Patents by Inventor Koji Sudo

Koji Sudo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050064793
    Abstract: An apparatus and a method for polishing a row bar including magnetic head sliders. A lapping surface plate is rotatable, and a housing is movable above the lapping surface plate. A jig is secured to the housing for holding the row bar. The jig is formed by an elongated rigid member having a plurality of holes and an elongated elastic member fixed to the rigid member. An air cylinder presses the whole row bar, and a pressing devices individually presses portions of the elastic member corresponding to magnetic head sliders of the row bar through the holes of the rigid member. A portion of the elastic member is deformed to press a portion of the row bar in response to a change in the measured resistance of ELG resistance elements in the row bar.
    Type: Application
    Filed: February 23, 2004
    Publication date: March 24, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Koji Sudo, Yoshiaki Yanagida
  • Publication number: 20040162005
    Abstract: The apparatus for lapping a magnetic head slider includes a lapping plate to which a bar of the magnetic head slider makes a contact by a predetermined lapping pressure, a primary oscillating mechanism that makes a primary oscillating of the bar in a radial direction of the lapping plate, and a secondary oscillating mechanism that makes a secondary oscillating of the bar in a direction perpendicular to a direction of the primary oscillating. A coarse lapping of the bar is performed by a combined oscillating of the primary oscillating and the secondary oscillating, and upon completion of the coarse lapping, the apparatus switches to the primary oscillating to finish lapping of the bar.
    Type: Application
    Filed: December 30, 2003
    Publication date: August 19, 2004
    Applicant: FUJITSU LIMITED
    Inventors: Koji Sudo, Mitsuo Takeuchi
  • Patent number: 6758725
    Abstract: A lapping method includes a step of moving a substantially bar-shaped workpiece in a radial direction of a surface of a rotary lapping plate while simultaneously oscillating the workpiece pivotally about a central point in a longitudinal direction of the workpiece in a plane parallel to the surface of the rotary lapping plate.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: July 6, 2004
    Assignee: Fujitsu Limited
    Inventors: Koji Sudo, Yoshiaki Yanagida, Tomokazu Sugiyama
  • Patent number: 6722947
    Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: April 20, 2004
    Assignee: Fujitsu Limited
    Inventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone, Koji Sudo, Tomokazu Sugiyama
  • Patent number: 6604989
    Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.
    Type: Grant
    Filed: January 24, 2001
    Date of Patent: August 12, 2003
    Assignee: Fujitsu Limited
    Inventors: Yoshiaki Yanagida, Koji Sudo
  • Publication number: 20030119421
    Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.
    Type: Application
    Filed: February 6, 2003
    Publication date: June 26, 2003
    Applicant: Fujitsu Limited
    Inventors: Michinao Nomura, Yoshiaki Yanagida, Tomokazu Sugiyama, Koji Sudo
  • Publication number: 20030051777
    Abstract: A solution treatment is firstly performed for a non-heat-treated Ni based alloy having a composition equivalent to that of Inconel 718 (registered trademark). Subsequently, a primary aging treatment is applied by holding the Ni based alloy at 610 to 660° C. for 5 to 10 hours. After that, a secondary aging treatment is performed by holding the Ni based alloy at 710 to 760° C. for 5 to 10 hours. There are 700 or more precipitates per &mgr;m2, in which each precipitate has a longer diameter of not less than 0.5 nm, in a metal microstructure of the Ni based alloy. Some of the precipitates are large precipitates having average diameters of 25 nm to 1 &mgr;m. There are 10 or more large precipitates per &mgr;m2. A forging die is produced with the Ni based alloy.
