Patents by Inventor Koji Orikawa

Koji Orikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250007404
    Abstract: A DC power distribution system includes a DC bus that distributes DC power, a first power converter, and a voltage stabilizer. The first power converter is connected between the DC bus and a load, and converts DC power from the DC bus into electric power required by the load. The voltage stabilizer is connected to the DC bus in parallel with the first power converter. The voltage stabilizer supplies electric power to the DC bus, the electric power corresponding to fluctuation of an input voltage input from the DC bus to the first power converter and corresponding to DC power supplied from the DC bus to the first power converter.
    Type: Application
    Filed: August 26, 2022
    Publication date: January 2, 2025
    Applicant: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
    Inventors: Yushin YAMAMOTO, Satoshi OGASAWARA, Koji ORIKAWA, Sosuke SUZUKI
  • Publication number: 20240047116
    Abstract: A printed board coil forms a coil with a plurality of turns, each formed by stacking a first layer having a first winding pattern and a second layer having a second winding pattern while having an insulation layer intervening therebetween. The first layers and the second layers are used for forming each of the coils. The coils are stacked having each of the insulation layers intervening between the coils by arranging the first layer and the second layer alternately in the stacking direction of the respective layers. The coils are connected in parallel to one another.
    Type: Application
    Filed: May 31, 2023
    Publication date: February 8, 2024
    Inventors: Yuki KAWAGUCHI, Hiroyuki SHOJI, Koji ORIKAWA, Satoshi OGASAWARA, Naoki MURAKAMI
  • Publication number: 20220285077
    Abstract: Variation in inductance is reduced with a secondary-side coil substrate on which a plurality of wiring layers are superimposedly disposed, and a plurality of coils provided in the secondary-side coil substrate. On the wiring layer, coil patterns corresponding to parts of one circumferences of the coils are formed. On the wiring layer, coil patterns corresponding to remaining parts of the one circumferences of the coils are formed. The coil patterns, and the coil patterns that are provided on the different wiring layers are connected to each other via conduction points in a superimposition direction of the wiring layers, and the one circumferences of the respective coils are formed.
    Type: Application
    Filed: June 9, 2020
    Publication date: September 8, 2022
    Inventors: Satoshi Ogasawara, Koji Orikawa, Hirohito Funato, Junnosuke Haruna, Fumihiro Okazaki