Patents by Inventor Koji Nishioka

Koji Nishioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240218244
    Abstract: A cured film of a curable composition containing quantum dots and breakdown and a method enabling the production of the cured film. The cured film contains quantum dots (A) and a photopolymerizable compound (B), in which the cured film has a Martens hardness of more than 0.10 GPa, and a method for producing a cured film of a curable composition containing quantum dots (A) and a photopolymerizable compound (B), the method including an exposure step of irradiating a film of the curable composition with light and a thermal curing step of thermally curing the film of the curable composition, in which, when a light exposure in the exposure step is indicated by X (mJ/cm2), a thermal curing temperature in the thermal curing step is indicated by Y (° C.), and a thermal curing time is indicated by Z (hr), a formula (1): X×Y×Z2?6500 is satisfied.
    Type: Application
    Filed: February 21, 2022
    Publication date: July 4, 2024
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masayoshi TOKUDA, Yoshihiro HARADA, Yoshifumi KOMATSU, Koji NISHIOKA
  • Publication number: 20240166791
    Abstract: A cured film of a curable composition containing a light scattering agent and a method enabling the production of the cured film. A cured film containing a light scattering agent (A) and a photopolymerizable compound (B), in which the cured film has a Martens hardness of 0.10 GPa or more, and a method for producing the curable composition containing a light scattering agent (A) and a photopolymerizable compound (B), the method including an exposure step of irradiating a film of the curable composition with light and a thermal curing step of thermally curing the film of the curable composition, in which, when a light exposure in the exposure step is indicated by X (mJ/cm2), a thermal curing temperature in the thermal curing step is indicated by Y (° C.), and a thermal curing time is indicated by Z (hr), a formula (1): X×Y×Z2?3000 is satisfied.
    Type: Application
    Filed: February 21, 2022
    Publication date: May 23, 2024
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masayoshi TOKUDA, Yoshihiro HARADA, Yoshifumi KOMATSU, Koji NISHIOKA
  • Patent number: 11766726
    Abstract: A method for machining a sputtering target that includes a sputtering surface, an opposing surface opposite to the sputtering surface, and an outer peripheral surface being between the sputtering surface and the opposing surface comprises the steps of: fixing the sputtering target on a fixing table by mounting the sputtering surface or the opposing surface of the sputtering target on the fixing table; and cutting the outer peripheral surface of the sputtering target by a cutting tool while rotating the cutting tool along a circumferential direction of the outer peripheral surface of the sputtering target.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: September 26, 2023
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masahiro Fujita, Koji Nishioka
  • Publication number: 20230274921
    Abstract: A sputtering target comprising: a backing plate; and a target material bonded via a bonding material to a bonding region of the backing plate, wherein a bonding area of a bonding portion between the target material and the backing plate accounts for 97% or more of the area of the bonding region, and wherein a maximum defect area of portions without the bonding material present between the target material and the backing plate accounts for 0.6% or less of the area of the bonding region. The sputtering target enables manufacturing of the sputtering target in which the target material is hardly peeled off during sputtering.
    Type: Application
    Filed: May 3, 2023
    Publication date: August 31, 2023
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masahiro FUJITA, Koji NISHIOKA
  • Patent number: 11731230
    Abstract: A sputtering target that is less likely to cause abnormal discharge is manufactured. A method for manufacturing a sputtering target includes performing multi-stage polishing on a sputtering surface of a target material having a Vickers hardness of 100 or less being made of metal by using a plurality of abrasives having different grit numbers in ascending order of grit number from a small grit number to a large grit number.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: August 22, 2023
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masahiro Fujita, Koji Nishioka
  • Publication number: 20220310371
    Abstract: A sputtering target comprising: a backing plate; and a target material bonded via a bonding material to a bonding region of the backing plate, wherein a bonding area of a bonding portion between the target material and the backing plate accounts for 97% or more of the area of the bonding region, and wherein a maximum defect area of portions without the bonding material present between the target material and the backing plate accounts for 0.6% or less of the area of the bonding region. The sputtering target enables manufacturing of the sputtering target in which the target material is hardly peeled off during sputtering.
