Patents by Inventor Koji SAGISAWA

Koji SAGISAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transport container automatic clamping mechanism
    Patent number: 11011403
    Abstract: An automatic clamping mechanism capable of automatically securing and releasing a wafer transport container to or from a manufacturing apparatus and having a small height dimension is provided at low cost. A wafer transport container is placed on a container placing table. A semiconductor wafer is loaded into the manufacturing apparatus main body from a wafer loading port while being placed on a container base part of the wafer transport container. An automatic clamping mechanism generates a press force component in a vertical direction at the wafer transport container and secures the wafer transport container to the container placing table by bringing claw parts of a plurality of clamping claws into contact with an inclined contact surface provided on a container lid part of the wafer transport container and pressing the inclined contact surface in a substantially horizontal direction.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: May 18, 2021
    Assignees: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, DESIGN NETWORK CO., LTD.
    Inventors: Shiro Hara, Hitoshi Maekawa, Hiroyuki Nishihara, Koji Sagisawa
  • TRANSPORT CONTAINER AUTOMATIC CLAMPING MECHANISM
    Publication number: 20190164797
    Abstract: An automatic clamping mechanism capable of automatically securing and releasing a wafer transport container to or from a manufacturing apparatus and having a small height dimension is provided at low cost. A wafer transport container is placed on a container placing table. A semiconductor wafer is loaded into the manufacturing apparatus main body from a wafer loading port while being placed on a container base part of the wafer transport container. An automatic clamping mechanism generates a press force component in a vertical direction at the wafer transport container and secures the wafer transport container to the container placing table by bringing claw parts of a plurality of clamping claws into contact with an inclined contact surface provided on a container lid part of the wafer transport container and pressing the inclined contact surface in a substantially horizontal direction.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 30, 2019
    Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, DESIGN NETWORK CO., LTD.
    Inventors: Shiro HARA, Hitoshi MAEKAWA, Hiroyuki NISHIHARA, Koji SAGISAWA