Patents by Inventor Koji Shiroki
Koji Shiroki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9460320Abstract: In a transceiver, on a top surface of a rectangular plate-shaped substrate, transmission radiating elements and receiving radiating elements are provided. The transmission radiating elements extend in the horizontal or lateral direction from the center of the substrate. The receiving radiating elements extend in the vertical or longitudinal direction from the center of the substrate. Inductors included in a matching feeding element are individually electromagnetically coupled to transmission-side feeding points that are inner end portions of the transmission radiating elements and receiving-side feeding points that are inner end portions of the receiving radiating elements. A transmission signal is transmitted with a wave polarized in the horizontal or lateral direction, and a signal having a vertical or longitudinal polarization direction is received.Type: GrantFiled: April 3, 2012Date of Patent: October 4, 2016Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Tsutomu Ieki, Ken Sakai, Noboru Kato, Koji Shiroki
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Patent number: 9264011Abstract: An antenna device includes an impedance-matching switching circuit connected to a feeding circuit, and a radiating element. The impedance-matching switching circuit matches the impedance of the radiating element as a second high frequency circuit element and the impedance of the feeding circuit as a first high frequency circuit element. The impedance-matching switching circuit includes a transformer matching circuit and a series active circuit. The transformer matching circuit matches the real parts of the impedance and matches the imaginary parts of the impedance in the series active circuit. Thus, impedance matching is performed over a wide frequency band at a point at which high frequency circuits or elements having different impedances are connected to each other.Type: GrantFiled: November 6, 2013Date of Patent: February 16, 2016Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kenichi Ishizuka, Noriyuki Ueki, Noboru Kato, Koji Shiroki
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Patent number: 9099770Abstract: A communication terminal device includes a printed wiring board disposed in a casing, a feed pattern provided on a main surface of the printed wiring board, a radiation plate including a substantially planar radiation portion substantially perpendicular to the main surface of the printed wiring board and a lead portion connecting the radiation portion to the feed pattern, and a component mounted on the main surface of the printed wiring board to overlap the lead portion when the main surface of the printed wiring board is viewed from above, the component including a conductive material, a magnetic material and/or a dielectric material. The radiation portion is connected to the lead portion at a side spaced away from the main surface of the printed wiring board, and an area of the lead portion is located at a predetermined distance from the main surface of the printed wiring board.Type: GrantFiled: October 7, 2013Date of Patent: August 4, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Kenichi Ishizuka, Noboru Kato, Koji Shiroki
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Patent number: 9070490Abstract: A transmission line portion of a flat cable that is bent at a position along the longitudinal direction includes a dielectric element body, a first ground conductor, and a second ground conductor. The dielectric element body includes a signal conductor at the middle position of the thickness direction. The first ground conductor includes elongated conductors and bridge conductors. The elongated conductors are spaced in the width direction of the dielectric element body, and extend in the longitudinal direction. The bridge conductors connect the elongated conductors at spacings along the longitudinal direction. The spacing of bridge conductors across the bending point in a bent portion is smaller than the spacing of adjacent bridge conductors located in a straight portion.Type: GrantFiled: June 27, 2013Date of Patent: June 30, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Koji Shiroki, Yoichi Saito, Hiromasa Koyama, Hirotaka Fujii, Noboru Kato
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Patent number: 8991713Abstract: An RFID chip package includes an RFID chip including a voltage booster circuit and processing an RF signal in a UHF band and a power supply circuit connected to the RFID chip and including at least one inductance element. A reactance component of an input/output impedance at an antenna-connecting input/output terminal of the power supply circuit is substantially 0?.Type: GrantFiled: March 11, 2013Date of Patent: March 31, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Yuya Dokai, Koji Shiroki
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Patent number: 8981906Abstract: A printed wiring board includes a circuit substrate on which sheets are laminated, a wireless IC element provided on the sheet, a radiator provided on the sheet, and a loop-shaped electrode defined by first planar conductors, via hole conductors, and one side of the radiator, coupled to the wireless IC element. The first planar conductors are coupled to the radiator and the second planar conductors by auxiliary electrodes.Type: GrantFiled: September 14, 2012Date of Patent: March 17, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Takeoka, Koji Shiroki
