Patents by Inventor Koji Nitta
Koji Nitta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240121898Abstract: A flexible printed circuit board according to an embodiment includes a base film and a first wire. The base film has a first surface. The first wire is disposed on the first surface. The first wire has a first layer and a second layer. The first layer is disposed on the first surface directly or indirectly. The second layer covers the first layer. In the first surface, a first groove is formed next to the first layer in a plan view. The second layer on a side surface of the first layer exists on a bottom surface and a side surface of the first groove.Type: ApplicationFiled: May 27, 2022Publication date: April 11, 2024Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Yosuke FUKAYA, Koji NITTA, Daisuke SATO
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Patent number: 11950365Abstract: A flexible printed circuit board includes: a base film having a hole for forming a through hole; and a coil-shaped wiring layer layered on at least one surface side of the base film, wherein the wiring layer includes a land portion arranged at an inner peripheral surface of the hole and at a peripheral portion of the hole of the base film, and a winding portion arranged in a spiral shape with the land portion as an inside end portion or an outside end portion, wherein the winding portion includes a first winding portion that is an outermost circumference and a second winding portion that is inside relative to the outermost circumference, and wherein a ratio of an average thickness of the land portion to an average thickness of the second winding portion is 1.1 or more and 5 or less.Type: GrantFiled: December 16, 2020Date of Patent: April 2, 2024Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Shoichiro Sakai, Koji Nitta, Yoshio Oka, Junichi Motomura, Masanao Yamashita
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Publication number: 20240096537Abstract: A printed wiring board includes a base film having a main surface, a coil wiring formed on the main surface, and a first connection land and a second connection land connected to one end and another end of the coil wiring, respectively. The main surface includes a first main surface and a second main surface opposite to the first main surface. The coil wiring includes a first coil wiring formed in a spiral shape on the first main surface, and a second coil wiring formed in a spiral shape on the second main surface and electrically connected to the first coil wiring. The first connection land and the second connection land are formed on the second main surface. The number of turns of the first coil wiring is more than the number of turns of the second coil wiring.Type: ApplicationFiled: August 17, 2022Publication date: March 21, 2024Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Yukie TSUDA, Koji NITTA, Kou NOGUCHI
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Patent number: 11889624Abstract: A flexible printed circuit board includes a base film having an insulating property, and one or more interconnects laminated to at least one surface side of the base film. At least one of the one or more interconnects includes, in a longitudinal direction, a first portion and a second portion that is a portion other than the first portion, an average thickness of the second portion being greater than an average thickness of the first portion. A ratio of the average thickness of the second portion to the average thickness of the first portion is greater than or equal to 1.5 and less than or equal to 50.Type: GrantFiled: December 18, 2020Date of Patent: January 30, 2024Assignees: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Yoshio Oka, Koji Nitta, Shoichiro Sakai, Yasushi Mochida, Tadahiro Kaibuki, Junichi Okaue
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Patent number: 11877397Abstract: The printed circuit board includes, a first conductive layer including copper foil, an insulating base layer, and a second conductive layer including copper foil in this order, and includes a via-hole laminate that is stacked on an inner circumference and a bottom of a connection hole extending through the first conductive layer and the base layer in a thickness direction. The via-hole laminate has an electroless copper plating layer stacked on the connection hole and an electrolytic copper plating layer stacked on the electroless copper plating layer. The copper foil has copper crystal grains oriented in a (100) plane orientation, and an average crystal grain size of copper of 10 ?m or more. The electroless copper plating layer includes palladium and tin, and an amount of the palladium stacked per unit area of a surface of the copper foil is 0.18 ?g/cm2 or more and 0.40 ?g/cm2 or less.Type: GrantFiled: May 15, 2020Date of Patent: January 16, 2024Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Junichi Motomura, Koji Nitta, Shoichiro Sakai, Mari Sogabe, Mitsutaka Tsubokura, Akira Tsuchiko, Masashi Iwamoto
