Abstract: A semiconductor device includes: a semiconductor substrate including a front surface, a back surface that is opposite to the front surface, and a drift layer of a first conductive type disposed between the front surface and the back surface; a first diffusion layer of a second conductive type provided between the drift layer and the front surface; a second diffusion layer provided between the drift layer and the back surface; a first buffer layer of the first conductive type provided between the drift layer and the second diffusion layer, having a concentration higher than that of the drift layer, and into which a proton is injected; and a second buffer layer of the first conductive type provided between the first buffer layer and the second diffusion layer and having a concentration higher than that of the drift layer, wherein a peak concentration of the second buffer layer is higher than a peak concentration of the first buffer layer, an impurity concentration of the first buffer layer gradually decreases t

Abstract: A semiconductor device includes an N-type drift layer provided between a first main surface and a second main surface of the semiconductor substrate and an N-type buffer layer provided between the N-type drift layer and the first main surface and having a higher impurity peak concentration than the N-type drift layer. The N-type buffer layer has a structure that a first buffer layer, a second buffer layer, a third buffer layer, and a fourth buffer layer are disposed in this order from a side of the first main surface. When a distance from an impurity peak position of the first buffer layer to an impurity peak position of the second buffer layer is L12 and a distance from an impurity peak position of the second buffer layer to an impurity peak position of the third buffer layer is L23, a relationship of L23/L12?3.5 is satisfied.

Abstract: An alkali metal ion capacitor that is capable of operating in a high-temperature environment at 85° C. The alkali metal ion capacitor is provided with: a positive electrode active material capable of adsorbing and desorbing alkali metal ions; a positive electrode binder for binding the positive electrode active material; a negative electrode active material capable of storing and releasing alkali metal ions; a negative electrode binder for binding the negative electrode active material; and an electrolytic solution that contains an organic solvent and an imide-based alkali metal salt. The negative electrode active material is predoped with alkali metal ions. The positive electrode binder has a Hansen solubility parameter-based RED value of more than 1 with respect to the electrolytic solution.

Abstract: Disclosed is a substrate treating apparatus that performs a heat treatment to a substrate. The apparatus includes the following elements: a heat treating plate; a casing that produces a heat treatment atmosphere by the heat treating plate; a movable top board that is movable between a ceiling surface of the casing and the heat treating plate; and a controller that causes the movable top board to be moved to a raised position when the substrate is loaded/unloaded, and causes the movable top board to be moved to a lowered position when the substrate is placed on the heat treating plate for performing the heat treatment, thereby controlling the lowered position for every substrate.

Abstract: A burn-in board includes: a board; sockets mounted on the board; a connector mounted on the board; and wiring systems disposed in the board and connecting the sockets and the connector. The wiring systems comprise: a first wiring system that transmits a first signal; and a second wiring system that transmits a second signal different from the first signal, and a type of a first connection form of the first wiring system is different from a type of a second connection form of the second wiring system.

Abstract: A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.

Abstract: A power supply device includes a combination of one power supply module of a plurality of power supply modules having different power supply performances and one controller of a plurality of controllers having different functions, which are selectively combined. Each of the plurality of power supply modules includes a power supply module side connection portion common to the plurality of power supply modules, and each of the plurality of controllers includes a controller side connection portion common to the plurality of controllers and connectable to the power supply module side connection portion, to allow the one power supply module and the one controller are selectively combined.

Abstract: A semiconductor device includes: a semiconductor substrate including a front surface, a back surface that is opposite to the front surface, and a drift layer of a first conductive type disposed between the front surface and the back surface; a first diffusion layer of a second conductive type provided between the drift layer and the front surface; a second diffusion layer provided between the drift layer and the back surface; a first buffer layer of the first conductive type provided between the drift layer and the second diffusion layer, having a concentration higher than that of the drift layer, and into which a proton is injected; and a second buffer layer of the first conductive type provided between the first buffer layer and the second diffusion layer and having a concentration higher than that of the drift layer, wherein a peak concentration of the second buffer layer is higher than a peak concentration of the first buffer layer, an impurity concentration of the first buffer layer gradually decreases t

Abstract: An auxiliary power supply device includes an auxiliary power supply; and an auxiliary power supply control unit configured to switch a mode of the auxiliary power supply to an output mode or a non-output mode when electric power is output from a main power supply to a drive motor. The auxiliary power supply control unit is configured to switch the mode to the non-output mode when a required power value required by the drive motor is equal to or smaller than a predetermined power value and to switch the mode to the output mode when the required power value is larger than the predetermined power value, the predetermined power value being set to a value smaller than outputtable electric power that is electric power outputtable from the main power supply.

Abstract: An alkali metal ion capacitor that is capable of operating in a high-temperature environment at 85° C. The alkali metal ion capacitor is provided with: a positive electrode active material capable of adsorbing and desorbing alkali metal ions; a positive electrode binder for binding the positive electrode active material; a negative electrode active material capable of storing and releasing alkali metal ions; a negative electrode binder for binding the negative electrode active material; and an electrolytic solution that contains an organic solvent and an imide-based alkali metal salt. The negative electrode active material is predoped with alkali metal ions. The positive electrode binder has a Hansen solubility parameter-based RED value of more than 1 with respect to the electrolytic solution.