    Type: Application
    Filed: September 17, 2002
    Publication date: March 20, 2003
    Inventor: Koji Sudo
  • Publication number: 20020052164
    Abstract: A lapping machine for lapping a row bar includes a lap plate for providing a lapping surface, a row tool having a plurality of bend cells formed by defining a plurality of slits, a pressure mechanism for pressing the row tool toward the lapping surface of the lap plate, and a bend mechanism for bending the bend cells of the row tool toward the lapping surface of the lap plate. The bend mechanism includes an air cylinder unit having a plurality of double-acting air cylinders, a plurality of racks operatively connected to the double-acting air cylinders, respectively, a plurality of drive pinions arranged coaxially and meshing with the racks, respectively, each drive pinion having a lever for driving the corresponding bend cell, a plurality of support pinions arranged coaxially and meshing with the racks, respectively, and a guide mechanism for guiding each rack, the respective drive pinion, and the respective support pinion in substantially the same plane.
    Type: Application
    Filed: July 24, 2001
    Publication date: May 2, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Koji Sudo, Yoshiaki Yanagida
  • Publication number: 20020052172
    Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).
    Type: Application
    Filed: September 10, 2001
    Publication date: May 2, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone, Koji Sudo, Tomokazu Sugiyama
  • Patent number: 6375539
    Abstract: A lapping machine for lapping a row bar includes a lap plate for providing a lapping surface, a row tool having a plurality of bend cells formed by defining a plurality of slits, a pressure mechanism for pressing the row tool toward the lapping surface of the lap plate, and a bend mechanism for bending the bend cells of the row tool toward the lapping surface of the lap plate. The bend mechanism includes an air cylinder unit having a plurality of double-acting air cylinders, a plurality of racks operatively connected to the double-acting air cylinders, respectively, a plurality of drive pinions arranged coaxially and meshing with the racks, respectively, each drive pinion having a lever for driving the corresponding bend cell, a plurality of support pinions arranged coaxially and meshing with the racks, respectively, and a guide mechanism for guiding each rack, the respective drive pinion, and the respective support pinion in substantially the same plane.
    Type: Grant
    Filed: July 24, 2001
    Date of Patent: April 23, 2002
    Assignee: Fujitsu Limited
    Inventors: Koji Sudo, Yoshiaki Yanagida
  • Publication number: 20020016130
    Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.
    Type: Application
    Filed: January 24, 2001
    Publication date: February 7, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Michinao Nomura, Yoshiaki Yanagida, Tomokazu Sugiyama, Koji Sudo
  • Patent number: 6325699
    Abstract: Disclosed are a lapping apparatus and a lapping method for compensating for warp in a work to be lapped, wherein the warp of the work is compensated for during the lapping process. A warp quantity of the work is detected during the lapping process and compensation is made. Hence, even warp caused during the lapping process can be compensated. It is also feasible to save the task of measuring the warp quantity of the work before lapping. An air pressure mechanism for applying pressure to the work in accordance with an air supply pressure is used as a warp straightening mechanism, whereby a minute warp quantity can be compensated for and controlled to zero. With the air pressure mechanism being adopted, it is possible to prevent excessive pressure from being applied to a lap jig.
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: December 4, 2001
    Assignee: Fujitsu Limited
    Inventors: Koji Sudo, Yoshiaki Yanagida, Tomokazu Sugiyama
  • Patent number: 6315636
    Abstract: Disclosed herein is a lapping machine for lapping a row bar having a plurality of head sliders. The lapping machine includes a lap plate for providing a lapping surface, a row tool having a work surface for pressing the row bar against the lapping surface, and a mechanism for operating the row tool so that a given pressure distribution is produced between the row bar and the lapping surface. The row tool has a plurality of holes arranged along the work surface. The mechanism includes a plurality of pivoted links each having a load point where a force having a direction perpendicular to the work surface is applied to the row tool in each of the holes. Each of the pivoted links further has a support point as the fulcrum and an effort point where a force having a direction substantially parallel to the work surface is received. The ratio of a distance between the load point and the support point to a distance between the effort point and the support point is substantially constant.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: November 13, 2001
    Assignee: Fujitsu Limited
    Inventors: Yoshiaki Yanagida, Teruaki Nishioka, Koji Sudo, Shunsuke Sone, Tomokazu Sugiyama