Abstract: A process for producing a flat glass, which comprises withdrawing a glass ribbon substantially horizontally from the surface of a molten metal bath while maintaining the level of the surface of the molten metal at a level higher than an end wall at the outlet of the bath from which the glass ribbon is withdrawn and preventing the overflow of the molten metal from the end wall by means of a force induced by a linear induction motor, wherein side walls at the outlet of the bath are made of an electroconductive material thereby to prevent a drop of the induced force in the vicinity of the side walls.

Abstract: A difficultly solderable metal of iron, nickel, copper or an alloy thereof having an oxide surface is soldered by dipping in a bath of a molten solder alloy consisting essentially of 15 to 98% by weight of Zn, 85 to 2% by weight of Sn, 0.01 to 0.5% by weight of Al and 0 to 5% by weight of Ag to which ultrasonic vibration is applied. The bath structure comprises a vessel, a tip element for imparting ultrasonic vibration and a block member for concentrating the ultrasonic vibration. Said element and member being fabricated of a metal selected from the group consisting of tantalum, niobium, molybdenum, tungsten and an alloy thereof having at least one of these metals as the main component.

Abstract: Difficultly solderable materials having oxide surfaces such as glass, ceramics or metals such as Si, Ge, Al, Ti, Zr or Ta are soldered at a temperature lower than about 180.degree. C with a solder alloy composed of 2 - 98% by wt Pb, 1 - 97.5% by wt Sn, 0.5 - 60% Cd and 0.05 - 10% by wt Zn with the simultaneous application of vibration, preferably ultrasonic vibration.

Abstract: A humidity sensor comprising a pair of spaced electrodes on an insulating substrate is formed by coating an orthophosphate as a sensitive membrane over at least a portion of the gap between the electrodes.

Abstract: A difficulty solderable metal of iron, nickel, copper or an alloy thereof having an oxide surface is soldered by dipping in a bath of a molten solder alloy consisting essentially of 15 to 98% by weight of Zn, 85 to 2% by weight of Sn, 0.01 to 0.5% by weight of Al and 0 to 5% by weight of Ag to which ultrasonic vibration is applied.