Abstract: A substrate processing apparatus includes a carrier block, an end block for returning a substrate picked up from the carrier block to the carrier block, and a middle block. The middle block includes a plurality of first processing modules stacked one above another, each being configured to process the picked-up substrate and directed to the end block or the substrate returning from the end block to the carrier block; a first transfer mechanism for vertically moving to transfer the substrate that is transferred from one of the carrier and end blocks to the middle block, to a respective one of the first processing modules, and delivering the substrate to the other of the carrier and end blocks; and a second transfer mechanism for transferring the substrate from the other of the carrier and end blocks to the one thereof, without passing through the plurality of first processing modules.

Abstract: A substrate processing apparatus includes a carrier block, an end block for returning a substrate picked up from the carrier block to the carrier block, and a middle block. The middle block includes a plurality of first processing modules stacked one above another, each being configured to process the picked-up substrate and directed to the end block or the substrate returning from the end block to the carrier block; a first transfer mechanism for vertically moving to transfer the substrate that is transferred from one of the carrier and end blocks to the middle block, to a respective one of the first processing modules, and delivering the substrate to the other of the carrier and end blocks; and a second transfer mechanism for transferring the substrate from the other of the carrier and end blocks to the one thereof, without passing through the plurality of first processing modules.

Abstract: A composite material comprising a core layer comprising filler and synthetic resin and containing the filler having a weight 0.7 times or more the product of volume of the core layer and bulk density of the filler; and a surface layer comprising a thermosetting resin reinforced by long fibers extending parallel in a longitudinal direction thereof, the surface layer being laminated on the core layer to cover at least one surface of the core layer with respect to a thickness direction thereof.

Abstract: An undercoat composition for a powder coating of a heat-resistant resin on a metal substrate at a high coating temperature wherein the composition includes a specific imide prepolymer.

Abstract: There is provided a method for coating a metal substrate by the use of a polyvinylidene fluoride resin composition. The method comprises forming a coating film made of a melted resin composition on the surface of an undercoated metal substrate at a temperature of from 200.degree. to 350.degree. C., said resin composition containing a major amount of polyvinylidene fluoride and from 5 to 40% by weight of an inorganic filler based on the total weight of the resin composition; and precooling said coating film to a temperature T.sub.A and then keeping said coating film at the temperature T.sub.A for at least one minute, wherein said temperature T.sub.A (.degree.C.) satisfies the inequality:T.sub.C -10.degree.C..ltoreq.T.sub.A .ltoreq.T.sub.C +10.degree.C.,said T.sub.C (.degree.C.) being the crystallization temperature for the polyvinylidene fluoride.