Patents by Inventor Koji Mitsui

Koji Mitsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic parts board and method of producing the same
    Patent number: 7728710
    Abstract: An electronic component substrate (1-1) includes an insulating base (10) and a flexible circuit board (20) mounted on the insulating base (10). The flexible circuit board (20) is a synthetic resin film provided thereon with terminal patterns (29) and a conductor pattern (25) whose surface is slidingly contacted with a slider. The insulating base (10) is a synthetic resin molded piece. The flexible circuit board (20) is insert-molded to the insulating base (10). The electronic component substrate (1-1) is produced by preparing the flexible circuit board (20) and first and second mold members (41, 45) having a cavity (C1) with a shape that corresponds to the external shape of the electronic component substrate (1-1). Then, the flexible circuit board (20) is accommodated in the cavity (C1) between the first and second mold members (41,45), and the cavity (C1) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members (41, 45) are removed.
    Type: Grant
    Filed: February 5, 2004
    Date of Patent: June 1, 2010
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Shinji Mizuno, Koji Mitsui, Katsutoshi Yanoshita, Shinichi Suzuki, Takashi Shinoki, Kazutaka Nakagome, Naoki Fukuda, Kozo Morita, Daisuke Makino
  • Electronic parts board and method of producing the same
    Publication number: 20060040094
    Abstract: An electronic component substrate 1-1 includes an insulating base 10 and a flexible circuit board 20 mounted on the insulating base 10. The flexible circuit board 20 is a synthetic resin film provided thereon with terminal patterns 29 and a conductor pattern 25 whose surface is slidingly contacted with a slider. The insulating base 10 is a synthetic resin molded piece. The flexible circuit board 20 is insert-molded to the insulating base 10. The electronic component substrate 1-1 is produced by preparing the flexible circuit board 20 and first and second mold members 41 and 45 having a cavity C1 with a shape that corresponds to the external shape of the electronic component substrate 1-1. Then, the flexible circuit board 20 is accommodated in the cavity C1 between the first and second mold members 41 and 45, and a molten molding resin is filled into the cavity C1. After the filled molding resin has been solidified, the first and second mold members 41 and 45 are removed.
    Type: Application
    Filed: February 5, 2004
    Publication date: February 23, 2006
    Inventors: Shinji Mizuno, Koji Mitsui, Katsutoshi Yanoshita, Shinichi Suzuki, Takashi Shinoki, Kazutaka Nakagawa, Naoki Fukuda, Kozo Morita, Daisuke Makino