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Patent number: 8941552Abstract: A composite printed wiring board includes a parent board and a child board that is mounted on the parent board. A wireless IC element that processes a high-frequency signal, a loop-shaped electrode that is coupled to the wireless IC element, and a first radiator that is coupled to the loop-shaped electrode are provided on the child board. A second radiator that is coupled to the loop-shaped electrode via an electromagnetic field is provided on the parent board.Type: GrantFiled: August 13, 2012Date of Patent: January 27, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Takeoka, Koji Shiroki, Nobuo Ikemoto, Yuya Dokai
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Publication number: 20140091971Abstract: A communication terminal device includes a printed wiring board disposed in a casing, a feed pattern provided on a main surface of the printed wiring board, a radiation plate including a substantially planar radiation portion substantially perpendicular to the main surface of the printed wiring board and a lead portion connecting the radiation portion to the feed pattern, and a component mounted on the main surface of the printed wiring board to overlap the lead portion when the main surface of the printed wiring board is viewed from above, the component including a conductive material, a magnetic material and/or a dielectric material. The radiation portion is connected to the lead portion at a side spaced away from the main surface of the printed wiring board, and an area of the lead portion is located at a predetermined distance from the main surface of the printed wiring board.Type: ApplicationFiled: October 7, 2013Publication date: April 3, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Kenichi ISHIZUKA, Noboru KATO, Koji SHIROKI
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Publication number: 20140062817Abstract: An antenna device includes an impedance-matching switching circuit connected to a feeding circuit, and a radiating element. The impedance-matching switching circuit matches the impedance of the radiating element as a second high frequency circuit element and the impedance of the feeding circuit as a first high frequency circuit element. The impedance-matching switching circuit includes a transformer matching circuit and a series active circuit. The transformer matching circuit matches the real parts of the impedance and matches the imaginary parts of the impedance in the series active circuit. Thus, impedance matching is performed over a wide frequency band at a point at which high frequency circuits or elements having different impedances are connected to each other.Type: ApplicationFiled: November 6, 2013Publication date: March 6, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Kenichi ISHIZUKA, Noriyuki UEKI, Noboru KATO, Koji SHIROKI
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Publication number: 20140003007Abstract: A transmission line portion of a flat cable that is bent at a position along the longitudinal direction includes a dielectric element body, a first ground conductor, and a second ground conductor. The dielectric element body includes a signal conductor at the middle position of the thickness direction. The first ground conductor includes elongated conductors and bridge conductors. The elongated conductors are spaced in the width direction of the dielectric element body, and extend in the longitudinal direction. The bridge conductors connect the elongated conductors at spacings along the longitudinal direction. The spacing of bridge conductors across the bending point in a bent portion is smaller than the spacing of adjacent bridge conductors located in a straight portion.Type: ApplicationFiled: June 27, 2013Publication date: January 2, 2014Inventors: Koji SHIROKI, Yoichi SAITO, Hiromasa KOYAMA, Hirotaka FUJII, Noboru KATO
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Patent number: 8583043Abstract: A high-frequency device includes a wireless IC chip and a board which is coupled to the wireless IC chip and electrically connected to radiator plates, and an inductor and/or a capacitance are provided as a static electricity countermeasure element in the board. The inductor is connected in parallel between the wireless IC chip and the radiator plates, and its impedance at the frequency of static electricity is less than an impedance of the wireless IC chip.Type: GrantFiled: April 27, 2011Date of Patent: November 12, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Nobuo Ikemoto, Yuya Dokai, Koji Shiroki
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Patent number: 8546927Abstract: An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above.Type: GrantFiled: September 1, 2011Date of Patent: October 1, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Koji Shiroki, Makoto Osamura, Takeshi Kurihara, Masami Mizuyama
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Patent number: 8528829Abstract: A wireless communication device includes a wireless IC device, a dielectric substrate, and a metal plate. A radiation conductor coupled to the wireless IC device is provided on the front surface of the dielectric substrate, and a ground conductor connected to the radiation conductor through an interlayer connection conductor is provided on a back surface. The dielectric substrate is fixed to the metal plate via an insulating adhesive, and is crimped by a conductive member. The front and back surfaces of the metal plate are electrically connected to each other by the conductive member, and when a high-frequency signal is supplied from the wireless IC device, a high-frequency signal current on the front surface side of the metal plate is conducted to the back surface side of the metal plate through a surface boundary portion between the conductive member and the metal plate, and radiated as a high-frequency signal.Type: GrantFiled: December 3, 2012Date of Patent: September 10, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Koji Shiroki
