Patents by Inventor Koji Niinobu

Koji Niinobu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming pattern in manufacturing semiconductor device
    Patent number: 5082800
    Abstract: A method of manufacturing a semiconductor device including a semiconductor substrate (10) comprising n-emitter regions (14a-14c) formed before the substrate is brazed on a molybdenum plate (1). Due to the difference between respective thermal expansion coefficients of silicon and molybdenum, the substrate is warped through the brazing process and the horizontal positions of the n-emitter regions are shifted. A mask pattern for patterning an aluminum layer (31) is corrected in position to prevent a patterned aluminum layer from extending over the peripheral areas of the n-emitter regions.
    Type: Grant
    Filed: February 12, 1991
    Date of Patent: January 21, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Koji Niinobu, Futoshi Tokunoh