Abstract: A semiconductor device is adapted for controlling energization of a heating element that performs printing. The semiconductor device includes: a strobe signal input unit receiving a printing strobe signal that causes the heating element to generate heat for printing; a preheating strobe generation circuit generating a preheating strobe signal that causes the heating element to preheat by compressing a waveform of the printing strobe signal in a time axis direction; and an output controller outputting a control signal that controls energization of the heating element based on the printing strobe signal and the preheating strobe signal.

Abstract: A lithium ion secondary battery that can operate in a high-temperature environment of 85° C. The lithium ion secondary battery includes a positive electrode active material that can store and release lithium ions Li|, a positive electrode binder that binds the positive electrode active material, a negative electrode active material that can store and release lithium ions Li+, a negative electrode binder that binds the negative electrode active material, and an electrolytic solution containing an organic solvent and an imide-based lithium salt. The negative electrode active material is previously doped with lithium ions. The positive electrode binder has a Hansen solubility parameter-based relative energy difference (RED) value of more than 1 with respect to the electrolytic solution.

Abstract: An auxiliary power supply device includes an auxiliary power supply; and an auxiliary power supply control unit configured to switch a mode of the auxiliary power supply to an output mode or a non-output mode when electric power is output from a main power supply to a drive motor. The auxiliary power supply control unit is configured to switch the mode to the non-output mode when a required power value required by the drive motor is equal to or smaller than a predetermined power value and to switch the mode to the output mode when the required power value is larger than the predetermined power value, the predetermined power value being set to a value smaller than outputtable electric power that is electric power outputtable from the main power supply.

Abstract: A power supply device includes a combination of one power supply module of a plurality of power supply modules having different power supply performances and one controller of a plurality of controllers having different functions, which are selectively combined. Each of the plurality of power supply modules includes a power supply module side connection portion common to the plurality of power supply modules, and each of the plurality of controllers includes a controller side connection portion common to the plurality of controllers and connectable to the power supply module side connection portion, to allow the one power supply module and the one controller are selectively combined.

Abstract: A treating liquid vaporizing apparatus includes a buffer tank for storing a treating liquid, a vaporizing container connected to the buffer tank for vaporizing the treating liquid, a further vaporizing container connected to the buffer tank in parallel with the vaporizing container for vaporizing the treating liquid, a switch valve for opening and closing a flow path of the treating liquid between the buffer tank and the vaporizing container, and a switch valve for opening and closing a flow path of the treating liquid between the buffer tank and the further vaporizing container.

Abstract: An upper plate on which a substrate is placed is cooled or heated by a thermal processor. The temperature of the thermal processor is adjusted by a temperature adjuster. The temperature of the upper plate is detected. A control value that is to be applied to the temperature adjuster in order to maintain the temperature of the upper plate at a set value is calculated as a control arithmetic value on the basis of the detected temperature. When the control arithmetic value decreases to a value less than a second threshold value, a first control that applies the control arithmetic value to the temperature adjuster is performed. When the control arithmetic value increases to a value not less than a first threshold value, a second control that applies a control set value higher than the control arithmetic value to the temperature adjuster is performed.

Abstract: A pressure reducing valve includes a body, an annular valve seat, a valve element, and a pressing mechanism configured to press the valve element. The pressing mechanism includes a plug provided downstream of the valve seat and having a plug hole, and a pin including a sliding portion and an upstream end, the sliding portion having a shaft shape and being inserted in the plug hole such that a gap is provided between the sliding portion and an inner peripheral surface of the plug hole, and the upstream end being provided upstream of the sliding portion so as to contact the valve element. A fitting length of the sliding portion with respect to the plug hole and the gap between the sliding portion and the plug hole satisfy 0.0005 L<C<0.00908 L, where L indicates the fitting length, and C indicates the gap.

Abstract: Disclosed is an acidic oil-in-water type emulsified condiment comprising one or more chelating agents selected from citric acid, malic acid, phosphoric acid, lactic acid, succinic acid, fumaric acid, gluconic acid, and EDTA, acetic acid, a sugar, a yolk, an edible oil, a thickener, and water, wherein the content of the edible oil is 1 to 40% by mass, and the acidic oil-in-water type emulsified condiment has a water activity of 0.90 to 0.96, a pH of 3.0 to 4.0, a viscosity (20° C.) of 50 to 600 Pa·s, and a b* value of 10 to 20 in an L*a*b* color system when preserved at 40° C. for 4 months.

Abstract: Disclosed is a substrate treating apparatus that performs a heat treatment to a substrate. The apparatus includes the following elements: a heat treating plate; a casing that produces a heat treatment atmosphere by the heat treating plate; a movable top board that is movable between a ceiling surface of the casing and the heat treating plate; and a controller that causes the movable top board to be moved to a raised position when the substrate is loaded/unloaded, and causes the movable top board to be moved to a lowered position when the substrate is placed on the heat treating plate for performing the heat treatment, thereby controlling the lowered position for every substrate.

Abstract: A production apparatus for producing an electricity storage material is provided. The electricity storage material includes at least a thickener and an active material. The production apparatus includes a solution production device and a mixture-kneading device. The solution production device produces a surfactant-containing solution of the thickener. The mixture-kneading device kneads the solution together with a powder of the active material.