Abstract: The invention of the present application is a laminate in which thermoplastic polyurethane is used, excellent antifouling and adhesion properties are obtained, and glue residue is minimized. The laminate is provided with a substrate film formed from thermoplastic polyurethane, and an adhesive layer formed on one surface side of the substrate film. The substrate film has a surface layer on the opposite side of the first surface, a mixture of the thermoplastic polyurethane and a curable resin composition being present in the surface layer. The content ratio of the curable resin composition is configured so as to gradually decrease from the surface of the surface layer towards the interior of the substrate film. The curable resin composition contains at least one fluorine compound selected from the group consisting of fluorosilsesquioxane and fluorosilsesquioxane polymers, and a curable resin. The adhesive layer has a surface roughness of 350-750 nm.

Abstract: The transfer film for in-mold molding of the invention has transfer layer 11 being a transfer layer to be transferred onto a transfer object in in-mold molding and cured by irradiation with an active energy ray after being transferred; and film-like base L0. Transfer layer 11 has topcoat layer L2 laminated on base L0 to be arranged on a surface of a molded product after in-mold molding; and conductor layer L4 laminated on a side opposite to a base L0 side of topcoat layer L2, and laminated on topcoat layer L2. Topcoat layer L2 is composed of a mixed composition containing an active energy ray-curable resin and a thermosetting resin, and conductor layer L4 is formed of at least one kind selected from the group of a flexible metal, carbon and conductive polymer.

Abstract: A compound capable of increasing the scratch resistance of, for instance, a hard-coat agent and a resin composition for a coating agent containing the compound are shown. The resin composition for a coating agent of the present application contains: a silicon compound (a) represented by formula (I) of the specification; and a curable resin (b). In formula (I), R1 is a C3 or C4 alkylene group, and X is a group represented by formula (II) of the specification having a urethane skeleton and having a (meth)acryloyl group at an end. In formula (II), R2 is hydrogen or a methyl group, and n is an integer of 0 or 1. The molecular weight of the silicon compound (a) is 500 to 699.

Abstract: Provided is a film for plastic restoration with which transparency of plastic having reduced transparency can be easily recovered. The film for plastic restoration has base material film formed of thermoplastic polyurethane; and adhesive layer formed on a first surface side of base material film. Adhesive layer is composed of at least one resin selected from an acrylic resin, a urethane-based resin, a rubber-based resin and a silicone-based resin. A refractive index of adhesive layer is 1.40 to 1.70. Surface roughness of adhesive layer is 350 to 750 nanometers.

Abstract: A laminate body (1) is provided with a transparent substrate (10) and a refractive layer (11) which refracts incident light towards the top of the substrate (10). The refractive layer (11) contains, at least, one kind of fluorine compound (ss) selected from a group consisting of fluoro-silsesquioxane and fluoro-silsesquioxane polymers, and a resin (pl) having a refractive index higher than that of the aforementioned fluorine compound (ss). Of the side of the substrate (10) (the side of the back surface s2) and the side opposite thereof (the side of the front surface s1), the concentration of the fluorine compound (ss) in the refractive layer (11) is higher on said side opposite (the side of the front surface s1), and the refractive layer (11) forms a graded structure layer of high refractive indices and low refractive indices inside the layer.

Abstract: Provided is a transparent conductive film having multilayer structure, and inconspicuous pattern shape and good visibility. The film includes: transparent base 11 formed of film-like polymer resin; first hard coat layer 12 laminated on the base 11; first transparent dielectric layer 13 laminated as required on the layer 12; and first transparent conductive layer 14 laminated on the layer 13. The base 11 has a film thickness of 2 to 250 micrometers. The layer 12 is formed of hardening resin containing inorganic oxide, with refractive index: 1.40 to 1.90 and film thickness: 0.5 to 6 micrometers. The layer 13 is formed of inorganic substance, with refractive index: 1.30 to 1.50 and film thickness: 10 to 50 nanometers. The layer 14 is formed of at least one kind of inorganic oxide, metal and carbon, and patterned, and has a film thickness of 10 nanometers to 2 micrometers.

Abstract: The transparent electroconductive film is provided with: a transparent substrate formed from a film-shaped polymer resin; a first hard coat layer laminated on one surface of the substrate; and a first transparent conductor layer laminated on the upper side of the first hard coating layer. The substrate has a film thickness of 2 to 250 ?m. The first hard coating layer is formed from a curable resin containing an inorganic oxide, and has a film thickness of 0.01 ?m to less than 0.5 ?m, or more than 6 ?m to 10 ?m. The first transparent conductor layer is formed from at least one material selected from the group consisting of an inorganic oxide, a metal, and carbon, has a film thickness of 10 nm to 2 ?m, and is patterned so as to have formed thereon a patterned section and a non-patterned section.

