a direction of the first bending deflection and thereby to abut against an electrode pad to establish electrical connection between the probe and the electrode pad, the electrode pad being provided on a surface of the bar other than a surface to be lapped.
    Type: Application
    Filed: February 29, 2008
    Publication date: September 18, 2008
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Ryuji Fujii, Takashi Honda, Hiroyasu Tsuchiya, Koji Hosaka
  • Publication number: 20070232200
    Abstract: The present invention provides a grinding sheet wherein the width of the ridge in the pattern of abrasive layer is larger than the width of the recess formed between the adjacent portions of the ridge. Its shape is suitable to carry out uniform treatment without causing the workpiece to drop into the recess between ridge portions of the pattern of abrasive layer even when the workpiece is swung while the grinding sheet is rotated during grinding operation.
    Type: Application
    Filed: February 20, 2007
    Publication date: October 4, 2007
    Inventors: Hideaki Natsui, Makoto Saito, Kazuya Orii, Ryuji Fujii, Koji Hosaka
  • Patent number: 7153198
    Abstract: A fixture for slider lapping includes a holding portion for holding the object with its surface to be lapped toward the lapping surface of the lapping device; a main body for mounting the lapping fixture to the lapping device; a plurality of load-applied portions which are arranged along said longitudinal direction and independent from said main body, said load-applied portions receiving a load which presses the surface to be lapped to the lapping surface tightly from at least the lapping device; a plurality of connection members connecting said holding portion and said main body along said longitudinal direction at intervals; and a plurality of wrist portions connecting said connection members and said holding portion; wherein at least one wrist portion is disposed between said adjacent connection members; at least one wrist portion is disposed at each outer side of the connection members which are located at both ends of the longitudinal direction.
    Type: Grant
    Filed: October 18, 2005
    Date of Patent: December 26, 2006
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ryuji Fujii, Koji Hosaka, GuoWei Li, XiaoMing Hong, XiangBin Xiao