Patents by Inventor Koji MISAKI

Koji MISAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Infrared sensor and infrared solid-state image pickup apparatus
    Patent number: 10274374
    Abstract: An infrared sensor includes an infrared sensor pixel in which a contact hole is formed to electrically connect a metal wiring layer and a support leg metal wiring layer that is located inside a support leg. The metal wiring layer is electrically connected to a signal reading circuit. The contact hole is formed by etching an insulating layer that is formed by deposition so as to cover the metal wiring layer, and has a bottom portion and a side wall portion that are each shaped into a forward tapered shape.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: April 30, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takaki Sugino, Kenji Shintani, Koji Misaki
  • INFRARED SENSOR AND INFRARED SOLID-STATE IMAGE PICKUP APPARATUS
    Publication number: 20180340836
    Abstract: An infrared sensor includes an infrared sensor pixel in which a contact hole is formed to electrically connect a metal wiring layer and a support leg metal wiring layer that is located inside a support leg. The metal wiring layer is electrically connected to a signal reading circuit. The contact hole is formed by etching an insulating layer that is formed by deposition so as to cover the metal wiring layer, and has a bottom. portion and a side wall portion that are each shaped into a forward tapered shape.
    Type: Application
    Filed: November 13, 2017
    Publication date: November 29, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takaki SUGINO, Kenji SHINTANI, Koji MISAKI