Abstract: A solid-state device includes a metal pattern formed on a substrate, a conductive bump connected to the metal pattern so as to be contact with a side surface of the metal pattern, and a solid-state element connected to the metal pattern via the conductive bump. A bottom surface level of at least a portion of the conductive bump is substantially equal to a bottom surface level of a portion of the metal pattern at which the metal pattern is connected to the conductive bump.

Abstract: A method of manufacturing a light-emitting device includes a hole forming process for forming a through-hole that continues from a front surface to a back surface of a mounting substrate, a pattern forming process for continuously forming a circuit pattern on an inner surface of the through-hole in the mounting substrate, from an end portion of the through-hole on the front surface of the mounting substrate to a mounting portion of a light-emitting element, and on a periphery of the through-hole on the back surface of the mounting substrate, a mounting process for mounting the light-emitting element on the mounting portion, and a hot pressing process in that an inorganic material softened by heating is placed on the surface of the mounting substrate and is advanced into the through-hole while sealing the light-emitting element by pressing and bonding the inorganic material to the surface of the mounting substrate.

Abstract: A light emitting device, comprises an element mounting substrate with a circuit pattern at least on an element mounting surface of the element mounting substrate, a light emitting element mounted on the element mounting surface of the element mounting substrate and connected with the circuit pattern, a sealing member that seals the light emitting element and is bonded on the element mounting surface, and a coating layer that covers the element mounting side of the element mounting substrate inside the sealing member, wherein the coating layer has its refractive index smaller than that of the sealing member.

Abstract: A method of manufacturing a light-emitting device including a light-emitting element mounted on a substrate and sealed with a glass. The method includes heating the glass by a first mold that is heated to a temperature higher than a yield point of the glass, the glass contacting the first mold, and pressing the glass against the light-emitting element mounted on the substrate supported by a second mold to seal the light-emitting element with the glass.

Abstract: A light emitting device includes a light source including an inorganic material substrate, a light emitting element mounted on a mounting surface of the inorganic material substrate, and a metalized pattern formed on a non-mounting surface of the inorganic material substrate on which the light emitting element is not mounted, a mounting substrate including an mounting surface on which the light source is mounted, and a conductor pattern formed on the mounting surface and bonded to the metalized pattern, and an optical member disposed on the mounting surface of the mounting substrate so as to guide a light emitted from the light source in a predetermined direction. The optical member includes a heat absorbing surface at least a part of which faces the conductor pattern of the mounting substrate, and a heat radiating surface that radiates heat of the light source conducted from the conductor pattern via the heat absorbing surface.

Abstract: A light-emitting device includes a light emitting portion including a substrate having a mounting surface for mounting an LED element and a metal portion formed on a surface of the substrate opposite to the mounting surface, the substrate including a ceramic or a semiconductor and the metal portion being bondable to a solder material and a heat dissipating member including one of aluminum, an aluminum alloy, magnesium, and a magnesium alloy, and having, on a surface thereof, a junction treated so as to be bondable to the solder material and a heat dissipating film formed in a periphery of the junction, wherein the metal portion of the light emitting portion is bonded to the junction of the heat dissipating member by the solder material.

Abstract: The light emitting device 10 comprises a mounting substrate 11, LED chips 20 flip-chip bonded on the mounting substrate 11, and a glass sealing member 30 made of a plate-shaped glass material that seals the LED chips 20 formed on the mounting substrate 11. Here, the glass sealing member 30 is in a state in which fine voids are almost evenly dispersed and distributed between the powder grains of the glass material, and the powder grains are connected with each other, and the fine bumps/dips 30a are almost evenly dispersed and distributed on the surface of the glass sealing member 30.

Abstract: A light-emitting device includes a light source including an element mounting substrate, an LED element mounted thereon by flip-chip connection and a sealing portion for sealing the LED element on the element mounting substrate, and a light guide plate including a housing hole for housing the light source. The housing hole extends from one surface side to another surface side of the light guide plate and an area of an inner surface thereof on which light is incident from the light source is parallel to a thickness direction of the light guide plate. The light source is housed in the housing hole so that the element mounting substrate is located on the other surface side of the light guide plate, emits light toward the one surface side of the light guide plate in the housing hole and the inner surface side of the housing hole, and has an optical axis parallel to the thickness direction of the light guide plate.

Abstract: A solid-state device includes a metal pattern formed on a substrate, a conductive bump connected to the metal pattern so as to be contact with a side surface of the metal pattern, and a solid-state element connected to the metal pattern via the conductive bump. A bottom surface level of at least a portion of the conductive bump is substantially equal to a bottom surface level of a portion of the metal pattern at which the metal pattern is connected to the conductive bump.

