Patents by Inventor Koji Shoki

Koji Shoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10154585
    Abstract: An object of the present invention is to provide a conductive coating film formed on a polyimide-based insulating substrate by using a metal powder paste which can exhibit a good conductivity and good adhesion to the insulating substrate. By forming a resin cured layer having a solvent-soluble content of not more than 20% by weight and a thickness of not more than 5 ?m on a polyimide-based insulating substrate; forming a metal powder-containing coating layer on the resin cured layer by using a metal powder paste; and then subjecting the resulting coating layer to heat treatment with superheated steam, it is possible to obtain a conductive coating film which can exhibit a good conductivity and good adhesion to the insulating substrate.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: December 11, 2018
    Assignees: TODA KOGYO CORPORATION, TOYOBO CO., LTD.
    Inventors: Takeshi Yatsuka, Chiho Ito, Yasuo Kakihara, Hirotoshi Kizumoto, Koji Shoki
  • Publication number: 20140141238
    Abstract: An object of the present invention is to provide a conductive coating film formed on a polyimide-based insulating substrate by using a metal powder paste which can exhibit a good conductivity and good adhesion to the insulating substrate. By forming a resin cured layer having a solvent-soluble content of not more than 20% by weight and a thickness of not more than 5 ?m on a polyimide-based insulating substrate; forming a metal powder-containing coating layer on the resin cured layer by using a metal powder paste; and then subjecting the resulting coating layer to heat treatment with superheated steam, it is possible to obtain a conductive coating film which can exhibit a good conductivity and good adhesion to the insulating substrate.
    Type: Application
    Filed: May 17, 2012
    Publication date: May 22, 2014
    Applicants: TOYOBO CO., LTD., TODA KOGYO CORPORATION
    Inventors: Takeshi Yatsuka, Chiho Ito, Yasuo Kakihara, Hirotoshi Kizumoto, Koji Shoki