Abstract: Provided is a multi-layered weather-resistant multilayer film that exhibits good substrate adhesion, wherein curing problems are avoided, bleed-out is minimized, yellowing is reduced, and weather-resistance is improved. The weather-resistant multilayer film 10 is provided with the following: a transparent film-like substrate C; a UV-absorbing resin layer B laminated on the substrate C and containing a UV absorber; and a first cured resin layer A laminated on the UV-absorbing resin layer B. The first cured resin layer A has a thickness of 1.0 to 10 ?m. The UV-absorbing resin layer B has a thickness of 0.5 to 5 ?m. The UV-absorbing resin layer B has an absorption wavelength of 200 to 500 nm.

Abstract: The invention of the present application is a laminate in which thermoplastic polyurethane is used, excellent antifouling and adhesion properties are obtained, and glue residue is minimized. The laminate is provided with a substrate film formed from thermoplastic polyurethane, and an adhesive layer formed on one surface side of the substrate film. The substrate film has a surface layer on the opposite side of the first surface, a mixture of the thermoplastic polyurethane and a curable resin composition being present in the surface layer. The content ratio of the curable resin composition is configured so as to gradually decrease from the surface of the surface layer towards the interior of the substrate film. The curable resin composition contains at least one fluorine compound selected from the group consisting of fluorosilsesquioxane and fluorosilsesquioxane polymers, and a curable resin. The adhesive layer has a surface roughness of 350-750 nm.

Abstract: A compound capable of increasing the scratch resistance of, for instance, a hard-coat agent and a resin composition for a coating agent containing the compound are shown. The resin composition for a coating agent of the present application contains: a silicon compound (a) represented by formula (I) of the specification; and a curable resin (b). In formula (I), R1 is a C3 or C4 alkylene group, and X is a group represented by formula (II) of the specification having a urethane skeleton and having a (meth)acryloyl group at an end. In formula (II), R2 is hydrogen or a methyl group, and n is an integer of 0 or 1. The molecular weight of the silicon compound (a) is 500 to 699.

Abstract: A compound capable of increasing the scratch resistance of, for instance, a hard-coat agent and a resin composition for a coating agent containing the compound are shown. The silicon compound of the present application is a silicon compound (a) represented by formula (I), R1 is a C3 or C4 alkylene group, X is a group selected from the group consisting of formula (II) to formula (III) of the specification, n is an integer of 0 or 1, Y is a group having a (meth)acrylate group selected from the group consisting of formula (IV) to formula (VI) of the specification, and R2 is hydrogen or a methyl group. If the silicon compound (a) and a cured resin are used together, then scratch resistance thought to be obtained from stress relief can be significantly increased.

Abstract: Provided is a transfer film for in-mold molding which is superior in solvent resistance, heat resistance, durability, blocking resistance, and moldability, and is capable of suppressing the generation of gate flow, and also provided is a method for producing such a film. The film is provided with: a transfer layer (11) which is to be transferred to an in-mold molded body and which is to be cured when irradiated with active energy rays after the transfer; and a film shaped substrate (L0). The transfer layer (11) comprises an IMD layer (L2) laminated on the substrate (L0) and to be arranged on the outermost surface of the molded body after the in-mold molding. The IMD layer (L2) is constituted by a mixture composition containing at least one active-energy curable resin and at least one thermosetting resin.

Abstract: The transfer film for in-mold molding of the invention has transfer layer 11 being a transfer layer to be transferred onto a transfer object in in-mold molding and cured by irradiation with an active energy ray after being transferred; and film-like base L0. Transfer layer 11 has topcoat layer L2 laminated on base L0 to be arranged on a surface of a molded product after in-mold molding; and conductor layer L4 laminated on a side opposite to a base L0 side of topcoat layer L2, and laminated on topcoat layer L2. Topcoat layer L2 is composed of a mixed composition containing an active energy ray-curable resin and a thermosetting resin, and conductor layer L4 is formed of at least one kind selected from the group of a flexible metal, carbon and conductive polymer.