Abstract: The light emitting device 10 comprises a mounting substrate 11, LED chips 20 flip-chip bonded on the mounting substrate 11, and a glass sealing member 30 made of a plate-shaped glass material that seals the LED chips 20 formed on the mounting substrate 11. Here, the glass sealing member 30 is in a state in which fine voids are almost evenly dispersed and distributed between the powder grains of the glass material, and the powder grains are connected with each other, and the fine bumps/dips 30a are almost evenly dispersed and distributed on the surface of the glass sealing member 30.

Abstract: A light emitting device, comprises an element mounting substrate with a circuit pattern at least on an element mounting surface of the element mounting substrate, a light emitting element mounted on the element mounting surface of the element mounting substrate and connected with the circuit pattern, a sealing member that seals the light emitting element and is bonded on the element mounting surface, and a coating layer that covers the element mounting side of the element mounting substrate inside the sealing member, wherein the coating layer has its refractive index smaller than that of the sealing member.

Abstract: A light emitting device includes a light-emitting portion including a metal part including a metal able to be bonded to a solder material, and a heat dissipation member that includes aluminum, aluminum alloy, magnesium or magnesium alloy and a bonding portion processed to be bonded to the solder material. The metal part of the light-emitting portion is bonded via the solder material to the bonding portion of the heat dissipation member. The solder material includes a material unable to be directly bonded to the heat dissipation member, the metal part of the light-emitting portion is formed by metalizing an insulation of ceramic or semiconductor, and the bonding portion includes a thermal expansion coefficient between that of the heat dissipation member and that of the insulation.

Abstract: A light emitting device includes a light source including an inorganic material substrate, a light emitting element mounted on a mounting surface of the inorganic material substrate, and a metalized pattern formed on a non-mounting surface of the inorganic material substrate on which the light emitting element is not mounted, a mounting substrate including an mounting surface on which the light source is mounted, and a conductor pattern formed on the mounting surface and bonded to the metalized pattern, and an optical member disposed on the mounting surface of the mounting substrate so as to guide a light emitted from the light source in a predetermined direction. The optical member includes a heat absorbing surface at least a part of which faces the conductor pattern of the mounting substrate, and a heat radiating surface that radiates heat of the light source conducted from the conductor pattern via the heat absorbing surface.

Abstract: A light source unit includes a light source portion including a mounting board, a light emitting element mounted on the mounting board, a rectangular solid sealing material for sealing the light emitting element, the sealing material including a first distance between the light emitting element and a top face thereof and a second distance between the light emitting element and a side face thereof, the first distance being greater than the second distance and a phosphor dispersed in the sealing material for radiating a wavelength conversion light by being excited by light emitted from the light emitting element, wherein a first light emitted through the top face of the sealing material is different in emission color from a second light emitted through the side face of the sealing material.

Abstract: A method of manufacturing a light-emitting device including a light-emitting element mounted on a substrate and sealed with a glass. The method includes heating the glass by a first mold that is heated to a temperature higher than a yield point of the glass, the glass contacting the first mold, and pressing the glass against the light-emitting element mounted on the substrate supported by a second mold to seal the light-emitting element with the glass.

Abstract: A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.

Abstract: A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state component, and a glass sealing portion that seals the solid state component. The glass sealing portion is formed of a B2O3—SiO2—Li2O—Na2O—ZnO—Nb2O5 based glass, which is composed of 21 wt % to 23 wt % of B2O3, 11 wt % to 13 wt % of SiO2, 1 wt % to 1.5 wt % of Li2O, and 2 wt % to 2.5 wt % of Na2O.

Abstract: A light-emitting device includes a light source including an element mounting substrate, an LED element mounted thereon by flip-chip connection and a sealing portion for sealing the LED element on the element mounting substrate, and a light guide plate including a housing hole for housing the light source. The housing hole extends from one surface side to another surface side of the light guide plate and an area of an inner surface thereof on which light is incident from the light source is parallel to a thickness direction of the light guide plate. The light source is housed in the housing hole so that the element mounting substrate is located on the other surface side of the light guide plate, emits light toward the one surface side of the light guide plate in the housing hole and the inner surface side of the housing hole, and has an optical axis parallel to the thickness direction of the light guide plate.

Abstract: A method of manufacturing a light-emitting device includes a hole forming process for forming a through-hole that continues from a front surface to a back surface of a mounting substrate, a pattern forming process for continuously forming a circuit pattern on an inner surface of the through-hole in the mounting substrate, from an end portion of the through-hole on the front surface of the mounting substrate to a mounting portion of a light-emitting element, and on a periphery of the through-hole on the back surface of the mounting substrate, a mounting process for mounting the light-emitting element on the mounting portion, and a hot pressing process in that an inorganic material softened by heating is placed on the surface of the mounting substrate and is advanced into the through-hole while sealing the light-emitting element by pressing and bonding the inorganic material to the surface of the mounting substrate.

Abstract: A light source unit includes a light source portion including an LED element, a heat radiation portion that is connected to the light source portion, a case including an outside wall that is disposed apart from the light source portion and the heat radiation portion, and a spring member that is disposed between the outside wall of the case and the heat radiation portion.