Abstract: Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals.

Abstract: Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals.

Abstract: A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a flexible wiring board sandwiched by the first and second rigid substrates and which has a plurality of third land portions corresponding to the first land portions on one surface and a plurality of fourth land portions corresponding to the second land portions on the other surface. In this circuit substrate, the second and fourth land portions are displaced from each other relative to the first and third land portions and at least part of the first and third land portions and at least part of the second and fourth land portions are electrically connected to each other, respectively.

Abstract: A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a flexible wiring board sandwiched by the first and second rigid substrates and which has a plurality of third land portions corresponding to the first land portions on one surface and a plurality of fourth land portions corresponding to the second land portions on the other surface. In this circuit substrate, the second and fourth land portions are displaced from each other relative to the first and third land portions and at least part of the first and third land portions and at least part of the second and fourth land portions are electrically connected to each other, respectively.

Abstract: An air-fuel ratio sensor comprises an oxygen concentration sensing element, a housing for holding this oxygen concentration sensing element, and protecting covers with gas holes. The protecting covers comprises an inside cover disposed closely to the oxygen concentration sensing element, and an outside cover surrounding the outside cover. Flange-like peripheral portions, formed on the protecting covers, are fixed to the abutting face of the housing by a caulking operation. These flange-like peripheral portions are disposed alternately along a same closed curve around the oxygen concentration sensing element, so that they are not overlapped with each other.