Patents by Inventor Koji SHIMONISHI

Koji SHIMONISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11279810
    Abstract: The foamed sheet of the present invention is a foamed sheet obtained by crosslinking and foaming a polyvinylidene fluoride-based resin composition comprising a polyvinylidene fluoride-based resin, wherein the polyvinylidene fluoride-based resin comprises a vinylidene fluoride-hexafluoropropylene copolymer, a density of the foamed sheet is not more than 180 kg/cm3, and an average cell diameter of the foamed sheet is not less than 100 ?m and not more than 500 ?m. According to the present invention, a crosslinked polyvinylidene fluoride-based resin foamed sheet having both good flame retardance and good flexibility and a process for producing the foamed sheet are provided.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: March 22, 2022
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Daisuke Mukohata, Koji Shimonishi
  • Patent number: 11136484
    Abstract: A heat-conducting sheet according to the present invention is a heat-conducting sheet having an initial Asker C hardness of 50 or less, the heat-conducting sheet containing an elastomer resin at the volume proportion of 30 to 70%, and a thermally conductive filler at the volume proportion of 30 to 70%, in which the elastomer resin has a viscosity at 25° C. of 3000 Pa·s or less, and the elastomer resin has a lamella length of 20 mm or more. According to the present invention, a heat-conducting sheet which has initial flexibility sufficient to exhibit excellent shape conformability and in which residual stress is reduced after compression by applying pressure can be provided.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: October 5, 2021
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Masahiro Hamada, Daisuke Mukohata, Koji Shimonishi, Yuuki Hoshiyama
  • Publication number: 20200062917
    Abstract: The foamed sheet of the present invention is a foamed sheet obtained by crosslinking and foaming a polyvinylidene fluoride-based resin composition comprising a polyvinylidene fluoride-based resin, wherein the polyvinylidene fluoride-based resin comprises a vinylidene fluoride-hexafluoropropylene copolymer, a density of the foamed sheet is not more than 180 kg/cm3, and an average cell diameter of the foamed sheet is not less than 100 ?m and not more than 500 ?m. According to the present invention, a crosslinked polyvinylidene fluoride-based resin foamed sheet having both good flame retardance and good flexibility and a process for producing the foamed sheet are provided.
    Type: Application
    Filed: February 27, 2018
    Publication date: February 27, 2020
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Daisuke MUKOHATA, Koji SHIMONISHI
  • Publication number: 20190358944
    Abstract: A resin laminate 10 comprises: at least one expandable resin layer 11 containing a resin and a thermally expandable graphite; and at least one foamed resin layer 12 made of a resin foam, wherein the sum of the values obtained by multiplying the thicknesses of the expandable resin layers 11 by expansion ratios is equal to or greater than the total thickness of the foamed resin layers 12.
    Type: Application
    Filed: September 12, 2017
    Publication date: November 28, 2019
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Daisuke MUKOHATA, Koji SHIMONISHI, Yasuo OOSATO, Michio SHIMAMOTO
  • Publication number: 20190241786
    Abstract: A heat-conducting sheet according to the present invention is a heat-conducting sheet having an initial Asker C hardness of 50 or less, the heat-conducting sheet containing an elastomer resin at the volume proportion of 30 to 70%, and a thermally conductive filler at the volume proportion of 30 to 70%, in which the elastomer resin has a viscosity at 25° C. of 3000 Pa·s or less, and the elastomer resin has a lamella length of 20 mm or more. According to the present invention, a heat-conducting sheet which has initial flexibility sufficient to exhibit excellent shape conformability and in which residual stress is reduced after compression by applying pressure can be provided.
    Type: Application
    Filed: November 30, 2017
    Publication date: August 8, 2019
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Masahiro HAMADA, Daisuke MUKOHATA, Koji SHIMONISHI, Yuuki HOSHIYAMA
  • Publication number: 20190176448
    Abstract: The heat conductive sheet of the present invention has a laminated structure of resin layers including a heat-conductive resin layer comprising a platy heat-conductive filler, a sheet major surface being a plane perpendicular to laminated faces of the resin layers, and the major axis of the platy heat-conductive filler being oriented at an angle of 60° or more with respect to the sheet major surface. According to the present invention, a heat conductive sheet that achieves improvement of the heat conductivity thereof can be provided while the amount of the platy heat-conductive filler used is reduced, and the method for producing the same can also be provided.
    Type: Application
    Filed: August 8, 2017
    Publication date: June 13, 2019
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Daisuke MUKOHATA, Koji SHIMONISHI, Masahiro HAMADA, Keisuke FUKANO
  • Publication number: 20190136004
    Abstract: Provided is a heat conductive foam sheet for electronic equipment sufficiently thin and flexible to be suitably used in the interior of electronic equipment and excellent in heat conductivity. A heat conductive foam sheet for electronic equipment containing a heat conductor in an elastomer resin portion constituting the foam sheet, in which the content of the heat conductor relative to 100 parts by mass of the elastomer resin is 100 to 500 parts by mass, the 25% compressive strength of the foam sheet is 200 kPa or less and the thickness thereof is 0.05 to 1 mm.
    Type: Application
    Filed: January 3, 2019
    Publication date: May 9, 2019
    Inventors: Tetsuhiro KATO, Koji SHIMONISHI, Yukinori KURINO
  • Publication number: 20170072666
    Abstract: A thermal conductive laminate for electronic equipment produced by attaching a two-sided adhesive tape to at least one surface of a foam sheet having a 25% compressive strength of 200 kPa or less and a thickness of 0.05 to 1.0 mm, in which the two-sided adhesive tape has a substrate formed of polyethylene terephthalate having a thickness of 2 to 100 ?m.
    Type: Application
    Filed: March 27, 2015
    Publication date: March 16, 2017
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tetsuhiro KATO, Koji SHIMONISHI
  • Publication number: 20150316332
    Abstract: Provided is a heat conductive foam sheet for electronic equipment sufficiently thin and flexible to be suitably used in the interior of electronic equipment and excellent in heat conductivity. A heat conductive foam sheet for electronic equipment containing a heat conductor in an elastomer resin portion constituting the foam sheet, in which the content of the heat conductor relative to 100 parts by mass of the elastomer resin is 100 to 500 parts by mass, the 25% compressive strength of the foam sheet is 200 kPa or less and the thickness thereof is 0.05 to 1 mm.
    Type: Application
    Filed: August 6, 2013
    Publication date: November 5, 2015
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tetsuhiro KATO, Koji SHIMONISHI, Yukinori KURINO