Abstract: A die cushion control device for controlling a die cushion mechanism includes: a pressure command generation unit that outputs a first pressure command on pressure or force to be generated between the die cushion mechanism and a slide; a deviation prediction unit that predicts a pressure deviation that is the difference between the pressure or the force in the first pressure command and a detected pressure caused when the die cushion mechanism is controlled according to the first pressure command, and outputs the predicted pressure deviation as a correction pressure command; a pressure command correction unit that corrects the first pressure command with the correction pressure command to calculate a second pressure command; and a pressure control unit that calculates a speed command to cause the detected pressure to follow the second pressure command, and outputs the speed command to a speed control unit.

Abstract: A servo control device includes a follow-up control unit that controls a control target that drives a mechanical system by a motor, a command function unit that has input therein a phase signal ? indicating a phase of a cyclic operation performed by the control target, and that calculates a machine motion command according to the phase signal ? by a preset first function, a second derivative unit that uses a second function obtained by second-order differentiating the first function with respect to the phase signal to calculate a value of the second function according to the phase signal as a second-order differential base signal, a correction-value computation unit that computes a first command correction value for correcting the motor motion command by using a product of a square value of the phase velocity, the second-order differential base signal, and a first constant, and a correction-value addition unit that calculates the motor motion command based on an added value of the first command correction val

Abstract: A position alignment of a transfer point of a transfer arm is performed by using a position detecting method. The method includes: detecting electrostatic capacitances in relation with a reference object for position alignment by a plurality of electrostatic capacitance detecting electrodes provided on a surface of the substrate body; communicating with each electrostatic capacitance detecting electrode and controlling a detection of each electrostatic capacitance detecting electrode; and calculating coordinates (x, y) of the reference object with respect to the substrate body based on a preset relationship between electrostatic capacitance values of multiple electrostatic capacitance detecting electrodes and a position of the reference object with respect to the substrate body.

Abstract: A servo control device includes a follow-up control unit that controls a control target that drives a mechanical system by a motor, a command function unit that has input therein a phase signal ? indicating a phase of a cyclic operation performed by the control target, and that calculates a machine motion command according to the phase signal ? by a preset first function, a second derivative unit that uses a second function obtained by second-order differentiating the first function with respect to the phase signal to calculate a value of the second function according to the phase signal as a second-order differential base signal, a correction-value computation unit that computes a first command correction value for correcting the motor motion command by using a product of a square value of the phase velocity, the second-order differential base signal, and a first constant, and a correction-value addition unit that calculates the motor motion command based on an added value of the first command correction val

Abstract: A position alignment of a transfer point of a transfer arm is performed by using a position detecting method. The method includes: detecting electrostatic capacitances in relation with a reference object for position alignment by a plurality of electrostatic capacitance detecting electrodes provided on a surface of the substrate body; communicating with each electrostatic capacitance detecting electrode and controlling a detection of each electrostatic capacitance detecting electrode; and calculating coordinates (x, y) of the reference object with respect to the substrate body based on a preset relationship between electrostatic capacitance values of multiple electrostatic capacitance detecting electrodes and a position of the reference object with respect to the substrate body.

Abstract: A position alignment of a transfer point of a transfer arm is performed by using a position detecting wafer capable of being loaded into an apparatus having a thin transfer port. The position detecting wafer S includes an electrostatic capacitance detecting sensor 50 for detecting an electrostatic capacitance in relation with a reference object for the position alignment. The electrostatic capacitance detecting sensor 50 includes a plurality of electrostatic capacitance detecting electrodes 52, each forming the electrostatic capacitance in relation with the reference object; and a control circuit 51 for controlling a detection of the electrostatic capacitance by each electrostatic capacitance detecting electrode 52, while communicating with each electrostatic capacitance detecting electrode 52. The electrostatic capacitance detecting electrodes 52 are provided on a rear surface of the position detecting wafer S, and the control circuit 51 is provided on a front surface of the position detecting wafer S.

Abstract: A transfer point of a transfer arm is detected accurately and stably by using a position detecting wafer having an electrostatic capacitance sensor. A position detecting wafer S is formed in a wafer shape transferable by a transfer arm 20 and includes an electrostatic capacitance sensor 50 for detecting a relative position with respect to a reference object by detecting an electrostatic capacitance in relation with the reference object for a position detection. The electrostatic capacitance sensor 50 includes a detection electrode 52 for forming the electrostatic capacitance in relation with the reference object, and the detection electrode 52 is installed on a rear surface of a main body of the wafer shape. Installed on the main body is a guard electrode 100 covering the detecting electrode 52 when viewed from a front surface thereof, for blocking an electric field oriented toward the detection electrode 52 from the front surface.

Abstract: In the present invention, a position detecting substrate having a capacitive sensor is supported on a transfer arm and transferred by the transfer arm and mounted on a mounting part. The capacitive sensor on the position detecting substrate then detects a position of a target object on the mounting part to detect a mounting position of the position detecting substrate on the mounting part. Based on the mounting position of the position detecting substrate, the moving position of the transfer arm when transferring a substrate is then adjusted.

Abstract: A transfer point of a transfer arm is detected accurately and stably by using a position detecting wafer having an electrostatic capacitance sensor. A position detecting wafer S is formed in a wafer shape transferable by a transfer arm 20 and includes an electrostatic capacitance sensor 50 for detecting a relative position with respect to a reference object by detecting an electrostatic capacitance in relation with the reference object for a position detection. The electrostatic capacitance sensor 50 includes a detection electrode 52 for forming the electrostatic capacitance in relation with the reference object, and the detection electrode 52 is installed on a rear surface of a main body of the wafer shape. Installed on the main body is a guard electrode 100 covering the detecting electrode 52 when viewed from a front surface thereof, for blocking an electric field oriented toward the detection electrode 52 from the front surface.

Abstract: In the present invention, a position detecting substrate having a capacitive sensor is supported on a transfer arm and transferred by the transfer arm and mounted on a mounting part. The capacitive sensor on the position detecting substrate then detects a position of a target object on the mounting part to detect a mounting position of the position detecting substrate on the mounting part. Based on the mounting position of the position detecting substrate, the moving position of the transfer arm when transferring a substrate is then adjusted.

Abstract: A position alignment of a transfer point of a transfer arm is performed by using a position detecting wafer capable of being loaded into an apparatus having a thin transfer port. The position detecting wafer S includes an electrostatic capacitance detecting sensor 50 for detecting an electrostatic capacitance in relation with a reference object for the position alignment. The electrostatic capacitance detecting sensor 50 includes a plurality of electrostatic capacitance detecting electrodes 52, each forming the electrostatic capacitance in relation with the reference object; and a control circuit 51 for controlling a detection of the electrostatic capacitance by each electrostatic capacitance detecting electrode 52, while communicating with each electrostatic capacitance detecting electrode 52. The electrostatic capacitance detecting electrodes 52 are provided on a rear surface of the position detecting wafer S, and the control circuit 51 is provided on a front surface of the position detecting wafer S.

Abstract: A substrate processing system for processing a substrate in accordance with a photolithographic process, comprising a cassette section, a process section having a plurality of process units each processing a substrate, main transfer arm mechanism arranged in a transfer space surrounded by the process section and the cassette section, for transporting substrates one by one not only between a cassette of the cassette section and each of the plurality of process units but also between the plurality of process units, and a loop transfer path movably supporting the main transfer arm means in a lower portion of the transfer space and guiding the main transfer arm means so as to face each of the process units and the cassette section.