Abstract: A high frequency heating apparatus (1A) includes the following components: a first electrode (11) that is flat; a plurality of flat second electrodes (12) that are flat; a high-frequency power supply (20); a matching unit (30); a controller (40); and an electric field regulator (50). The second electrodes (12) are placed opposite to the first electrode (11). The high-frequency power supply (20) applies a high-frequency voltage to the first electrode (11). The matching unit (30) is placed between the first electrode (11) and the high-frequency power supply (20), and is impedance-matched with the high-frequency power supply (20). The controller (40) controls the high-frequency power supply (20). The electric field regulator (50) individually adjusts the electric field strengths in a plurality of regions located between first electrode (11) and the second electrodes (12). This aspect can reduce uneven heating.

Abstract: An image reading apparatus includes a scanner, an operation panel, a communication interface, and a processor. The scanner is configured to read an image of a document. The operation panel is configured to designate a transmission destination of scan data, the scan data including image data of the document read by the scanner. The communication interface is configured to transmit the scan data to the transmission destination designated on the operation panel. The processor is configured to transmit the scan data to the transmission destination without a password in response to the transmission destination designated on the operation panel being a transmission destination of an operator who operates the operation panel, and transmit the scan data protected with a password to the transmission destination in response to the transmission destination designated on the operation panel including a transmission destination of any person other than the operator.

Abstract: An image reading apparatus includes a scanner, an operation panel, a communication interface, and a processor. The scanner is configured to read an image of a document. The operation panel is configured to designate a transmission destination of scan data, the scan data including image data of the document read by the scanner. The communication interface is configured to transmit the scan data to the transmission destination designated on the operation panel. The processor is configured to transmit the scan data to the transmission destination without a password in response to the transmission destination designated on the operation panel being a transmission destination of an operator who operates the operation panel, and transmit the scan data protected with a password to the transmission destination in response to the transmission destination designated on the operation panel including a transmission destination of any person other than the operator.

Abstract: A semiconductor chip 10 flip-chip mounted on a first surface 32 of a wiring substrate 30, a semiconductor chip 20 flip-chip mounted on a second surface 33 of the wiring substrate 30, a sealing resin 71 covering the semiconductor chip 10, a sealing resin 72 covering the semiconductor chip 20, a plurality of conductive posts provided to penetrate through the sealing resin 72, and a plurality of solder balls mounted on second ends of the plurality of conductive posts exposed from the sealing resin 72 are provided; and the mounting directions of the semiconductor chips 10 and 20 are mutually different by 90°. Both of the planar shapes of the semiconductor chips 10 and 20 are rectangular shapes, the semiconductor chip 10 is mounted so that the long sides thereof are parallel to the long sides of the wiring substrate 30, and the semiconductor chip 20 is mounted so that the long sides thereof are perpendicular to the long sides of the wiring substrate 30.

Abstract: According to one embodiment, an image forming apparatus includes a sensor, an auxiliary storage device, and an operation control unit. The sensor detects disturbance. The auxiliary storage device is provided with a storage medium, and a head which performs operations of reading and writing of data with respect to the storage medium. The operation control unit does not perform a data writing operation with respect to the storage medium until a predetermined condition related to the disturbance is satisfied, and performs the data writing operation with respect to the storage medium by controlling the head, when a predetermined condition related to the disturbance is satisfied while the disturbance is detected by the sensor.

Abstract: A semiconductor chip 10 flip-chip mounted on a first surface 32 of a wiring substrate 30, a semiconductor chip 20 flip-chip mounted on a second surface 33 of the wiring substrate 30, a sealing resin 71 covering the semiconductor chip 10, a sealing resin 72 covering the semiconductor chip 20, a plurality of conductive posts provided to penetrate through the sealing resin 72, and a plurality of solder balls mounted on second ends of the plurality of conductive posts exposed from the sealing resin 72 are provided; and the mounting directions of the semiconductor chips 10 and 20 are mutually different by 90°. Both of the planar shapes of the semiconductor chips 10 and 20 are rectangular shapes, the semiconductor chip 10 is mounted so that the long sides thereof are parallel to the long sides of the wiring substrate 30, and the semiconductor chip 20 is mounted so that the long sides thereof are perpendicular to the long sides of the wiring substrate 30.

