Abstract: An electric machine system includes an electric machine, an electric power converter, and a control unit. The electric machine includes a stator that includes coils, and a rotator that includes a magnet and is rotatable with respect to the stator. The electric power converter inputs electric power with respect to the coils of the electric machine. The control unit controls the electric power converter. The control unit includes an output unit and a correction unit. The output unit outputs a control signal for operating the electric power converter to the electric power converter. The correction unit corrects a phase of the control signal that determines input timing of the electric power with respect to the coils of the electric machine. The correction unit corrects the phase so that the magnitude of the electric power approaches an extreme value.

Abstract: A composition for aqueous ink jet contains a specific dye which is one or more coloring materials selected from the group consisting of C. I. Acid Black 172 and C. I. Acid Black 194, and a specific aromatic compound which is at least one compound selected from the group consisting of compounds represented by formulae (1) to (4) below. The content of the specific aromatic compound relative to 100 parts by mass of the specific dye is 0.2 parts by mass or more and 50 parts by mass or less.

Abstract: In order to achieve a charging service using an outlet of 100 V or 200V, the present invention provides a management server 10 including an acquisition unit 11 that acquires, from a user terminal, apparatus specifying information specifying a control apparatus that controls power supply to an outlet, and a control execution unit 12 that executes processing of controlling the control apparatus specified by the apparatus specifying information.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A cooling apparatus for a fired body includes a transporting member for transporting a firing jig in which a ceramic fired body is housed; a plurality of blowers for cooling the ceramic fired body; and a suction mechanism for changing the atmosphere inside the firing jig from an inert gas atmosphere to an air atmosphere.