Abstract: The transparent electroconductive film is provided with: a transparent substrate formed from a film-shaped polymer resin; a first hard coat layer laminated on one surface of the substrate; and a first transparent conductor layer laminated on the upper side of the first hard coating layer. The substrate has a film thickness of 2 to 250 ?m. The first hard coating layer is formed from a curable resin containing an inorganic oxide, and has a film thickness of 0.01 ?m to less than 0.5 ?m, or more than 6 ?m to 10 ?m. The first transparent conductor layer is formed from at least one material selected from the group consisting of an inorganic oxide, a metal, and carbon, has a film thickness of 10 nm to 2 ?m, and is patterned so as to have formed thereon a patterned section and a non-patterned section.

Abstract: The curable resin composition of the present invention contains inorganic particles and a curable resin. The inorganic particles includes an inorganic particle (a-1) having a Mohs hardness of 7 or more and an average particle diameter of 1 ?m or less, an inorganic particle (a-2) having a Mohs hardness of 4 or more to less than 7 and an average particle diameter of 1 ?m or less, and an inorganic particle (a-3) having a Mohs hardness of less than 4 and an average particle diameter of 1 ?m or less. The curable resin is at least one selected from a group consisting of a thermosetting resin and an active energy ray-curable resin.

Abstract: Provided is a multi-layered weather-resistant multilayer film that exhibits good substrate adhesion, wherein curing problems are avoided, bleed-out is minimized, yellowing is reduced, and weather-resistance is improved. The weather-resistant multilayer film 10 is provided with the following: a transparent film-like substrate C; a UV-absorbing resin layer B laminated on the substrate C and containing a UV absorber; and a first cured resin layer A laminated on the UV-absorbing resin layer B. The first cured resin layer A has a thickness of 1.0 to 10 ?m. The UV-absorbing resin layer B has a thickness of 0.5 to 5 ?m. The UV-absorbing resin layer B has an absorption wavelength of 200 to 500 nm.

Abstract: Provided is a transfer film for in-mold molding which is superior in solvent resistance, heat resistance, durability, blocking resistance, and moldability, and is capable of suppressing the generation of gate flow, and also provided is a method for producing such a film. The film is provided with: a transfer layer (11) which is to be transferred to an in-mold molded body and which is to be cured when irradiated with active energy rays after the transfer; and a film shaped substrate (L0). The transfer layer (11) comprises an IMD layer (L2) laminated on the substrate (L0) and to be arranged on the outermost surface of the molded body after the in-mold molding. The TMD layer (L2) is constituted by a mixture composition containing at least one active-energy curable resin and at least one thermosetting resin.

Abstract: A laminate body (1) is provided with a transparent substrate (10) and a refractive layer (11) which refracts incident light towards the top of the substrate (10). The refractive layer (11) contains, at least, one kind of fluorine compound (ss) selected from a group consisting of fluoro-silsesquioxane and fluoro-silsesquioxane polymers, and a resin (pl) having a refractive index higher than that of the aforementioned fluorine compound (ss). Of the side of the substrate (10) (the side of the back surface s2) and the side opposite thereof (the side of the front surface s1), the concentration of the fluorine compound (ss) in the refractive layer (11) is higher on said side opposite (the side of the front surface s1), and the refractive layer (11) foams a graded structure layer of high refractive indices and low refractive indices inside the layer.

Abstract: A polymer and a treating agent (such as a surface-treating agent) are provided that have excellent characteristics in such properties as water repellency, oil repellency, antifouling property and charge controlling property. The polymer contains a structural unit derived from fluorosilsesquioxane having an addition polymerizable group, or contains a structural unit derived from fluorosilsesquioxane having an addition polymerizable group and a structural unit derived from organopolysiloxane having an addition polymerizable group. The treating agent contains the polymer. An article treated with the treating agent is also provided.

Abstract: Provided is a transparent conductive film having multilayer structure, and inconspicuous pattern shape and good visibility. The film includes: transparent base 11 formed of film-like polymer resin; first hard coat layer 12 laminated on the base 11; first transparent dielectric layer 13 laminated as required on the layer 12; and first transparent conductive layer 14 laminated on the layer 13. The base 11 has a film thickness of 2 to 250 micrometers. The layer 12 is formed of hardening resin containing inorganic oxide, with refractive index: 1.40 to 1.90 and film thickness: 0.5 to 6 micrometers. The layer 13 is formed of inorganic substance, with refractive index: 1.30 to 1.50 and film thickness: 10 to 50 nanometers. The layer 14 is formed of at least one kind of inorganic oxide, metal and carbon, and patterned, and has a film thickness of 10 nanometers to 2 micrometers.