    Type: Application
    Filed: March 26, 2021
    Publication date: September 29, 2022
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masahiro FUJITA, Koji NISHIOKA
  • Patent number: 11345533
    Abstract: A sputtering target packaging structure comprising: a sputtering target including a cylinder part, a flange part disposed on an opening part at one end of the cylinder part, and a cap disposed on an opening part at the other end of the cylinder part; and a packing material made up of a sheet and covering an inner surface and an outer surface of the sputtering target in a close contact state, wherein the packing material includes seal parts on both end sides of the sputtering target.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: May 31, 2022
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Koji Nishioka, Naoya Satoh
  • Publication number: 20220013342
    Abstract: An object of the present invention is to provide a production method for a backing plate that can reduce displacement of the groove.
    Type: Application
    Filed: November 15, 2019
    Publication date: January 13, 2022
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Koji NISHIOKA, Naoya SATOH
  • Patent number: 11142819
    Abstract: Provided is a sputtering target that is less likely to cause abnormal discharge. The sputtering target has a sputtering surface in which a lightness L in a Lab color system is more than 27 and 51 or less.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: October 12, 2021
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Hiroyuki Tsukada, Masahiro Fujita, Koji Nishioka
  • Publication number: 20200384598
    Abstract: A sputtering target that is less likely to cause abnormal discharge is manufactured. A method for manufacturing a sputtering target includes performing multi-stage polishing on a sputtering surface of a target material having a Vickers hardness of 100 or less being made of metal by using a plurality of abrasives having different grit numbers in ascending order of grit number from a small grit number to a large grit number.
    Type: Application
    Filed: September 21, 2018
    Publication date: December 10, 2020
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masahiro FUJITA, Koji NISHIOKA
  • Publication number: 20200385853
    Abstract: Provided is a sputtering target that is less likely to cause abnormal discharge. The sputtering target has a sputtering surface in which a lightness L in a Lab color system is more than 27 and 51 or less.
    Type: Application
    Filed: September 21, 2018
    Publication date: December 10, 2020
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Hiroyuki TSUKADA, Masahiro FUJITA, Koji NISHIOKA
  • Patent number: 10670384
    Abstract: To provide a process for producing a cylindrical target which has almost no distortion in the longitudinal direction. The process for producing a cylindrical target according to the present invention comprises the steps of: processing a target material into a cylindrical shape; providing an adapter for attachment to a sputtering apparatus, in the target material processed into the cylindrical shape; and measuring a straightness in a longitudinal direction of an appearance of the target material having the adapter to confirm whether the straightness of the target material having the adapter is within a predetermined range.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: June 2, 2020
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Mizuki Shiraishi, Takuto Sugawara, Koji Nishioka, Masahiro Fujita
  • Publication number: 20200165050
    Abstract: A sputtering target packaging structure comprising: a sputtering target including a cylinder part, a flange part disposed on an opening part at one end of the cylinder part, and a cap disposed on an opening part at the other end of the cylinder part; and a packing material made up of a sheet and covering an inner surface and an outer surface of the sputtering target in a close contact state, wherein the packing material includes seal parts on both end sides of the sputtering target.
    Type: Application
    Filed: November 25, 2019
    Publication date: May 28, 2020
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Koji NISHIOKA, Naoya SATOH
  • Patent number: 10564134
    Abstract: A pseudo defect sample for adjusting an ultrasonic flaw detection measurement condition to inspect a defect within a target material, the pseudo defect sample comprising a substrate which has a first surface and a second surface opposed to the first surface, the substrate having a counterbore which is formed therein from a side of the first surface to a first depth, and a flat-bottomed hole which is formed from the bottom surface of the counterbore to a second depth and formed in a part of a bottom surface of the counterbore, and a ratio ?/d of an equivalent circle diameter ? of the flat-bottomed hole to the second depth d of the flat-bottomed hole being: 0.08 or more and less than 0.40 when the equivalent circle diameter ? of the flat-bottomed hole is less than 0.3 mm; 0.1 or more and less than 0.60 when the equivalent circle diameter ? of the flat-bottomed hole is 0.3 mm or more and less than 0.4 mm; and 0.11 or more and less than 1.60 when the equivalent circle diameter ? of the flat-bottomed hole is 0.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: February 18, 2020
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Hiroaki Sugawara, Koji Nishioka
  • Publication number: 20190351491
    Abstract: A method for machining a sputtering target that includes a sputtering surface, an opposing surface opposite to the sputtering surface, and an outer peripheral surface being between the sputtering surface and the opposing surface comprises the steps of: fixing the sputtering target on a fixing table by mounting the sputtering surface or the opposing surface of the sputtering target on the fixing table; and cutting the outer peripheral surface of the sputtering target by a cutting tool while rotating the cutting tool along a circumferential direction of the outer peripheral surface of the sputtering target.
