Abstract: To detect abnormality of a connecting section and appropriately disconnect the connecting section, the present invention refers to the result of detection by a state detection section configured to detect the state of each of a plurality of terminals to detect the presence or absence of abnormality of each of the plurality of terminals, In a case where abnormality has been detected, the present invention switches the direction of electric current flowing through an electromagnet. This disconnects a first connecting section and a second connecting section from each other.

Abstract: To detect abnormality of a connecting section and appropriately disconnect the connecting section, the present invention refers to the result of detection by a state detection section configured to detect the state of each of a plurality of terminals to detect the presence or absence of abnormality of each of the plurality of terminals, in a case where abnormality has been detected, the present invention switches the direction of electric current flowing through an electromagnet. This disconnects a first connecting section and a second connecting section from each other.

Abstract: A semiconductor device is provided with connection reliability between a bump electrode and a substrate electrode. An elastic modulus of an adhesive material used to electrically connect a metal bump and an interconnect pattern, and sealing the circuit surface of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material of a packaging substrate surface layer after thermosetting is Eb; an elastic modulus of a core material, if used, is Ec, and the following rational expression is satisfied at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea<Eb<Ec, preferably ?Eb<Ea<Eb<3Ea(<Ec). With this arrangement, a stable connection state can be attained irrespective of the level of the contact bonding load or fluctuations of it upon mass production and, therefore, high yield can be attained at low cost.

Abstract: An object of the present invention is to manufacture a semiconductor device improved in the connection reliability between a bump electrode and a substrate electrode. Supposing that an elastic modulus of an adhesive material, which is used for the purpose of electrically connecting a metal bump and an interconnect pattern and sealing the circuit surface of LSI of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material constituting the surface layer of a packaging substrate after thermosetting is Eb; and an elastic modulus of a core material, if the substrate is a multilayer substrate having a core layer, is Ec, the material system of the present invention satisfies the following rational expression at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea<Eb<Ec, preferably ?Eb<Ea<Eb<3Ea(<Ec).

Abstract: A service switching point equipped with a switching function and connected via a communication network to a service control point equipped with an additional-service control function sends a request for an additional service to the service control point when the additional service is requested by a terminal (subscriber). The service control point executes control for the additional service, creates additional service charging information (first charging information) related to the additional service and sends the first information to the service switching point. The latter creates second charging information, which is information related to the ordinary service, as part of detailed charging information and creates detailed charging information by combining the first charging information, which is sent from the service control point, with the second charging information.

Abstract: A telecommunication system comprises a network for transmitting information, a plurality of terminals connected to the network for communicating to each other, a data base provided in the network and having a plurality of storage areas corresponding to the plurality of terminals for storing a plurality of alerting patterns, alerting tone selector for reading, on the basis of information for identifying a calling terminal, an alerting pattern specified at the calling terminal when there is a call incoming from the calling terminal to a called terminal, from a storage area in the data base corresponding to the called terminal, and alerting tone controller for controlling a called terminal on the basis of the alerting pattern and generating a corresponding alerting tone at the called terminal when there is an incoming call.

Abstract: A picture image color separating apparatus to be used when block copies for dyeing use are made in a dyeing business, wherein a region the above described other representative color occupies may not exist on a straight line connecting the above described adjacent two representative color positions on the color space when the other representative color exists near the adjacent two representative colors on the original picture image from among a plurality of representative colors selected by the given procedure by the representative color selecting portion from the illustration inputted from the picture image inputting portion, whereby noises by the above described representative color are not caused on the boundary of the above described adjacent two representative colors.