Patents by Inventor Koji Nishibuchi

Koji Nishibuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10199138
    Abstract: Insulated winding wires and associated methods for forming winding wires are described. A winding wire may include a conductor and insulation formed around the conductor. The insulation may provide a partial discharge inception voltage greater than approximately 1,000 volts and a dielectric strength greater than approximately 10,000 volts. Additionally, the insulation may be capable of withstanding a continuous operating temperature of approximately 220° C. without degradation. The insulation may include at least one base layer formed around an outer periphery of the conductor, and an extruded thermoplastic layer formed around the base layer. The extruded layer may include at least one of polyetheretherketone (PEEK) or polyaryletherketone (PAEK).
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: February 5, 2019
    Assignee: Essex Group, Inc.
    Inventors: Gregory S. Caudill, Baber Inayat, Allan R. Knerr, Jason Dennis Stephens, Koji Nishibuchi, Marvin Bradford DeTar, Joonhee Lee, Won S. Lee, Bogdan Gronowski
  • Patent number: 9543058
    Abstract: An insulated winding wire may include a conductor and insulation formed around the conductor. The insulation may include a base insulation layer formed around the conductor and having a first dielectric constant (?1). The insulation may further include an extruded thermoplastic layer formed around the base insulation layer and having a second dielectric constant (?2). The extruded thermoplastic layer may include (i) at least one polymer comprising a ketone group and (ii) at least one fluoropolymer. A ratio of the dielectric constant (?2) of the extruded thermoplastic layer to the dielectric constant (?1) of the base layer at 250° C. may be less than or equal to approximately 1.0.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: January 10, 2017
    Assignee: Essex Group, Inc.
    Inventors: Allan R. Knerr, Gregory S. Caudill, Baber Inayat, Jason Dennis Stephens, Koji Nishibuchi, Bogdan Gronowski, Joonhee Lee, Won S. Lee
  • Publication number: 20160233003
    Abstract: Insulated winding wires and dissociated methods for forming winding wires are described. A winding wire may include a conductor and insulation formed around the conductor. The insulation may provide a partial discharge inception voltage greater than approximately 1,000 volts and a dielectric strength greater than approximately 10,000 volts. Additionally, the insulation may be capable of withstanding a continuous operating temperature of approximately 220° C. without degradation. The insulation may include at least one base layer formed around an outer periphery of the conductor, and an extruded thermoplastic layer formed around the base layer. The extruded layer may include at least one of polyetheretherketone (PEEK) or polyaryletherketone (PAEK.).
    Type: Application
    Filed: March 17, 2016
    Publication date: August 11, 2016
    Inventors: Gregory S. Caudill, Baber Inayat, Allan R. Knerr, Jason Dennis Stephens, Koji Nishibuchi, Marvin Bradford De Tar, Joonhee Lee, Won S. Lee, Bogdan Gronowski
  • Patent number: 9324476
    Abstract: Insulated winding wires and associated methods for forming winding wires are described. A winding wire may include a conductor and insulation formed around the conductor. The insulation may provide a partial discharge inception voltage greater than approximately 1,000 volts and a dielectric strength greater than approximately 10,000 volts. Additionally, the insulation may be capable of withstanding a continuous operating temperature of approximately 220° C. without degradation. The insulation may include at least one base layer formed around an outer periphery of the conductor, and an extruded thermoplastic layer formed around the base layer. The extruded layer may include at least one of polyetheretherketone (PEEK) or polyaryletherketone (PAEK).
    Type: Grant
    Filed: February 5, 2014
    Date of Patent: April 26, 2016
    Assignee: Essex Group, Inc.
    Inventors: Gregory S. Caudill, Baber Inayat, Allan R. Knerr, Jason Dennis Stephens, Koji Nishibuchi, Marvin Bradford DeTar, Joonhee Lee, Won S. Lee, Bogdan Gronowski
  • Publication number: 20150243410
    Abstract: An insulated winding wire may include a conductor and insulation formed around the conductor. The insulation may include a base insulation layer formed around the conductor and having a first dielectric constant (?1). The insulation may further include an extruded thermoplastic layer formed around the base insulation layer and having a second dielectric constant (?2). The extruded thermoplastic layer may include (i) at least one polymer comprising a ketone group and (ii) at least one fluoropolymer. A ratio of the dielectric constant (?2) of the extruded thermoplastic layer to the dielectric constant (?1) of the base layer at 250° C. may be less than or equal to approximately 1.0.
    Type: Application
    Filed: February 25, 2015
    Publication date: August 27, 2015
    Inventors: Allan R. Knerr, Gregory S. Caudill, Baber Inayat, Jason Dennis Stephens, Koji Nishibuchi, Bogdan Gronowski, Joonhee Lee, Won S. Lee
  • Publication number: 20150221412
    Abstract: Insulated winding wires and associated methods for forming winding wires are described. A winding wire may include a conductor and insulation formed around the conductor. The insulation may provide a partial discharge inception voltage greater than approximately 1,000 volts and a dielectric strength greater than approximately 10,000 volts. Additionally, the insulation may be capable of withstanding a continuous operating temperature of approximately 220° C. without degradation. The insulation may include at least one base layer formed around an outer periphery of the conductor, and an extruded thermoplastic layer formed around the base layer. The extruded layer may include at least one of polyetheretherketone (PEEK) or polyaryletherketone (PAEK).
    Type: Application
    Filed: February 5, 2014
    Publication date: August 6, 2015
    Applicant: Essex Group, Inc.
    Inventors: Gregory S. Caudill, Baber Inayat, Allan R. Knerr, Jason Dennis Stephens, Koji Nishibuchi, Marvin Bradford DeTar, Joonhee Lee, Won S. Lee
  • Patent number: 5330870
    Abstract: An electrophotographic developer composition for flash fusing containing at least a binder resin based on a polyester resin and a colorant, the polyester resin being formed between an acid component, not less than 80 mol % of the acid component being phthalic acid series dicarboxylic acid and an alcohol component, not less than 80 mol % of the alcohol component being bisphenol A alkylene oxide adduct, the polyester resin having an acid value of not more than 10.0 KOH mg/g, a softening temperature of not less than 95.0.degree. C. and not more than 125.0.degree. C. as determined using a flow tester of the "koka-shiki" type and a glass transition temperature of not less than 50.0.degree. C. and not more than 80.0.degree. C. as determined by DSC, whereby substantially no odor is produced upon flash fusing.
    Type: Grant
    Filed: August 31, 1992
    Date of Patent: July 19, 1994
    Assignee: Kao Corporation
    Inventors: Shingo Tanaka, Koji Nishibuchi, Koji Shimokusa, Tetsuya Ueno
  • Patent number: 5252420
    Abstract: The present invention is directed to a developer composition for electrophotography containing a binder resin comprising at least a polyester resin as the main component, a colorant and a bisphenol A alkylene oxide adduct, wherein said bisphenol A alkylene oxide adduct is contained in a ratio of not less than 1.0 part by weight and not more than 10.0 parts by weight to 100 parts by weight of the binder resin. The developer composition of the present invention possesses satisfactory low-temperature fixability and is excellent in offset resistance, storage stability and resin pulverizability.
    Type: Grant
    Filed: June 27, 1991
    Date of Patent: October 12, 1993
    Assignee: KAO Corporation
    Inventors: Shingo Tanaka, Tetsuya Ueno, Koji Nishibuchi