Abstract: In a semiconductor-mounting heat dissipation base plate including: an insulating substrate to which a metal circuit layer for mounting a semiconductor chip thereon is fixed; a heat dissipation base formed from the same metal material as the metal circuit layer at a side opposite to the metal circuit layer across the insulating substrate and fixed to the insulating substrate similar to the metal circuit layer; and a strengthening member provided in the heat dissipation base so as to be separated from the insulating substrate, the sizes of crystal grains of a metal structure at a part of the heat dissipation base or the metal circuit layer are reduced by a crystal size reducing material adhered to a mold, thereby preventing an adverse effect of a columnar crystal structure.

Abstract: A heat-medium flow-path switching device and a heat-medium flow-rate adjusting device are integrated into an integrated heat-medium flow-rate adjusting device. The integrated heat-medium flow-rate adjusting device is configured to perform the heat-medium flow-path switching function and the meat-medium flow-rate adjusting function by driving and controlling a single drive unit. Moreover, the integrated heat-medium flow-path switching device is configured to perform a function of closing flow paths from/to a use-side heat exchanger added to the heat-medium flow-rate adjusting function.

Abstract: An offset calculation circuit comprising a data obtaining unit for sequentially obtaining two-axis or three-axis magnetic detection data as a set of data points of a two-axis coordinate system or a three-axis coordinate system; an offset recording unit for recording offset components of the magnetic detection data as an offset point of the two-axis coordinate system or the three-axis coordinate system; and an offset calculation unit for calculating a first reference line or a first reference plane put between first and second data points among the set of data points, and subsequently moving the offset point recorded in the offset recording unit in a direction toward the first reference line or the first reference plane to calculate a first offset candidate point.

Abstract: A rotational movement detection device includes a rotating member including a through hole passing therethrough from a first surface to a second surface opposite the first surface, the rotating member rotating around the through hole to generate a magnetic field around the rotating member, a rotation angle detection part that detects a rotation angle of the rotating member, a movement detection part that detects a movement along a rotational axis of the rotating member, and a holding part including a guide part and an arrangement part formed integrally therein, the guide part being inserted into the through hole to guide the rotation of the rotating member and to hold the rotating member, the arrangement part having thereon the movement detection part arranged facing a side surface of the rotating member.

Abstract: A crown prosthesis preparing system includes a data generator and a cutting device including a retainer, a cutting mechanism, and a controller. The cutting mechanism includes a first processing tool that cuts a workpiece to form a processed workpiece, a second processing tool that polishes the processed workpiece, a driver detachably holding at least one of the first processing tool and the second processing tool and controlling its position. The controller includes a first control section causing the first processing tool to cut the workpiece retained by the retainer based on three-dimensional data, to form the processed workpiece, and a second control section causing the second processing tool to polish a surface of the processed workpiece retained by the retainer based on the three-dimensional data.

Abstract: A device for inserting n number of the electronic components into n number of housing recess in a carrier tape at once includes an imaging device that images, at an imaging position provided at an upstream side of the insertion position, a portion of the carrier tape that contains the n number of housing recesses; and a processor that determines, on the basis of an image captured by the imaging device, a two-dimensional position of each of the n number of housing recesses contained in the image relative to a reference point in the image, and that causes a two-dimensional position of the insertion position for the n number of the housing recesses that have been imaged by the imaging device to be corrected in accordance with the captured image so as to mitigate positional deviations of the n number of the housing recesses in the tape.

Abstract: A processing target mold is usable to form, by molding, a processing target to be shaved by a shaving device. The processing target includes a hold portion held by the shaving device, a target portion to be formed into a post-shaving item, and a coupling portion coupling the hold portion with the target portion. A main body of the processing target mold includes a bottom member, an outer frame member extending upward from the bottom member, and a protruding member extending upward from a portion of the bottom member that is enclosed by the outer frame member as seen in a plan view. The main body includes an injection space enclosed by the bottom member and the outer frame member. A material is injected into the injection space. The injection space includes a hold space, a target space and a coupling space in which the hold portion, the target portion and the coupling portion are respectively formed by molding.

Abstract: The present invention provides a camshaft capable of suppressing an increase in the number of parts and the number of places to be processed, preventing scratching on a sliding surface that is a part of an outer peripheral surface of an outer shaft and on which an inner cam is rotated, and preventing occurrence of deformation in the entire camshaft after final assembly. A camshaft includes an inner cam that is attached from a radial direction of an outer shaft and that is fixed to an inner shaft with a pin inserted into the inner cam from the radial direction of the outer shaft in a cam surface of the inner cam.

Abstract: A component conveyance disk of a taping apparatus has a plurality of component transport units at an equiangular interval. Each component transport unit is formed of three component transport grooves in a peripheral portion of the component conveyance disk. Width direction centerlines of the respective component transport grooves are parallel to each other, with a portion thereof in a direction along the width direction centerlines opening toward a component storage chamber. Dimensions along the width direction centerlines of the opened portion of the respective component transport grooves are shorter than a length of the component. In addition, the respective component transport grooves have component guides that guide the components into the respective component transport grooves.

Abstract: A control system for controlling a work machine including a working unit including elements and actuators that drives the elements includes: a first hydraulic pump and a second hydraulic pump each of which supplies operating oil to at least one of the actuators; and a control device that calculates a distribution flow rate of operating oil distributed to each of the actuators based on an operating state of the working unit and switches, based on the calculated distribution flow rate, between a first state in which the operating oil supplied from both the first hydraulic pump and the second hydraulic pump is supplied to the actuators and a second state in which the actuator to which the operating oil is supplied from the first hydraulic pump is different from the actuator to which the operating oil is supplied from the second hydraulic pump.