Abstract: A semiconductor chip 10 flip-chip mounted on a first surface 32 of a wiring substrate 30, a semiconductor chip 20 flip-chip mounted on a second surface 33 of the wiring substrate 30, a sealing resin 71 covering the semiconductor chip 10, a sealing resin 72 covering the semiconductor chip 20, a plurality of conductive posts provided to penetrate through the sealing resin 72, and a plurality of solder balls mounted on second ends of the plurality of conductive posts exposed from the sealing resin 72 are provided; and the mounting directions of the semiconductor chips 10 and 20 are mutually different by 90°. Both of the planar shapes of the semiconductor chips 10 and 20 are rectangular shapes, the semiconductor chip 10 is mounted so that the long sides thereof are parallel to the long sides of the wiring substrate 30, and the semiconductor chip 20 is mounted so that the long sides thereof are perpendicular to the long sides of the wiring substrate 30.

Abstract: According to the present invention, a semiconductor device includes a substrate including a first surface and a second surface opposite to the first surface, a first layer formed over the first surface, a second layer thicker than the first layer formed over the first portion of the first layer, the first and second layers being formed of a same material, a first semiconductor chip mounted over a second portion of the first layer; and a second semiconductor chip commonly mounted over the first semiconductor chip and the second layer.

Abstract: The invention provides a grease composition for use in an image forming apparatus, containing a thickener, a base oil and a lubricity improver, wherein the thickener is a lithium soap, the base oil is a synthetic hydrocarbon oil, the lubricity improver is a polyethylene oxide wax, and the image forming apparatus is equipped with a sliding member and a member for holding the sliding member which is driven to slide through the holding member via the grease composition, one of the sliding member or the holding member for the sliding member having a sliding surface formed from a metal, and the other having a sliding surface formed from a resin.

Abstract: A semiconductor chip 10 flip-chip mounted on a first surface 32 of a wiring substrate 30, a semiconductor chip 20 flip-chip mounted on a second surface 33 of the wiring substrate 30, a sealing resin 71 covering the semiconductor chip 10, a sealing resin 72 covering the semiconductor chip 20, a plurality of conductive posts provided to penetrate through the sealing resin 72, and a plurality of solder balls mounted on second ends of the plurality of conductive posts exposed from the sealing resin 72 are provided; and the mounting directions of the semiconductor chips 10 and 20 are mutually different by 90°. Both of the planar shapes of the semiconductor chips 10 and 20 are rectangular shapes, the semiconductor chip 10 is mounted so that the long sides thereof are parallel to the long sides of the wiring substrate 30, and the semiconductor chip 20 is mounted so that the long sides thereof are perpendicular to the long sides of the wiring substrate 30.

Abstract: A semiconductor chip 10 flip-chip mounted on a first surface 32 of a wiring substrate 30, a semiconductor chip 20 flip-chip mounted on a second surface 33 of the wiring substrate 30, a sealing resin 71 covering the semiconductor chip 10, a sealing resin 72 covering the semiconductor chip 20, a plurality of conductive posts provided to penetrate through the sealing resin 72, and a plurality of solder balls mounted on second ends of the plurality of conductive posts exposed from the sealing resin 72 are provided; and the mounting directions of the semiconductor chips 10 and 20 are mutually different by 90°. Both of the planar shapes of the semiconductor chips 10 and 20 are rectangular shapes, the semiconductor chip 10 is mounted so that the long sides thereof are parallel to the long sides of the wiring substrate 30, and the semiconductor chip 20 is mounted so that the long sides thereof are perpendicular to the long sides of the wiring substrate 30.

