Abstract: A communication apparatus enables an establishment data of a package type concerned to be established to a package to settle a communication pass although the establishment data of the package mounted is not established from an external system. The communication apparatus has a plurality of slots into which the package is inserted. The communication apparatus settles a communication pass in such a way that a configuration data is established for the package installed on the inside of the slot. The slot is capable of installing voluntary package therein. There is provided a data processor which establishes the configuration data to the package mounted.

Abstract: A hermetically sealing enclosure for housing photo-semiconductor devices that reduces the heat generated in the wiring strips at the ceramic terminal member, increases the allowable current of the wiring strips in comparison with the conventional enclosures while maintaining the low power consumption, and stabilizes the output of the device in the enclosure. A photo-semiconductor module incorporating the enclosure is also offered. The ceramic terminal member is provided with a first wiring layer that comprises a plurality of wiring strips and that penetrates through the ceramic terminal member; two second wiring layers each of which comprises at least one wiring strip, one of which is connected to the first wiring layer at the outside of the enclosure, and the other of which is connected to the first wiring layer at the inside; and at least one third wiring layer that comprises at least one wiring strip and that connects the two second wiring layers.

Abstract: A sealed airtight container wherein the width of the exposed electrode part provided in a ceramic terminal part is enlarged, and the exposed electrode part is connected to a wiring part and the width of the wiring part is equal to the enlarged width of the electrode part. A sealed airtight container for an optical-semiconductor with a small heat generation in the metallized wiring layer, small power consumption and large current carrying capacity, and an optical-semiconductor module with a stable optical output can be obtained.

Abstract: A clip connector (A) includes an insulating housing (1) and a plurality of terminals (2) projecting from the housing (1). The housing (1) includes an outer surface (1a) for engaging a support member such as a printed board. The outer surface (1a) is irregular, including a plurality of projecting portions (12) and a plurality of retreating portions (13). Each of the terminals (2) includes a straight portion (20a) and a bent portion (20b). Each of the straight portion (20a) is formed with a through-hole (22) through which a resin for bonding the support member and the outer surface (1a) is applied.

Abstract: A hermetically sealing enclosure for housing photo-semiconductor devices that reduces the heat generated in the wiring strips at the ceramic terminal member, increases the allowable current of the wiring strips in comparison with the conventional enclosures while maintaining the low power consumption, and stabilizes the output of the device in the enclosure. A photo-semiconductor module incorporating the enclosure is also offered. The ceramic terminal member is provided with a first wiring layer that comprises a plurality of wiring strips and that penetrates through the ceramic terminal member; two second wiring layers each of which comprises at least one wiring strip, one of which is connected to the first wiring layer at the outside of the enclosure, and the other of which is connected to the first wiring layer at the inside; and at least one third wiring layer that comprises at least one wiring strip and that connects the two second wiring layers.

Abstract: A drive IC chip (A) has a primary surface (10) which includes a corner (11a) at which a first and a second pads (3a, 3b) are provided so that their respective centers (Oa, Ob) are deviate positionally from each other in both directions x, y. With this structure, even if two wires for electric connection are extended from the first and the second pads (3a, 3b) either in the x direction or in the y direction, it is possible to advantageously prevent the wires from becoming too close to each other into shorting contact.

Abstract: A sealed airtight container wherein the width of the exposed electrode part provided in a ceramic terminal part is enlarged, and the exposed electrode part is connected to a wiring part and the width of the wiring part is equal to the enlarged width of the electrode part. A sealed airtight container for an optical-semiconductor with a small heat generation in the metallized wiring layer, small power consumption and large current carrying capacity, and an optical-semiconductor module with a stable optical output can be obtained.

Abstract: A DC-DC converter includes a primary side circuit for allowing a switching device to perform on/off operations to output energy in a primary coil of a transformer to a secondary coil. A secondary side circuit rectifies and smooths a voltage outputted from the secondary coil so as to output a DC-DC voltage. A voltage-detecting circuit rectifies and smooths a voltage outputted from a voltage-detecting coil provided in the transformer so as to output the voltage as a detected voltage corresponding to a voltage to be outputted from the secondary side circuit. A control circuit applies to the switching device a pulse control signal used for controlling on/off operation of the switching device according to the voltage outputted from the voltage-detecting circuit.

Abstract: The invention provides quality assured network services in a multi-domain network and comprises a network service management device for managing device clusters incorporated within the operations management network of each provider network and receiving service orders, and a multi-domain service broker for providing a broker function for achieving agreement between a plurality of providers, and the multi-domain service broker further comprises a device for collecting domain information and information relating to the services each provider is able to provide from the network service management devices, and a device which on receipt of a network service request from a customer, extracts the network service management device of the domain which is able to satisfy the required quality level, and then issues instructions for the setting of the required information within the extracted network service management device.

