Abstract: A method of manufacturing a gate switching device is provided. The method includes: forming an oxide insulating layer on a gallium nitride semiconductor layer of n-type or i-type; forming a gallium oxide layer at an interface between the oxide insulating layer and the gallium nitride semiconductor layer by heating the oxide insulating layer and the gallium nitride semiconductor layer at a temperature higher than a temperature of the oxide insulating layer and the gallium nitride semiconductor layer in the formation of the oxide insulating layer; and forming a gate electrode opposed to the gallium nitride semiconductor layer via the gallium oxide layer.

Abstract: A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

Abstract: Examples of the invention include methods and apparatus for wirelessly transmitting power to a vehicle using electromagnetic radiation. An example apparatus includes a transmitter coil associated with a first metamaterial lens, and a receiver coil associated with a second metamaterial lens, the receiver coil being located within the vehicle. The metamaterial lenses each have a negative magnetic permeability, and are separated by a lens spacing including an air gap. The first and second metamaterial lenses (and the lens spacing) act cooperatively to focus the electromagnetic radiation from the transmitter coil on the receiver coil.

Abstract: A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the electronic device is processed to complete bonding. The first side completes bonding during the processing of the second side. This reduces the time needed for the bonding process of both sides. This process allows for various TLP bonding parameters while being compatible with conventional fabrication systems.

Abstract: A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the electronic device is processed to complete bonding. The first side completes bonding during the processing of the second side. This reduces the time needed for the bonding process of both sides. This process allows for various TLP bonding parameters while being compatible with conventional fabrication systems.

Abstract: Devices, methods and systems are disclosed herein to describe the wettability characteristics of the material forming a bonding area, a non-bonding area, and a melted bonding material. The melted bonding material may have a high degree of cohesion and may result in a very high contact angle (e.g., between 90°- 180°) in the non-bonding area thereby preventing or limiting the flow of a melted material into the non-bonding area, which often results when the melted bonding material forms a low contact angle (e.g., between 0°-90°) in the bonding area. In other words, by choosing a material for the non-bonding area to have low wettability characteristics when compared to the melted materials of the bonding area or by treating the material forming the non-bonding area to have much lower wettability characteristics, the melted materials of the bonding area may be prevented from flowing into the non-bonding area.

Abstract: Examples of the invention include methods and apparatus for wirelessly transmitting power to a vehicle using electromagnetic radiation. An example apparatus includes a transmitter coil associated with a first metamaterial lens, and a receiver coil associated with a second metamaterial lens, the receiver coil being located within the vehicle. The metamaterial lenses each have a negative magnetic permeability, and are separated by a lens spacing including an air gap. The first and second metamaterial lenses (and the lens spacing) act cooperatively to focus the electromagnetic radiation from the transmitter coil on the receiver coil.

Abstract: A radar microchip for short range detection with phased array radar uses phase shifters along with an antenna array to steer the transmitted and received radar beams along orthogonal axes to achieve a 3D scan. Individual phase shifters connected to antenna cells that transmit and receive the radar beams steer the radar along two orthogonal axes by controlling the phase of the radar. The radar then detects where the two beams overlap. The antenna cells are further aligned along these orthogonal axes. An isolation barrier between the phase shifters of the transmitted and received signals reduces cross coupling on the radar microchip.

Abstract: The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.

Abstract: A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

Abstract: Devices, methods and systems are disclosed herein to describe the wettability characteristics of the material forming a bonding area, a non-bonding area, and a melted bonding material. The melted bonding material may have a high degree of cohesion and may result in a very high contact angle (e.g., between 90°-180°) in the non-bonding area thereby preventing or limiting the flow of a melted material into the non-bonding area, which often results when the melted bonding material forms a low contact angle (e.g., between 0°-90°) in the bonding area. In other words, by choosing a material for the non-bonding area to have low wettability characteristics when compared to the melted materials of the bonding area or by treating the material forming the non-bonding area to have much lower wettability characteristics, the melted materials of the bonding area may be prevented from flowing into the non-bonding area.

Abstract: The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.

Abstract: The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.

Abstract: The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.

Abstract: An example apparatus comprises an electromagnetic source, such as an antenna, a metamaterial lens, and a reflector. The antenna is located proximate the metamaterial lens, for example supported by the metamaterial lens, and the antenna is operable to generate radiation when the antenna is energized. The reflector is positioned so as to reflect the radiation through the metamaterial lens. The reflector may have a generally concave reflective surface, for example having a parabolic or spherical cross-section. The metamaterial lens may have an area similar to that of the aperture of the reflector. In some examples, the antenna is located proximate a focal point of the reflector, so that a generally parallel beam is obtained after reflection from the reflector.

Abstract: A microwave component having an elongated flexible sheet made of a liquid crystal polymer. A first microwave pattern is printed on one side of the sheet while a second microwave pattern is printed on the other side of the sheet. The first and second patterns are mirror images of each other so that, with the first and second portions of the sheet folded over so that the first portion overlies the second portion, the patterns are aligned with each other and bond together. A margin area of the sheet in between the first and second patterns is then removed to form the microwave component.

Abstract: A microwave component having an elongated flexible sheet made of a liquid crystal polymer. A first microwave pattern is printed on one side of the sheet while a second microwave pattern is printed on the other side of the sheet. The first and second patterns are mirror images of each other so that with the first and second portions of the sheet folded over so that the first portion overlies the second portion, the patterns are aligned with each other and bond together. A margin area of the sheet in between the first and second patterns is then removed to form the microwave component.

Abstract: An example apparatus comprises an electromagnetic source, such as an antenna, a metamaterial lens, and a reflector. The antenna is located proximate the metamaterial lens, for example supported by the metamaterial lens, and the antenna is operable to generate radiation when the antenna is energized. The reflector is positioned so as to reflect the radiation through the metamaterial lens. The reflector may have a generally concave reflective surface, for example having a parabolic or spherical cross-section. The metamaterial lens may have an area similar to that of the aperture of the reflector. In some examples, the antenna is located proximate a focal point of the reflector, so that a generally parallel beam is obtained after reflection from the reflector.