Abstract: A side surface type optical semiconductor device includes a substrate made of an insulating material and having a main surface and a back surface, which face opposite sides to each other in a thickness direction. The substrate includes a first concave portion recessed in the thickness direction and a second concave portion recessed further toward the back surface than the first concave portion, a semiconductor optical element is disposed across the first concave portion and the second concave portion, a hollow portion is formed between the semiconductor optical element and the second concave portion, and the hollow portion is used as a light guide path of the semiconductor optical element.

Abstract: A drive device of a construction machine includes a pump passage connected to a hydraulic pump, first and second supply passages connected to the pump passage, first and second passages connected to the first supply passage, third and fourth passages connected to the second supply passage, a first valve connected to the first and third passages, a second valve connected to the second and fourth passages, a first bucket passage connecting the first passage to a cap-side space of the bucket cylinder through the first valve, a second bucket passage connecting the third passage to a rod-side space of the bucket cylinder through the first valve, a first arm passage connecting the second passage to a rod-side space of an arm cylinder through the second valve, and a second arm passage connecting the fourth passage to a cap-side space of the arm cylinder through the second valve.

Abstract: A molding die includes: a pair of dies, i.e., a first die and a second die respectively having abutting surfaces; a first die part and a second die part respectively having cavity forming portions inside which a cavity is formed, and thick portions provided at both ends of the cavity forming portions, the die parts being detachably fitted to die part attachment grooves provided in the abutting surfaces of the pair of dies; and induction heating coils for heating a surface of the cavity, wherein thicknesses of the cavity forming portions are smaller than thicknesses of the thick portions, and the distance between the induction heating coils and the cavity is smaller than the thicknesses of the thick portions.

Abstract: A side surface type optical semiconductor device includes a substrate made of an insulating material and having a main surface and a back surface, which face opposite sides to each other in a thickness direction. The substrate includes a first concave portion recessed in the thickness direction and a second concave portion recessed further toward the back surface than the first concave portion, a semiconductor optical element is disposed across the first concave portion and the second concave portion, a hollow portion is formed between the semiconductor optical element and the second concave portion, and the hollow portion is used as a light guide path of the semiconductor optical element.

Abstract: A crown prosthesis preparing system includes a data generator and a cutting device including a retainer, a cutting mechanism, and a controller. The cutting mechanism includes a first processing tool that cuts a workpiece to form a processed workpiece, a second processing tool that polishes the processed workpiece, a driver detachably holding at least one of the first processing tool and the second processing tool and controlling its position. The controller includes a first control section causing the first processing tool to cut the workpiece retained by the retainer based on three-dimensional data, to form the processed workpiece, and a second control section causing the second processing tool to polish a surface of the processed workpiece retained by the retainer based on the three-dimensional data.

Abstract: A vehicle seat includes a bladder as an actuator; a pump that is operated to supply air to the bladder; a switch that is operated to operate the pump; and a switching valve that is disposed in an air supply/discharge passage for the air for the bladder, the switching valve being configured to connect the air supply/discharge passage to a discharge port of the pump when the air is supplied to the bladder, and to connect the air supply/discharge passage to an exhaust port when the air is discharged from the bladder. The switching valve is incorporated in the switch, and is configured to receive an operating force applied to the switch, and to supply and discharge the air to and from the bladder in accordance with an operation of the switch.

Abstract: The present disclosure relates to a method for manufacturing the laminated film that is BSPC (Back Side Printable Clear) and has excellent interlayer adhesion. The method involves a first UV curing step and a second UV curing step and the laminated film includes a transparent film layer, a UV curable ink layer, and an adhesive layer. The first UV curing step includes disposing the UV curable ink layer on the transparent film layer and partially curing the UV curable ink layer by performing a first UV irradiation. The second UV curing step includes disposing the adhesive layer on a surface of the UV curable ink layer opposite the transparent film layer, and further curing the UV curable ink layer by performing a second UV irradiation.

Abstract: Product management and/or prompt defect analysis of a semiconductor device may be carried out without reducing the throughput in assembly and testing. Unique identification information is attached to a plurality of substrates (lead frames) used in manufacturing a semiconductor device (QFP) and to a transport unit for transporting a plurality of substrates, respectively. Identification information (rack ID) of the transport unit and identification information (substrate ID) of the substrate stored into the transport unit are associated with each other. The substrate is taken out from the transport unit set to a loader unit of each manufacturing apparatus and supplied to a processing unit, of the apparatus and in storing the substrate, the processing of which is complete, into a transport unit of an unloader unit of the apparatus, an association between identification information of the transport unit and the identification information of the substrate is checked.

Abstract: A hydraulic fluid flowpath includes a first flowpath and a second flowpath. The first flowpath connects a first pump port and a first chamber in a hydraulic cylinder. The second flowpath connects a second pump port and a second chamber in the hydraulic cylinder. The hydraulic fluid flowpath forms a closed circuit between a hydraulic pump and the hydraulic cylinder. A bleed-off flowpath bleeds off a portion of the hydraulic fluid from the second flowpath. A control valve connects the second flowpath to the bleed-off flowpath via a throttle when an operation amount of an operating member for lowering a work implement is less than a predetermined operation amount so that a hydraulic pressure in second flowpath is maintained at less than a relief pressure. The predetermined operation amount is less than or equal to the maximum operation amount for lowering the work implement.