Patents by Inventor Koji KAMADA
Koji KAMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240099038Abstract: A display apparatus having a photoelectric conversion function with high sensitivity is provided. The light extraction efficiency of the display apparatus is increased. The display apparatus includes a light-emitting device, a light-emitting and light-receiving device, a first lens, and a second lens. The light-emitting device has a function of emitting light of a first color. The light-emitting and light-receiving device has a function of emitting light of a second color and a function of receiving light of the first color and converting it into an electric signal. The light emitted by the light-emitting device is emitted to the outside of the display apparatus through the first lens. Light enters the light-emitting and light-receiving device from the outside of the display apparatus through the second lens.Type: ApplicationFiled: October 5, 2020Publication date: March 21, 2024Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventors: Daisuke Kubota, Taisuke KAMADA, Ryo HATSUMI, Koji KUSUNOKI, Kazunori WATANABE, Susumu KAWASHIMA
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Publication number: 20230378651Abstract: An antenna element includes a body including laminated insulator layers, a first ground conductor, and a radiation conductor overlapping the first ground conductor along a first direction from the first ground conductor. Guard ground conductors are provided in the body along the first direction to surround the radiation conductor. The guard ground conductors include second ground conductors electrically interconnected, and one or more first interlayer connection conductors piercing the insulator layers. The second ground conductors are shaped to not make a circuit of the radiation conductor, and are positioned at multiple positions relative to up-down directions.Type: ApplicationFiled: August 3, 2023Publication date: November 23, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Hirotaka FUJII, Koji KAMADA, Daisuke DOI
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Publication number: 20220416425Abstract: An element assembly has a structure in which insulator layers including first and second insulator layers are laminated in an up-down direction. The first insulator layer is above the second insulator layer. A radiant conductor layer is on an upper surface of the first insulator layer. A first capacitance defining portion includes a first interlayer connection conductor passing through one or more of the insulator layers in the up-down direction. The first interlayer connection conductor is electrically connected to the radiant conductor layer. The radiant conductor layer, a ground conductor, and the first capacitance defining portion define and function as a patch antenna. When the first interlayer connection conductor is electrically connected to the radiant conductor layer, a distance from a lower end of the first interlayer connection conductor to the ground conductor in the up-down direction is shorter than a distance from the radiant conductor layer to the ground conductor in the up-down direction.Type: ApplicationFiled: September 1, 2022Publication date: December 29, 2022Inventors: Koji KAMADA, Kunihiro KOMAKI, Masahiro IZAWA, Ryo KOMURA
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Publication number: 20220285082Abstract: A multilayer board includes a first insulator layer including a first coil pattern thereon, a second insulator layer including a second coil pattern thereon, a third insulator layer including a third coil pattern thereon, a first terminal on the first insulator layer and connected to one end of the first coil pattern, a first floating pattern on the first insulator layer and not connected to the first coil pattern, and a second terminal on the third insulator layer and connected to one end of the third coil pattern. The first, second, and third insulator layers are sequentially laminated. The first, second, and third coil patterns are respectively electrically connected in sequence. The first floating pattern overlaps the second coil pattern when viewed from a laminating direction.Type: ApplicationFiled: May 23, 2022Publication date: September 8, 2022Inventors: Kiminori KOUNO, Koji KAMADA
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Patent number: 11166386Abstract: An interposer substrate includes a dielectric portion, a magnetic portion, and a first principal surface and a second principal surface opposite to each other. Connection terminal electrodes are each provided on a corresponding one of first principal surfaces of the dielectric portion and the magnetic portion, and are connected to a cable. Circuit-board terminal electrodes are provided on a second principal surface of the dielectric portion and connected to a circuit board. Wiring electrodes are provided inside a base body, and connecting the connection terminal electrodes to the circuit-board terminal electrodes in a predetermined connection pattern. The wiring electrodes include a first wiring electrode passing through only the dielectric portion, and a second wiring electrode passing through the magnetic portion.Type: GrantFiled: July 26, 2019Date of Patent: November 2, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Keito Yonemori, Hirokazu Yazaki, Takanori Tsuchiya, Koji Kamada
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Patent number: 11032904Abstract: An interposer substrate includes a body, first to third external connection conductors, and a wiring conductor. The body includes first to third principal surfaces. A distance between the first and second principal surfaces is different from a distance between the first and third principal surfaces. The first external connection conductor is provided on the first principal surface and is connected to an external circuit board. The second external connection conductor is provided on the second principal surface and is connected to a first flat cable. The third external connection conductor is provided on the third principal surface and is connected to a second flat cable. The wiring conductor is provided in the body, and connects the first external connection conductor and second and third external connection conductors.Type: GrantFiled: June 12, 2019Date of Patent: June 8, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hirokazu Yazaki, Keito Yonemori, Takanori Tsuchiya, Koji Kamada, Takashi Noma
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Publication number: 20190363031Abstract: A module component includes a substrate, components mounted to one principal surface of the substrate, a nonmagnetic member covering at least a portion of one or more electrodes different from a ground electrode in each of the mounted components, and a magnetic member covering the one principal surface of the substrate, the mounted components, and the nonmagnetic member.Type: ApplicationFiled: August 7, 2019Publication date: November 28, 2019Inventor: Koji KAMADA
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Publication number: 20190350090Abstract: An interposer substrate includes a dielectric portion, a magnetic portion, and a first principal surface and a second principal surface opposite to each other. Connection terminal electrodes are each provided on a corresponding one of first principal surfaces of the dielectric portion and the magnetic portion, and are connected to a cable. Circuit-board terminal electrodes are provided on a second principal surface of the dielectric portion and connected to a circuit board. Wiring electrodes are provided inside a base body, and connecting the connection terminal electrodes to the circuit-board terminal electrodes in a predetermined connection pattern. The wiring electrodes include a first wiring electrode passing through only the dielectric portion, and a second wiring electrode passing through the magnetic portion.Type: ApplicationFiled: July 26, 2019Publication date: November 14, 2019Inventors: Keito YONEMORI, Hirokazu YAZAKI, Takanori TSUCHIYA, Koji KAMADA
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Publication number: 20190297726Abstract: An interposer substrate includes a body, first to third external connection conductors, and a wiring conductor. The body includes first to third principal surfaces. A distance between the first and second principal surfaces is different from a distance between the first and third principal surfaces. The first external connection conductor is provided on the first principal surface and is connected to an external circuit board. The second external connection conductor is provided on the second principal surface and is connected to a first flat cable. The third external connection conductor is provided on the third principal surface and is connected to a second flat cable. The wiring conductor is provided in the body, and connects the first external connection conductor and second and third external connection conductors.Type: ApplicationFiled: June 12, 2019Publication date: September 26, 2019Inventors: Hirokazu YAZAKI, Keito YONEMORI, Takanori TSUCHIYA, Koji KAMADA, Takashi NOMA