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Patent number: 8360325Abstract: A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.Type: GrantFiled: August 24, 2010Date of Patent: January 29, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Takeshi Kataya, Noboru Kato, Satoshi Ishino, Nobuo Ikemoto, Ikuhei Kimura, Koji Shiroki, Yuya Dokai
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Publication number: 20130002404Abstract: A printed wiring board includes a circuit substrate on which sheets are laminated, a wireless IC element provided on the sheet, a radiator provided on the sheet, and a loop-shaped electrode defined by first planar conductors, via hole conductors, and one side of the radiator, coupled to the wireless IC element. The first planar conductors are coupled to the radiator and the second planar conductors by auxiliary electrodes.Type: ApplicationFiled: September 14, 2012Publication date: January 3, 2013Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Makoto TAKEOKA, Koji SHIROKI
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Patent number: 8336786Abstract: A wireless communication device includes a wireless IC device, a dielectric substrate, and a metal plate. A radiation conductor coupled to the wireless IC device is provided on the front surface of the dielectric substrate, and a ground conductor connected to the radiation conductor through an interlayer connection conductor is provided on a back surface. The dielectric substrate is fixed to the metal plate via an insulating adhesive, and is crimped by a conductive member. The front and back surfaces of the metal plate are electrically connected to each other by the conductive member, and when a high-frequency signal is supplied from the wireless IC device, a high-frequency signal current on the front surface side of the metal plate is conducted to the back surface side of the metal plate through a surface boundary portion between the conductive member and the metal plate, and radiated as a high-frequency signal.Type: GrantFiled: March 26, 2012Date of Patent: December 25, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Koji Shiroki
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Publication number: 20120306719Abstract: A composite printed wiring board includes a parent board and a child board that is mounted on the parent board. A wireless IC element that processes a high-frequency signal, a loop-shaped electrode that is coupled to the wireless IC element, and a first radiator that is coupled to the loop-shaped electrode are provided on the child board. A second radiator that is coupled to the loop-shaped electrode via an electromagnetic field is provided on the parent board.Type: ApplicationFiled: August 13, 2012Publication date: December 6, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Makoto TAKEOKA, Koji SHIROKI, Nobuo IKEMOTO, Yuya DOKAI
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Publication number: 20120190310Abstract: In a transceiver, on a top surface of a rectangular plate-shaped substrate, transmission radiating elements and receiving radiating elements are provided. The transmission radiating elements extend in the horizontal or lateral direction from the center of the substrate. The receiving radiating elements extend in the vertical or longitudinal direction from the center of the substrate. Inductors included in a matching feeding element are individually electromagnetically coupled to transmission-side feeding points that are inner end portions of the transmission radiating elements and receiving-side feeding points that are inner end portions of the receiving radiating elements. A transmission signal is transmitted with a wave polarized in the horizontal or lateral direction, and a signal having a vertical or longitudinal polarization direction is received.Type: ApplicationFiled: April 3, 2012Publication date: July 26, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Tsutomu IEKI, Ken SAKAI, Noboru KATO, Koji SHIROKI
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Publication number: 20120187198Abstract: A wireless communication device includes a wireless IC device, a dielectric substrate, and a metal plate. A radiation conductor coupled to the wireless IC device is provided on the front surface of the dielectric substrate, and a ground conductor connected to the radiation conductor through an interlayer connection conductor is provided on a back surface. The dielectric substrate is fixed to the metal plate via an insulating adhesive, and is crimped by a conductive member. The front and back surfaces of the metal plate are electrically connected to each other by the conductive member, and when a high-frequency signal is supplied from the wireless IC device, a high-frequency signal current on the front surface side of the metal plate is conducted to the back surface side of the metal plate through a surface boundary portion between the conductive member and the metal plate, and radiated as a high-frequency signal.Type: ApplicationFiled: March 26, 2012Publication date: July 26, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Koji SHIROKI
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Publication number: 20120056337Abstract: An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above.Type: ApplicationFiled: September 1, 2011Publication date: March 8, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Koji SHIROKI, Makoto OSAMURA, Takeshi KURIHARA, Masami MIZUYAMA