Abstract: A housing of an example of an electronic apparatus has a top surface and a bottom surface and has a flat shape. A power supply section having a flat shape is a power supply section, which is a housing case capable of accommodating a battery or is a battery, and the power supply section is provided at a position inside the housing that intersects with a reference plane perpendicular to the up-down direction. A first substrate is provided parallel to the reference plane on the top surface side relative to the power supply section. A second substrate is provided parallel to the reference plane on the bottom surface side relative to the power supply section. The electronic apparatus includes at least one of a vibrator and a speaker at a position that intersects with the reference plane.

Abstract: The diagnosis support apparatus according to any of embodiments includes processing circuitry. The processing circuitry is configured to acquire external force data regarding external force applied to a subject. The processing circuitry is configured to generate diagnosis support data for supporting diagnosis practice to the subject based on the acquired external force data. The processing circuitry is configured to control output of the generated diagnosis support data.

Abstract: The medical data file processing apparatus according to the present embodiment includes processing circuitry. The processing circuitry is configured to acquire an image-interpretation report. The processing circuitry is configured to classify a medical data file corresponding to the image-interpretation report based on a content of the image-interpretation report.

Abstract: According to one embodiment, a medical image diagnosis apparatus is capable of imaging a subject based on a scan plan. The medical image diagnosis apparatus includes a gantry, a bed, a display, and a controller. The gantry images the subject. The bed includes a top-plate upon which the subject is positioned. The display is attached to the gantry. The controller displays, based on the scan plan, one of a moving distance of the top-plate, a moving direction of the top-plate, and a scan mode based on the scan plan.

Abstract: According to one embodiment, a medical image processing apparatus includes memory circuitry, and transfer circuitry. The memory circuitry configured to store a plurality of medical images obtained by capturing a subject and a plurality of pieces of additional information respectively associated with the plurality of medical images. The transfer circuitry configured to transfer the plurality of medical images to an external apparatus in accordance with a predetermined transfer sequence. If the additional information associated with each medical image matches a predetermined determination condition, the transfer circuitry changes the predetermined transfer sequence, and transfers the plurality of medical images to the external apparatus.

Abstract: According to one embodiment, a medical image diagnosis apparatus is capable of imaging a subject based on a scan plan. The medical image diagnosis apparatus includes a gantry, a bed, a display, and a controller. The gantry images the subject. The bed includes a top-plate upon which the subject is positioned. The display is attached to the gantry. The controller displays, based on the scan plan, one of a moving distance of the top-plate, a moving direction of the top-plate, and a scan mode based on the scan plan.

Abstract: A medical image processing apparatus according to embodiments includes identification information retrieving circuitry and medical image retrieving circuitry. The identification information retrieving circuitry retrieves identification information of a medical image serving as a basis of a three-dimensionally displayed image used for diagnosing a subject from object information that includes the identification information and setting information for three-dimensionally displaying the three-dimensionally displayed image. The medical image retrieving circuitry retrieves a medical image corresponding to retrieved identification information from storage circuitry that stores therein a plurality of medical images of a subject and identification information of the medical images in a corresponding manner.

Abstract: According to one embodiment, a medical image processing apparatus includes a reception unit, determination unit, dividing unit, processing control unit, and storage processing unit. The reception unit receives first data including supported and unsupported tags, and individual data added to the supported or unsupported tag. The determination unit determines whether a tag included in the first data is supported or not. The dividing unit divides the first data into second data and third data. The processing control unit executes data processing by referring to the second data. The storage processing unit generates fourth data by adding second data to data acquired by the processing.

Abstract: A solar cell module is provided with a plurality of dye sensitized solar cells arranged on a plane and connected in series with an intercell region interposed therebetween. A first transparent substrate, a first transparent conductive film, a dye carrying oxide semiconductor layer, an electrolyte layer, a catalyst layer, a second transparent conductive film and a second transparent substrate are laminated. An insulating barrier seals cells on both sides thereof in fluid tightness and insulates them in the intercell region. An electrode connecting portion provided in a vertical central part of the insulating barrier connects an extended portion of the first transparent conductive film of one of the cells to that of a second transparent conductive film of the other cell, and the electrode connecting portion penetrates through at least one of the first transparent substrate and the second transparent substrate in the vertical direction and is thus exposed.

Abstract: A method and apparatus for processing a thin film able to easily form grooves in a conductive thin film on an insulating substrate, comprising bringing a first electrode into contact with the conductive thin film, maintaining a conductive state between a tip of a second electrode with a voltage applied with respect to the first electrode and the surface of the conductive thin film, and using the tip of the second electrode to scan the conductive thin film so as to thereby form grooves passing through the thickness of the conductive thin film and exposing the surface of the insulating substrate at their bottoms in the conductive thin film.

Abstract: In a solar cell module in which a plurality of dye sensitized solar cells is arranged on a plane basis and is connected in series with an intercell region interposed therebetween, a first transparent substrate, a first transparent conductive film, a dye carrying oxide semiconductor layer, an electrolyte layer, a catalyst layer, a second transparent conductive film and a second transparent substrate are laminated, an insulating barrier seals cells on both sides thereof in fluid tightness and insulates them in the intercell region, an electrode connecting portion provided in a central part in a vertical direction of the insulating barrier connects an extended portion of the first transparent conductive film of one of the cells on the both sides to that of a second transparent conductive film of the other cell, and the electrode connecting portion penetrates through at least one of the first transparent substrate and the second transparent substrate in the vertical direction and is thus exposed.