    Type: Application
    Filed: February 9, 2018
    Publication date: November 21, 2019
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masahiro FUJITA, Koji NISHIOKA
  • Patent number: 10408477
    Abstract: An air conditioning apparatus includes a refrigerant circuit in which a compressor for compressing heat source-side refrigerant, a first refrigerant channel switching device, a heat source side heat exchanger, an expansion device, and intermediate heat exchangers for performing heat exchange between the heat source-side refrigerant and a heat medium different from the heat source-side refrigerant are connected by pipes. Also, the air conditioning apparatus includes a heat medium circuit in which pumps for circulating the heat medium to be used for the heat exchange performed by the intermediate heat exchangers, a use-side heat exchanger, and channel switching devices for switching passages of the heat medium heated or cooled to the use-side heat exchanger are connected by pipes.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: September 10, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Daisuke Shimamoto, Yuji Motomura, Osamu Morimoto, Takayoshi Honda, Koji Nishioka, Tatsuo Ono
  • Publication number: 20190265201
    Abstract: A pseudo defect sample for adjusting an ultrasonic flaw detection measurement condition to inspect a defect within a target material, the pseudo defect sample comprising a substrate which has a first surface and a second surface opposed to the first surface, the substrate having a counterbore which is formed therein from a side of the first surface to a first depth, and a flat-bottomed hole which is formed from the bottom surface of the counterbore to a second depth and formed in a part of a bottom surface of the counterbore, and a ratio ?/d of an equivalent circle diameter ? of the flat-bottomed hole to the second depth d of the flat-bottomed hole being: 0.08 or more and less than 0.40 when the equivalent circle diameter ? of the flat-bottomed hole is less than 0.3 mm; 0.1 or more and less than 0.60 when the equivalent circle diameter ? of the flat-bottomed hole is 0.3 mm or more and less than 0.4 mm; and 0.11 or more and less than 1.60 when the equivalent circle diameter ? of the flat-bottomed hole is 0.
    Type: Application
    Filed: January 18, 2018
    Publication date: August 29, 2019
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Hiroaki SUGAWARA, Koji NISHIOKA
  • Patent number: 10359207
    Abstract: When starting a cooling operation mode from a non-operating mode, the blower device of the indoor unit from which the start command is originated is operated. When starting a heating operation mode from a non-operating mode, the blower device of the indoor unit from which the start command is originated is operated after the heat medium temperature becomes equal to or greater than a preconfigured temperature.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: July 23, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yuji Motomura, Daisuke Shimamoto, Takayoshi Honda, Osamu Morimoto, Koji Nishioka, Tatsuo Ono
  • Publication number: 20190041183
    Abstract: To provide a process for producing a cylindrical target which has almost no distortion in the longitudinal direction. The process for producing a cylindrical target according to the present invention comprises the steps of: processing a target material into a cylindrical shape; providing an adapter for attachment to a sputtering apparatus, in the target material processed into the cylindrical shape; and measuring a straightness in a longitudinal direction of an appearance of the target material having the adapter to confirm whether the straightness of the target material having the adapter is within a predetermined range.
    Type: Application
    Filed: February 2, 2017
    Publication date: February 7, 2019
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Mizuki SHIRAISHI, Takuto SUGAWARA, Koji NISHIOKA, Masahiro FUJITA
  • Patent number: 10018390
    Abstract: An air-conditioning apparatus includes actuation control means including an actuation unit that sequentially opens heat medium flow switching devices or heat medium flow control devices on a one-by-one basis. The actuation control means performs control in such a manner that start time of driving of pumps is later than start of actuation of the heat medium flow switching devices and the heat medium flow control devices.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: July 10, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Daisuke Shimamoto, Yuji Motomura, Osamu Morimoto, Takayoshi Honda, Tatsuo Ono, Koji Nishioka