Patents by Inventor Koji Sekine
Koji Sekine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8533943Abstract: A method of manufacturing a multilayer printed circuit board includes preparing a substrate having a first conductor circuit, forming on first circuit formed over substrate a film including cycloolefin resin such that an insulating layer including the resin is formed on substrate and first circuit, forming in insulating layer an opening exposing at least portion of first circuit, forming an electroless plating film covering surface of insulating layer including surface of insulating layer inside opening, forming on electroless film a plating resist layer having pattern exposing selected portions of electroless film, selected portions of electroless film including a second conductor circuit and a portion of electroless film covering opening, and forming an electrolytic plating film covering selected portions of electroless film such that a filled via conductor including an electrolytic material filling space in opening and that first circuit is connected to second circuit via conductor.Type: GrantFiled: March 24, 2009Date of Patent: September 17, 2013Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8093507Abstract: A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.Type: GrantFiled: April 8, 2009Date of Patent: January 10, 2012Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8030577Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: October 4, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8020291Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: September 20, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8018045Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: September 13, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8006377Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: August 30, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 7994433Abstract: A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.Type: GrantFiled: March 24, 2009Date of Patent: August 9, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 7916492Abstract: The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.Type: GrantFiled: July 28, 2000Date of Patent: March 29, 2011Assignee: Ibiden Co., Ltd.Inventors: Hui Zhong, Kenichi Shimada, Yukihiko Toyoda, Motoo Asai, Dongdong Wang, Koji Sekine, Yoshitaka Ono
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Patent number: 7910836Abstract: The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.Type: GrantFiled: August 14, 2007Date of Patent: March 22, 2011Assignee: Ibiden Co. Ltd.Inventors: Hui Zhong, Kenichi Shimada, Yukihiko Toyoda, Motoo Asai, Dongdong Wang, Koji Sekine, Yoshitaka Ono
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Publication number: 20100163288Abstract: The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.Type: ApplicationFiled: January 11, 2010Publication date: July 1, 2010Applicant: IBIDEN CO., LTDInventors: Hui Zhong, Kenichi Shimada, Yukihiko Toyoda, Motoo Asai, Dongdong Wang, Koji Sekine, Yoshitaka Ono
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Publication number: 20090205857Abstract: A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.Type: ApplicationFiled: April 8, 2009Publication date: August 20, 2009Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20090188708Abstract: A method of manufacturing a multilayer printed circuit board including preparing a substrate board having a conductor circuit formed over the substrate board, forming an interlayer resin insulating layer on the conductor circuit formed over the substrate board by press laminating on the conductor circuit a film comprising a cycloolefin resin under vacuum or reduced pressure, and forming a via hole connecting to the conductor circuit through the resin insulating layer, the forming of the via hole including plating the via hole to fill up.Type: ApplicationFiled: March 24, 2009Publication date: July 30, 2009Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20090183904Abstract: A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.Type: ApplicationFiled: March 24, 2009Publication date: July 23, 2009Applicant: IBIDEN CO., LTD.Inventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 7535095Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: September 28, 1999Date of Patent: May 19, 2009Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20090090003Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: ApplicationFiled: June 25, 2008Publication date: April 9, 2009Applicant: IBIDEN CO., LTDInventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 7504719Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: July 26, 2005Date of Patent: March 17, 2009Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20080289176Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: ApplicationFiled: June 25, 2008Publication date: November 27, 2008Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20080292852Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: ApplicationFiled: June 25, 2008Publication date: November 27, 2008Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20080289864Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: ApplicationFiled: June 25, 2008Publication date: November 27, 2008Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20080041615Abstract: The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.Type: ApplicationFiled: August 14, 2007Publication date: February 21, 2008Applicant: IBIDEN CO., LTDInventors: Hui ZHONG, Kenichi Shimada, Yukihiko Toyoda, Motoo Asai, Dongdong Wang, Koji Sekine, Yoshitaka Ono