Abstract: To insert a cylindrical metallic raw material into a melting cylinder provided in a heating holding cylinder of a metal molding apparatus and to efficiently semi-melt or completely melt the cylindrical metallic raw material, a clearance between an inner circumferential surface of the melting cylinder and an outer circumferential surface of the cylindrical metallic raw material is limited to a range in which the clearance does not exceed 1.0 mm with respect to the inner diameter of the melting cylinder and the diameter of the metallic raw material during thermal expansion and the insertion of the metallic raw material in a non-thermal expansion state into the thermally expanding melting cylinder is possible, from a linear expansion coefficient of a metallic raw material and a linear expansion coefficient of a material of the melting cylinder.

Abstract: In a metal molding machine provided having a tilt to a clamping device with an injection unit which is constituted by a liquid metallic material reservoir in which a cylinder having a nozzle portion at the tip portion equipped with a heating device at the outer periphery and an injection plunger having advance or retreat freely in the inside, and the injection cylinder at the rear portion, the metallic material feeding to the above liquid metallic material reservoir is performed in liquid by melt to the temperature of above the liquidus temperature in a melting cylinder standing the liquid metallic material reservoir to liquid metallic material surface from a feeding pipe having a smaller diameter than the inner diameter of the cylinder. The melting and feeding of metallic material is performed at an atmosphere of an inert gas such as argon.

Abstract: To insert a cylindrical metallic raw material into a melting cylinder provided in a heating holding cylinder of a metal molding apparatus and to efficiently semi-melt or completely melt the cylindrical metallic raw material, a clearance between an inner circumferential surface of the melting cylinder and an outer circumferential surface of the cylindrical metallic raw material is limited to a range in which the clearance does not exceed 1.0 mm with respect to the inner diameter of the melting cylinder and the diameter of the metallic raw material during thermal expansion and the insertion of the metallic raw material in a non-thermal expansion state into the thermally expanding melting cylinder is possible, from a linear expansion coefficient of a metallic raw material and a linear expansion coefficient of a material of the melting cylinder.

Abstract: A method and apparatus for processing a thin film able to easily form grooves in a conductive thin film on an insulating substrate, comprising bringing a first electrode into contact with the conductive thin film, maintaining a conductive state between a tip of a second electrode with a voltage applied with respect to the first electrode and the surface of the conductive thin film, and using the tip of the second electrode to scan the conductive thin film so as to thereby form grooves passing through the thickness of the conductive thin film and exposing the surface of the insulating substrate at their bottoms in the conductive thin film.

Abstract: The present invention relates to a method of molding a low-melting-point metal alloy which exhibits thixotropy properties in a solid-phase and liquid-phase coexisting temperature region. In this method, a temperature of a heating holding cylinder is increased to a liquidus temperature or higher at the start of a molding operation. Then a remaining material in the preceding molding remaining in the heating holding cylinder in a solid state is wholly melted. After that a temperature of the heating holding cylinder is lowered to a temperature in the solid-phase and a liquid-phase coexisting temperature region. At the same time a molding material is supplied and a provisional molding is carried out. After the temperature has reached the solid-phase and liquid-phase coexisting temperature region, a regular molding is started. By the present invention a problem of a remaining material in the heating holding cylinder, which becomes a trouble at the start of molding by injection, is solved.

Abstract: A method of molding a low melting point metal alloy which exhibits thixotropy properties at a solid-liquid coexisting temperature, said method comprising the steps of heating said metal alloy at a temperature in the solid-liquid coexisting temperature region to form a semisolid, supplying said semisolid to a heating/holding cylinder to be accumulated, and injecting said semisolid into a mold. At the end of the molding process, a remaining semisolid material is heated to a wholly molten state, then discharged by injection, and heating is stopped so that the molding operation is finished; or, at a temporary suspension of molding, an accumulated material is heated to a wholly molten state and, at the resumption of molding, the temperature of the heating holding cylinder is lowered to the original solid-liquid coexisting temperature region while discharging said wholly molten material by injection and resupplying with new semisolid molding material.

Abstract: The present invention relates to a method of molding a low-melting-point metal alloy. In this method, a remaining semisolid material at the end of molding is heated to a liquidus temperature or higher to be melted. Then an injection of the material is performed in a perfectly molten material state to discharge it from a heating holding cylinder. Heating is stopped and a molding operation is finished. A discharge of a remaining semisolid material is made while supplying a metallic raw material having the same composition as the molding material. A temporary suspension of molding is performed after the temperature of the heating holding cylinder is increased to a liquidus temperature or higher and an accumulated semisolid material is in a perfectly molten material state.

Abstract: The present invention relates to a method of molding a low-melting-point metal alloy which exhibits thixotropy properties in a solid-phase and liquid-phase coexisting temperature region. In this method, a temperature of a heating holding cylinder is increased to a liquidus temperature or higher at the start of a molding operation. Then a remaining material in the preceding molding remaining in the heating holding cylinder in a solid state is perfectly melted. After that a temperature of the heating holding cylinder is lowered to a temperature in the solid-phase and a liquid-phase coexisting temperature region. At the same time a molding material is supplied and a provisional molding is carried out. After the temperature has reached the solid-phase and liquid-phase coexisting temperature region, a regular molding is started. By the present invention a problem of a remaining material in the heating holding cylinder, which becomes a trouble at the start of molding by injection is solved.

Abstract: In a metal molding machine provided ed having a tilt to a clamping device with an injection unit which is constituted by a liquid metallic material reservoir in which a cylinder having a nozzle portion at the tip portion equipped with a heating device at the outer periphery and an injection plunger having advance or retreat freely in the inside, and the injection cylinder at the rear portion, the metallic material feeding to the above liquid metallic material reservoir is performed in liquid by melt to the temperature of above the liquidus temperature in a melting cylinder standing the liquid metallic material reservoir to liquid metallic material surface from a feeding pipe having a smaller diameter than the inner diameter of the cylinder. The melting and feeding of metallic material is performed at an atmosphere of an inert gas such as argon.