Abstract: The present invention proposes a semiconductor device including a semiconductor chip having a plurality of electrodes, a plurality of leads electrically connected to the plurality of electrodes of the semiconductor chip by bonding wires, and a resin for implementing the semiconductor chip, wherein the plurality of leads are comprised of two or more kinds of leads having different rigidities.

Abstract: Disclosed is a low thermal resistance surface mount component and a mounting substrate bump-connected therewith, capable of removing a soldered low thermal resistance surface mount component from a circuit board without harming the performance of the circuit board or the performance of the low thermal resistance surface mount component. The solder bumps 3 in an area approaching the periphery 2 of the low thermal resistance surface mount component 1 are composed of a solder of a melting point lower than that of the solder bumps 3 in an area approaching the center. The low thermal resistance surface mount component 1 on the circuit board can be removed by partial heating and by melting the solder bumps. However, when the component is partially heated in this manner, the heating temperature declines approaching the periphery compared to that of the center of the low thermal resistance surface mount component 1.

Abstract: There is proposed a mounting structure including a plurality of components each having a plurality of solder bumps, a substrate having a plurality of lands, and a solder connecting portion for connecting the solder bump and the land, wherein the land provided in an outer peripheral portion of the substrate is smaller than that of the land in a central portion of the substrate.

Abstract: The present invention proposes a semiconductor device including a semiconductor chip having a plurality of electrodes, a plurality of leads electrically connected to the plurality of electrodes of the semiconductor chip by bonding wires, and a resin for implementing the semiconductor chip, wherein the plurality of leads are comprised of two or more kinds of leads having different rigidities.

Abstract: A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.

Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.

Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.

Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.

Abstract: The object of the invention is to obtain solder bonding of high reliability in which the heat resisting properties of a circuit substrate and electronic parts are taken into consideration. In order to achieve the object, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.

Abstract: A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.

Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.

Abstract: The object of the invention is to obtain solder bonding of high reliability in which the heat resisting properties of a circuit substrate and electronic parts are taken into consideration. In order to achieve the object, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.

Abstract: A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.

Abstract: Electronic components are bonded to an electronic circuit board with a lead-free solder. The bonded structure is cooled from a temperature close to the liquids temperature of the solder to a temperature close to the solids temperature of the solder at a first cooling rate of about 10 to 20° C./second, followed by cooling the bonded structure to a temperature lower than the solids temperature of the solder at a second cooling rate of about 0.1 to less than 5° C./second.

Abstract: A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip-semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.

Abstract: In a hard disk drive, power and signals are transferred through a flexible cable 42 between a carriage having a magnetic head reading magnetic information while the positioning of the magnetic head is controlled on a magnetic disk and a card provided on the lower surface of a base. The movable section 44 of the flexible cable 42 is supported by the carriage to follow the carriage. A nonmovable section 46 is bent so as to enclose a reinforcement plate 50 and installed on the base through the reinforcement plate 50. The reinforcement plate 50 is used as a reinforcement for installing an AE module 54 on the upper surface 52 thereof. The reinforcement plate is also used as a reinforcement for connecting a carriage connector 84 to the card 40 through the lower surface 60 thereof. The reinforcement plate is used for maintaining an attitude to maintain the attitude of the movable section 44 in the lateral direction on a surface 64 of thickness of the plate.

Abstract: A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.

Abstract: An electronic circuit comprising a circuit substrate with electronic circuit elements bonded onto the circuit substrate with gaps between the circuit substrate and the respective electronic circuit elements has thermal conductive layers comprising an oxidatively curable resin filled into the gaps. The thermal conductive layers are produced by filling a varnish comprising an oxidatively curable resin into the gaps and exhibit excellent moist heat resistance and thermal conductive properties. The electronic circuit elements once mounted on the circuit substrate can easily be removed as required by releasing the bonding between the elements and the substrate.