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Publication number: 20240008175Abstract: A printed wiring board includes a base film having a first surface and a second surface opposite to the first surface, a first electrically conductive pattern existing on the first surface, and a first electrically insulating layer existing on the first surface so as to cover the first electrically conductive pattern. A plurality of first voids exist in the first electrically insulating layer.Type: ApplicationFiled: June 7, 2022Publication date: January 4, 2024Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Yoshio OKA, Koji NITTA, Shoichiro SAKAI
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Patent number: 11852788Abstract: There is provided an imaging lens with excellent optical characteristics which satisfies demand of a low profile and a low F-number. An imaging lens comprises in order from an object side to an image side, a first lens with negative refractive power having an object-side surface being convex in a paraxial region, a second lens with positive refractive power in a paraxial region, a third lens with the negative refractive power in a paraxial region, a fourth lens with the positive refractive power in a paraxial region, a fifth lens having a flat object-side surface and a flat image-side surface that are aspheric, and a sixth lens with the negative refractive power having an image-side surface being concave in a paraxial region.Type: GrantFiled: June 8, 2020Date of Patent: December 26, 2023Assignee: TOKYO VISIONARY OPTICS CO., LTD.Inventors: Koji Nitta, Masaya Hashimoto
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Patent number: 11812546Abstract: A high-frequency circuit includes a first dielectric layer, a circuit layer, a second dielectric layer arranged in this order, the circuit layer includes a transmission line of a high-frequency signal and a ground pattern disposed around the transmission line. An electromagnetic wave shield is disposed in the first dielectric layer and the second dielectric layer around the transmission line. The electromagnetic wave shield includes a first ground electric conductor formed on an inner surface of at least one first hole formed to extend through the first dielectric layer without extending through the ground pattern, and a second ground electric conductor formed on an inner surface of at least one second hole formed to extend through the second dielectric layer without extending through the ground pattern. The first ground electric conductor and the second ground electric conductor are each electrically connected to the ground pattern.Type: GrantFiled: May 10, 2021Date of Patent: November 7, 2023Assignees: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Koji Nitta, Takafumi Uemiya, Suguru Yamagishi, Shigeki Shimada, Hiroshi Ueda, Satoshi Kiya
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Patent number: 11740436Abstract: There is provided an imaging lens with high resolution which satisfies in well balance wide field of view, low-profileness and low F-number and properly corrects aberrations. An imaging lens comprises a first lens having negative refractive power, a second lens having the negative refractive power, a third lens, a fourth lens having the negative refractive power and a convex surface facing the image side near an optical axis, a fifth lens having at least one aspheric surface, and a sixth lens being double-sided aspheric lens and having a concave surface facing the image side near the optical axis, wherein the image-side surface of the sixth lens is an aspheric surface changing to the convex surface at a peripheral area.Type: GrantFiled: October 1, 2020Date of Patent: August 29, 2023Assignee: TOKYO VISIONARY OPTICS CO., LTD.Inventor: Koji Nitta
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Publication number: 20230247763Abstract: A flexible printed circuit board includes a base film having an insulating property and a plurality of interconnects laminated to at least one surface side of the base film. The plurality of interconnects includes a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect being greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50. The first interconnect includes a first conductive underlayer and a first plating layer, and the second interconnect includes a second conductive underlayer, a second plating layer, and a third plating layer.Type: ApplicationFiled: April 10, 2023Publication date: August 3, 2023Inventors: Koji NITTA, Yasushi MOCHIDA, Yoshio OKA, Shoichiro SAKAI, Tadahiro KAIBUKI, Junichi OKAUE
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Publication number: 20230232540Abstract: In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1) : where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.Type: ApplicationFiled: November 16, 2021Publication date: July 20, 2023Inventors: Shoichiro SAKAI, Ryuta OHSUKA, Koji NITTA, Yoshihito YAMAGUCHI, Masaharu YASUDA, Akira TSUCHIKO, Koji KASUYA, Kenji NISHIE, Yu FUKUI
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Publication number: 20230212757Abstract: A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.Type: ApplicationFiled: November 16, 2021Publication date: July 6, 2023Inventors: Ryuta OHSUKA, Koji NITTA, Shoichiro SAKAI, Yoshihito YAMAGUCHI, Masaharu YASUDA, Akira TSUCHIKO, Koji KASUYA, Kenji NISHIE, Yu FUKUI
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Patent number: 11696401Abstract: A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.Type: GrantFiled: December 18, 2020Date of Patent: July 4, 2023Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Koji Nitta, Yasushi Mochida, Yoshio Oka, Shoichiro Sakai, Tadahiro Kaibuki, Junichi Okaue
