Abstract: The present invention provides a colorless and transparent polyimide film which exhibits excellent heat resistance, transparency and strength equivalent to those of the conventional colorless and transparent polyimide film, can be produced at a lower cost than the conventional polyimide film, and is more resistant to methyl ethyl ketone than the conventional polyimide film. The colorless and transparent polyimide film of the present invention is made from a specific polyimide resin. The specific polyimide resins comprise a site derived from BPDA, at least one site selected from the group comprising a site derived from BPADA and a site derived from ODPA, a site derived from TFMB, and at least one site selected from the group comprising a site derived from 3,3?-DDS and a site derived from 4,4?-DDS. The haze value of the polyimide film is in the range of 0.1 or more and 2.0 or less.

Abstract: The method for producing a polyimide fiber includes a coagulation step of forming a polyimide precursor fiber by extruding a polyimide precursor solution containing a polyimide precursor and a compound having an acid dissociation constant (pKa) of a conjugate acid in water at 25° C. of 6.0 to 10 inclusive and an octanol-water partition coefficient (Log P) at 25° C. of ?0.75 to 0.75 inclusive into a poor solvent or nonsolvent for the polyimide precursor; and a heat drawing step of forming the polyimide fiber by drawing the polyimide precursor fiber while heating same. The polyimide fiber of the present disclosure has a physical property such that the coefficient of thermal expansion thereof is in the range of ?15 ppm/K to 0 ppm/K inclusive.

Abstract: The method for producing a polyimide fiber includes a coagulation step of forming a polyimide precursor fiber by extruding a polyimide precursor solution containing a polyimide precursor and a compound having an acid dissociation constant (pKa) of a conjugate acid in water at 25° C. of 6.0 to 10 inclusive and an octanol-water partition coefficient (Log P) at 25° C. of ?0.75 to 0.75 inclusive into a poor solvent or nonsolvent for the polyimide precursor; and a heat drawing step of forming the polyimide fiber by drawing the polyimide precursor fiber while heating same. The polyimide fiber of the present disclosure has a physical property such that the coefficient of thermal expansion thereof is in the range of ?15 ppm/K to 0 ppm/K inclusive.

Abstract: A binder composition for electrodes with greater binding strength that does not inhibit the formation of a stable electrode interface (SEI) on the surface of an active substance is provided. The binder composition for electrodes includes at least one type of tetracarboxylic acid ester compound, at least one type of diamine compound, and an organic solvent. Furthermore, the organic solvent preferably has a boiling point that is 250° C. or less. In addition, the organic solvent preferably has a highest occupied molecular orbital (HOMO) that is ?10 eV or less.

Abstract: A binder composition for electrodes with greater binding strength that does not inhibit the formation of a stable electrode interface (SEI) on the surface of an active substance is provided. The binder composition for electrodes includes at least one type of tetracarboxylic acid ester compound, at least one type of diamine compound, and an organic solvent. Furthermore, the organic solvent preferably has a boiling point that is 250° C. or less. In addition, the organic solvent preferably has a highest occupied molecular orbital (HOMO) that is ?10 eV or less.

Abstract: A binder composition for electrodes relating to the present invention includes an ester compound derived from at least one type of tetracarboxylic acid, at least one type of compound having 3 or more amino groups, and an organic solvent. Furthermore, this binder composition for electrodes preferably contains at least one type of diamino compound. In addition, it is preferable to use a solvent with a boiling point ?250° C. in this binder composition for electrodes.

Abstract: The task of the present invention is to offer a conductive paste that can be molded into a conductive coating or film that can maintain flexibility and ductility even while possessing a thickness of 50 ?m˜125 ?m. The conductive paste of the present invention includes a conductive particulate, a metal capture agent and a polyimide precursor solution. The metal capture agent can be selected as at least one from among either pyrimidinethiol compounds, triazinethiol compounds and imidazole compounds with a mercapto group. Moreover, the conductive particulate is preferably a core particle that is covered with a metal shell. In addition, a polyamic acid solution is preferred as the polyimide precursor solution.

Abstract: The task of the present invention is to offer a conductive paste that can be molded into a conductive coating or film that can maintain flexibility and ductility even while possessing a thickness of 50 ?m˜125 ?m. The conductive paste of the present invention includes a conductive particulate, a metal capture agent and a polyimide precursor solution. The metal capture agent can be selected as at least one from among either pyrimidinethiol compounds, triazinethiol compounds and imidazole compounds with a mercapto group. Moreover, the conductive particulate is preferably a core particle that is covered with a metal shell. In addition, a polyamic acid solution is preferred as the polyimide precursor solution.

Abstract: A polyimide precursor liquid composition of the present invention includes at least one type of tetracarboxylic dianhydride or derivative thereof, at least one type of diamine or derivative thereof, and a polar polymerization solvent, wherein the polyimide precursor liquid composition further includes a cyclic compound, and wherein the cyclic compound has a boiling point of 200° C. or more and comprises carbon, hydrogen and oxygen atoms. A polyimide coating film of the present invention is obtained by converting the polyimide precursor liquid composition into imide. Thus, the present invention provides a polyimide coating or film that is substantially colorless and transparent, and that is useful as, for example, a heat resistant coating film for liquid crystals, organic electroluminescence, touch panels and solar cells and the like.

Abstract: A polyimide precursor liquid composition of the present invention includes at least one type of tetracarboxylic dianhydride or derivative thereof, at least one type of diamine or derivative thereof, and a polar polymerization solvent, wherein the polyimide precursor liquid composition further includes a cyclic compound, and wherein the cyclic compound has a boiling point of 200° C. or more and comprises carbon, hydrogen and oxygen atoms. A polyimide coating film of the present invention is obtained by converting the polyimide precursor liquid composition into imide. Thus, the present invention provides a polyimide coating or film that is substantially colorless and transparent, and that is useful as, for example, a heat resistant coating film for liquid crystals, organic electroluminescence, touch panels and solar cells and the like.