Abstract: A grinding wheel is for use in a grinding machine, and is attached on a wheel spindle of the grinding machine for simultaneously grinding at least two parts of a workpiece. The grinding wheel includes at least two wheel cores. Each of wheel cores has a disk-like shape. An abrasive layer is disposed on a circumferential surface of each of the wheel cores. A spacer portion is inseparably fixed on at least one of the wheel cores for keeping a space between the abrasive layers of the wheel cores. And a first labyrinth portion located on one of side surfaces of one of the wheel cores for forming a labyrinth seal with a second labyrinth portion arranged on the grinding machine. The number of separable parts of the grinding wheel are extremely decreased in consideration of imbalance of every part. The spacer portion is integral with at least one of the wheel cores.

Abstract: A thermal printhead is provided which includes a head substrate (11) made of an insulating material, a heating element (12) arranged along an edge of the substrate, drive ICs (13) for driving the heating element, a temperature sensor (18) mounted on the head substrate for temperature monitoring of the heating element, and a heat sink (20) attached to the head substrate. The heat sink has a first surface for attachment to the head substrate and a second surface corresponding in location to the temperature sensor. The second surface faces the head substrate but is spaced therefrom to define a heat-transfer adjusting region (22). The head substrate and the heat sink are attached together by an adhesive member having a desired heat conductivity.

Abstract: On a surface of an insulating board, a front wiring pattern is formed. On the rear surface of the insulating board, opposing the front wiring pattern, a rear wiring pattern is formed in a shape which is substantially plane-symmetrical to the front wiring pattern. An opening which penetrates the front wiring pattern and the rear wiring pattern is formed. At the inner wall of the opening, an electrically conductive layer is formed. Inside the opening, solder, for example, is placed to form an electrically conductive filling. As a result, the front wiring pattern and the rear wiring pattern are positively connected to each other electrically. Therefore, the current capacity and the heat capacity of the wiring patterns are increased, and the amount of generated heat is reduced.

Abstract: When a multilayer substrate is formed by alternately laminating a plurality of substrates having coil patterns and preimpregs including an epoxy resin, and by pressing in the direction of lamination while heating, the epoxy resin is melted and may leak from between the substrates, and may form voids between the coil patterns so as to render the electrical insulation therebetween unsatisfactory. According to the present invention, a fence pattern or another structure is formed around each coil pattern, which substantially prevents leakage of the melted epoxy resin from between the substrates, and therefore, the spaces between the coil patterns remain securely filled with the epoxy resin.

Abstract: A current-mode control device for controlling an output voltage of a DC power supply including: a switching element for supplying an output voltage of the DC power supply through an on/off switching action; an output voltage detector circuit for detecting the output voltage of the DC power supply and outputting an output voltage based on the output voltage of the DC power supply; a current sense circuit for converting into a voltage a switching current flowing through the switching element during the switch-on period of the switching element to sense and output the resulting voltage; an integrating circuit for converting the switching current of the switching circuit that increases at a gradient of a straight line linear function with time during of the switch-on period of the switching element into a voltage that increases at a rate defined by a quadratic or higher-order curved line with time by integrating the switching current of the switching circuit at least once and for superimposing the resulting volta

Abstract: According to one embodiment of a switching power supply, a superimposition circuit including a resistor is connected in parallel to the primary coil of a transformer. A superimposition current is supplied to a current sensing circuit during a switching-on period of a switching element. The current sensing circuit detects the current flowing through the primary coil during the switch-on period. According to the detected current, a switch control circuit controls switching on and off of the switching element so as to stabilize the output voltage. When the current becomes low in a case in which the circuit has a light load or receives a high input voltage, noise generally causes substantial adverse effects.

Abstract: A low-temperature fusing brazing material containing 10-70% by weight of silver, 10-75% by weight of antimony, 10-50% by weight of indium and/or tin and 0-15% by weight of copper, and wiring boards and semiconductor device-housing packages assembled with the foregoing brazing material.

Abstract: A thermal printhead assembly includes a metallic heat sink plate, a head circuit board mounted on an obverse surface of the heat sink plate, and a control circuit board electrically connected to the head circuit board for feeding control signals and power supply to the head circuit board. The head circuit board is formed with a heating resistor. A reverse surface of the heat sink plate is mounted on the control circuit board so that the heat sink plate is sandwiched between the head circuit board and the control circuit board.

Abstract: A thermal printhead according to the present invention includes a stepped heat sink plate (1) having an upper first supporting surface (1a) and a lower second supporting surface (1b), a head substrate (2) mounted on the first supporting surface (1a) of the heat sink plate (1) and formed with printing dots (3), and a printed circuit board (14) mounted on the second supporting surface (1b) of the heat sink plate (1) and formed with various wiring patterns. The head substrate (2) has an edge projecting from the first supporting surface (1a) of the heat sink plate (1) toward the second supporting surface (1b). The printed circuit board (14) overlaps the projecting edge of the head substrate (2) with a predetermined spacing (18) therebetween.

Abstract: In a grinding wheel for use in a grinding machine, a plurality of grinding tips are bonded on the outer peripheral surface of a wheel core having a disk-like shape by bond. On both side surfaces of the wheel core are formed with depressions continuous with the outer peripheral surface of the wheel core. Bond is filled between the outer peripheral surface and the grinding chips, and filled in the depressions of the wheel core to form a bonding layer. Namely, the bonding layer has side portions which extends along both side surfaces of the wheel core in a radial direction.