Abstract: [Problem] To provide a semiconductor device suitable for use as an upper-side package of a semiconductor device having a PoP structure. [Solution] This invention is provided with a semiconductor chip (10) flip-chip mounted on one surface (32) of a wiring board (30), and a semiconductor chip (20) flip-chip mounted on the other surface (33) of the wiring board (30), the semiconductor chips (10, 20) being installed in directions that differ by 90°. It is thereby possible to prevent the layout of wiring patterns (41, 42) on the wiring board (30) from becoming locally congested and enhance the freedom of layout. In addition, when the semiconductor chips (10, 20) are mounted on the wiring board (30), the location at which the load concentrates can be held by a stage, thereby making it possible to prevent the wiring board from deforming.

Abstract: According to the present invention, a semiconductor device includes a substrate including a first surface and a second surface opposite to the first surface, a first layer formed over the first surface, a second layer thicker than the first layer formed over the first portion of the first layer, the first and second layers being formed of a same material, a first semiconductor chip mounted over a second portion of the first layer; and a second semiconductor chip commonly mounted over the first semiconductor chip and the second layer.

Abstract: A semiconductor chip 10 flip-chip mounted on a first surface 32 of a wiring substrate 30, a semiconductor chip 20 flip-chip mounted on a second surface 33 of the wiring substrate 30, a sealing resin 71 covering the semiconductor chip 10, a sealing resin 72 covering the semiconductor chip 20, a plurality of conductive posts provided to penetrate through the sealing resin 72, and a plurality of solder balls mounted on second ends of the plurality of conductive posts exposed from the sealing resin 72 are provided; and the mounting directions of the semiconductor chips 10 and 20 are mutually different by 90°. Both of the planar shapes of the semiconductor chips 10 and 20 are rectangular shapes, the semiconductor chip 10 is mounted so that the long sides thereof are parallel to the long sides of the wiring substrate 30, and the semiconductor chip 20 is mounted so that the long sides thereof are perpendicular to the long sides of the wiring substrate 30.

Abstract: The invention provides a grease composition for use in an image forming apparatus, containing a thickener, a base oil and a lubricity improver, wherein the thickener is a lithium soap, the base oil is a synthetic hydrocarbon oil, the lubricity improver is a polyethylene oxide wax, and the image forming apparatus is equipped with a sliding member and a member for holding the sliding member which is driven to slide through the holding member via the grease composition, one of the sliding member or the holding member for the sliding member having a sliding surface formed from a metal, and the other having a sliding surface formed from a resin.

Abstract: A device includes a wiring board, an element mounted on the wiring board, a spacer member intervening between the wiring board and the element to form a space therebetween, and an encapsulation body filling the space and encapsulating the element on the wiring board.

Abstract: A semiconductor device includes a wiring board, a semiconductor chip mounted over a surface of the wiring board, a sealing resin provided over the surface of the wiring board to cover the semiconductor chip, and a low-elasticity resin provided between the wiring board and the sealing resin. The low-elasticity resin is arranged outside of an area on which the semiconductor chip is mounted. The low-elasticity resin has an elastic modulus lower than an elastic modulus of the sealing resin.

Abstract: A BGA semiconductor device includes a semiconductor package and a mounting board mounting thereon the semiconductor package, wherein an array of signal electrodes of the semiconductor package and an array of signal electrodes of the mounting board are coupled together via signal bumps. The BGA semiconductor device also includes a dummy bump, which reinforces the bending strength of the BGA semiconductor device and is broken by a shearing force caused by thermal expansion to alleviate the stress for the signal bumps.

Abstract: A BGA semiconductor device includes a semiconductor package and a mounting board mounting thereon the semiconductor package, wherein an array of signal electrodes of the semiconductor package and an array of signal electrodes of the mounting board are coupled together via signal bumps. The BGA semiconductor device also includes a dummy bump, which reinforces the bending strength of the BGA semiconductor device and is broken by a shearing force caused by thermal expansion to alleviate the stress for the signal bumps.

Abstract: A device includes a wiring board, an element mounted on the wiring board, a spacer member intervening between the wiring board and the element to form a space therebetween, and an encapsulation body filling the space and encapsulating the element on the wiring board.