Abstract: A substrate system of the kind having a buffer region interposed between a silicon substrate proper and a nitride semiconductor region in order to make up for a difference in linear expansion coefficient therebetween. Electrodes are formed on the nitride semiconductor layer or layers in order to provide HEMTs or MESFETs. The buffer region is a lamination of a multiplicity of buffer layers each comprising a first, a second, and a third buffer sublayer of nitride semiconductors, in that order from the silicon substrate proper toward the nitride semiconductor region. The three sublayers of each buffer layer contain aluminum in varying proportions including zero. The aluminum proportion of the third buffer sublayer is either zero or intermediate that of the first buffer sublayer and that of the second.

Abstract: A dustfree filling and sealing apparatus is disclosed. A pair of wrapping clean films 10 which are free of cleaning are supplied from a pair of wrapping clean film supply means 1. Two outer layer films 10b are peeled off and removed from the wrapping clean films 10 by a pair of outer layer film peeling-off means 2. Thus, clean surfaces of inner layer films 10a appear. The two inner layer films 10a are conveyed by a pair of inner layer film conveying means 4 so that these films are opposed. An object 15 is inserted between the inner layer films 10a by an object filling means 5. The inner layer films 10a are sealed by an impulse seal head 6. The present invention also discloses a wrapping clean film producing method and a dustfree container.

Abstract: A method for manufacturing multilayer ceramic electronic components includes the steps of removing organic materials from multilayer ceramic bodies having internal electrodes and ceramic layers, and then sintering the multilayer ceramic bodies. After finishing the removing step, it is preferable that the amount of the remaining organic materials in the multilayer ceramic body is 0.5 to 8.5 weight %, more preferably 1.0 to 5.0 weight %. The removing process may be performed in a neutral, a reductive or inert atmosphere. It is also preferable that the organic materials removing temperature of the internal electrodes are controlled to be higher than that of the ceramic layer.

Abstract: A pouch of the present invention comprises a front and a rear walls and a narrow pouring portion, and at least one wall portion is partially protruded to an outward direction of the pouch to be provided with a bulge portion having a hollow structure at vicinity of the pouring portion. Alternatively, a cut line of the pouring portion is positioned based on a vertex of a vertical angle of an assumed right triangle which is drawn at the pouring portion by the predetermined regulations. A half-cut line as an opening aid may be provided to a position to be opened of the pouch, the half-cut line being formed so as to have a combination of a deep part and a shallow part and/or a combination of a wide part and a narrow part. The bulge portion may be formed by subjecting a preheated resin film to press molding with the use of a die comprising a cavity and a core, and then cooling the thus press-molded resin film while it is held in the die.

Abstract: A dustfree filling and sealing apparatus is disclosed. A pair of wrapping clean films 10 which are free of cleaning are supplied from a pair of wrapping clean film supply means 1. Two outer layer films 10b are peeled off and removed from the wrapping clean films 10 by a pair of outer layer film peeling-off means 2. Thus, clean surfaces of inner layer films 10a appear. The two inner layer films 10a are conveyed by a pair of inner layer film conveying means 4 so that these films are opposed. An object 15 is inserted between the inner layer films 10a by an object filling means 5. The inner layer films 10a are sealed by an impulse seal head 6. The present invention also discloses a wrapping clean film producing method and a dustfree container.

Abstract: An inventive method for fabricating a multilayered ceramic electronic component comprises the steps of: preparing a multilayered ceramic body and abrasive powders into an abrader; abrading the multilayered ceramic body for smoothing edge portions of the multilayered ceramic body; and separating the multilayered ceramic body from the abrasive powders, wherein the abrasive powders are porous and includes fat and oil, in such a way that the abrasive powders allow undesirable wastes produced from the multilayered ceramic body to adhere thereto during the abrading step, thereby resulting in preventing internal or external electrodes of the multilayered ceramic body from being contaminated by the undesirable wastes, and improving the electrical properties of the multilayered ceramic electronic component.

Abstract: A button body of a tack button comprises a back member, a front member, and a backing core fitted securely in a space formed between the two members, the back member has a plurality of projections formed on the side in contact with the core. The projections are formed either directly on the back member or downwardly in a reinforcing groove formed in the member.

Abstract: A catalyst comprising 10 to 30 wt.% of nickel as nickel oxide, 20 to 60 wt.% of calcium as calcium oxide, 10 to 70 wt.% of aluminum as aluminum oxide and containing less than 1 wt.% of silicon dioxide. The catalyst is prepared by using: as the starting material for the nickel component, fine particles of nickel oxide obtained by heating a nickel compound which is decomposed to nickel oxide by heating at a temperature in the range of 400.degree. to 800.degree. C in the presence of oxygen; as the starting material for the calcium component, calcium oxide per se or a calcium compound which is decomposed to calcium oxide by heating and; as the starting material for the aluminum component, alumina cement of a high purity. The catalyst is prepared by mixing and kneading the starting materials with water, molding the same, then keeping the catalyst composition under a highly humid atmosphere at a temperature in the range of 5.degree. to 35.degree.