Patents by Inventor Koji Seno

Koji Seno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7323712
    Abstract: An anisotropically conductive connector, by which positioning, and holding and fixing to a wafer to be inspected can be conducted with ease even when the wafer has a large area, contains a frame plate having a plurality of anisotropically conductive film-arranging holes formed corresponding to regions of electrodes to be inspected of a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes and supported by the inner peripheral edge thereabout.
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: January 29, 2008
    Assignee: JSR Corporation
    Inventors: Terukazu Kokubo, Koji Seno, Masaya Naoi, Kazuo Inoue
  • Publication number: 20070040245
    Abstract: An anisotropically conductive sheet that can surely achieve necessary electrical connection even to an object to be connected, the arrangement pitch of electrodes to be connected of which is extremely small, a production process thereof, and applied products equipped with the anisotropically conductive sheet. The anisotropically conductive sheet according to the present invention has an insulating sheet body formed of an elastic polymeric substance, in which a plurality of through-holes for forming conductive paths, each extending in a thickness-wise direction of the insulating sheet body, have been formed, and conductive path elements integrally provided in the respective through-holes for forming conductive paths of the insulating sheet body.
    Type: Application
    Filed: November 15, 2004
    Publication date: February 22, 2007
    Applicant: JSR Corporation
    Inventors: Koji Seno, Yuichi Haruta
  • Patent number: 7131851
    Abstract: Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: November 7, 2006
    Assignee: JSR Corporation
    Inventors: Ryoji Setaka, Terukazu Kokubo, Koji Seno, Takeo Hara
  • Publication number: 20060177971
    Abstract: Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a circuit device can be conducted with ease even when the pitch of electrodes of the circuit device to be connected is small, and moreover good conductivity can be achieved as to all conductive parts, and insulating property between adjacent conductive parts can be surely achieved, a production process thereof, and applied products thereof.
    Type: Application
    Filed: April 3, 2006
    Publication date: August 10, 2006
    Applicant: JSR Corporation
    Inventors: Terukazu Kokubo, Koji Seno
  • Publication number: 20060033100
    Abstract: An anisotropically conductive connector, by which positioning, and holding and fixing to a wafer to be inspected can be conducted with ease even when the wafer has a large area, contains a frame plate having a plurality of anisotropically conductive film-arranging holes formed corresponding to regions of electrodes to be inspected of a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes and supported by the inner peripheral edge thereabout.
    Type: Application
    Filed: August 17, 2005
    Publication date: February 16, 2006
    Applicant: JSR Corporation
    Inventors: Terukazu Kokubo, Koji Seno, Masaya Naoi, Kazuo Inoue
  • Publication number: 20050272282
    Abstract: Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them.
    Type: Application
    Filed: August 7, 2003
    Publication date: December 8, 2005
    Applicant: JSR CORPORATION
    Inventors: Ryoji Setaka, Terukazu Kokubo, Koji Seno, Takeo Hara
  • Patent number: 6969622
    Abstract: An anisotropically conductive connector, by which positioning, and holding and fixing to a wafer to be inspected can be conducted with ease even when the wafer has a large area, contains a frame plate having a plurality of anisotropically conductive film-arranging holes formed corresponding to regions of electrodes to be inspected of a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes and supported by the inner peripheral edge thereabout.
    Type: Grant
    Filed: February 6, 2002
    Date of Patent: November 29, 2005
    Assignee: JSR Corporation
    Inventors: Terukazu Kokubo, Koji Seno, Masaya Naoi, Kazuo Inoue
  • Publication number: 20040217342
    Abstract: Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a circuit device can be conducted with ease even when the pitch of electrodes of the circuit device to be connected is small, and moreover good conductivity can be achieved as to all conductive parts, and insulating property between adjacent conductive parts can be surely achieved, a production process thereof, and applied products thereof.
    Type: Application
    Filed: January 13, 2004
    Publication date: November 4, 2004
    Applicant: JSR Corporation
    Inventors: Terukazu Kokubo, Koji Seno