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Patent number: 11675162Abstract: There is provided an imaging lens with high resolution which satisfies in well balance the low-profileness and the low F-number and properly corrects aberrations. An imaging lens comprises a first lens having positive refractive power, a second lens having the positive refractive power, a third lens, a fourth lens, a fifth lens being a double-sided aspheric lens, and a sixth lens being double-sided aspheric lens and having a concave surface facing the image side near the optical axis, wherein the image-side surface of the sixth lens is an aspheric surface changing to the convex surface at a peripheral area.Type: GrantFiled: June 8, 2020Date of Patent: June 13, 2023Assignee: TOKYO VISIONARY OPTICS CO., LTD.Inventors: Koji Nitta, Yukio Sekine, Masaya Hashimoto
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Patent number: 11668901Abstract: There is provided an imaging lens with high resolution which satisfies in well balance the low-profileness and the low F-number and properly corrects aberrations. An imaging lens comprises a first lens having positive refractive power, a second lens having the positive refractive power, a third lens, a fourth lens, a fifth lens being a double-sided aspheric lens, and a sixth lens being double-sided aspheric lens and having a concave surface facing the image side near the optical axis, wherein the image-side surface of the sixth lens is an aspheric surface changing to the convex surface at a peripheral area.Type: GrantFiled: June 8, 2020Date of Patent: June 6, 2023Assignee: TOKYO VISIONARY OPTICS CO., LTDInventors: Koji Nitta, Yukio Sekine, Masaya Hashimoto
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Patent number: 11672082Abstract: A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.Type: GrantFiled: April 11, 2022Date of Patent: June 6, 2023Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Junichi Motomura, Koji Nitta, Shoichiro Sakai, Kenji Takahashi, Maki Ikebe, Kousuke Miura, Masahiro Itoh
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Patent number: 11659662Abstract: A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.Type: GrantFiled: December 18, 2020Date of Patent: May 23, 2023Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Koji Nitta, Yasushi Mochida, Yoshio Oka, Shoichiro Sakai, Tadahiro Kaibuki, Junichi Okaue
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Patent number: 11657944Abstract: A flexible printed circuit board according to the present disclosures includes a base film having an insulating property, and a planar coil disposed on a surface of the base film, wherein a number of turns on an inside of a center point of a coil width of the planar coil in a plan view is greater than a number of turns on an outside of the center point.Type: GrantFiled: March 24, 2021Date of Patent: May 23, 2023Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Yukie Tsuda, Yuichi Nakamura, Masanao Yamashita, Koji Nitta, Kou Noguchi
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Patent number: 11619805Abstract: The present disclosure relates to the field of optical lenses and provides a camera optical lens. The camera optical lens sequentially includes, from an object side to an image side: a first lens having a positive refractive power; a second lens having a negative refractive power; a third lens having a negative refractive power; a fourth lens having a positive refractive power; a fifth lens having a positive refractive power; and a sixth lens having a negative refractive power. The camera optical lens satisfies following conditions: 1.00?(v2+v4)/v3?1.90; 9.00?f3/f2?15.00; and 8.00?f4/f5?30.00, where v2, v3 and v4 denote abbe numbers of the second, third and fourth lenses, respectively; and f2, f3, f4 and f5 denote focal lengths of the second, third, fourth and fifth lenses, respectively. The camera optical lens according to the present disclosure can achieve high optical performance while satisfying design requirements for ultra-thin, wide-angle lenses having large apertures.Type: GrantFiled: September 1, 2020Date of Patent: April 4, 2023Assignee: AAC Optics Solutions Pte. Ltd.Inventors: Koji Nitta, Lei Zhang, Yuanshan Cui
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Publication number: 20230078709Abstract: An object of the present invention is to provide a liquid crystal polymer film having an excellent peel strength of a laminate produced by sticking a metal foil to the liquid crystal polymer film; and a laminate. A liquid crystal polymer film including a liquid crystal polymer, in which in a case where a cross-section of the liquid crystal polymer film along a thickness direction of the liquid crystal polymer film is exposed and immersed in monomethylamine, and then void regions are extracted from an observed image of a cross-section obtained by using an electron microscope, an average value of widths of the void regions is 0.01 to 0.1 ?m and an area ratio of the void regions in the observed image of the cross-section is 20% or less.Type: ApplicationFiled: July 18, 2022Publication date: March 16, 2023Applicant: FUJIFILM CorporationInventors: Akira YAMADA, Koji NITTA