Abstract: Fastening parts suitable for recycling are disclosed. The fastening parts include a plastic main body with at least two engaging projections, and metal inserts having interior screw threads contained integrally inside the plastic main body. Designing electronic equipment using such fastening parts enable easy parts separation from the plastic main body at disassembly, and facilitate recycling of both fastening parts and the plastic main body.

Abstract: A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

Abstract: A method of cooling a device with a cooling unit, using a metal sherbet, which is metal being in a state of a two-phase composition consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the heat generating device for transferring heat generated in the device to the cooling unit. The metal sherbet is metal, such as an In-Ga binary system, in which solids of an In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the device and the cooling unit.

Abstract: A method of cooling a semiconductor device with a cooling unit, using a metal sherbet, which is metal being in a state of a mixed phase consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the semiconductor device for transferring heat generated in the semiconductor device to the cooling unit. The metal sherbet is metal, such as In-Ga binary system, in which solids of In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the semiconductor device and the cooling unit.

Abstract: A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

Abstract: A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

Abstract: A cooling system for electronic circuit components mounted on a printed circuit board, includes a cooling plate having a coolant passage, thermal contacts arranged on the cooling plate to be in resilient contact with the surfaces of the electronic components, which are cooled via the thermal contacts by liquid coolant flowing through the coolant passage. The cooling plate has one or more shortcut passages, the cross-sectional area of which is smaller than that of the coolant passage, to mutually connect predetermined portions of the coolant passage. The liquid coolant can be discharged from the cooling plate via the shortcut passage.