Abstract: This dithiapolyether diol has a halogen content of less than 10 ppm and a purity of 80% or more and is represented by the following general formula (1) or (2).

Abstract: A tin alloy plating solution of the present invention includes (A) a soluble salt or oxide including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) a tin complexing agent formed of a sugar alcohol having 4 or more and 6 or less carbon atoms, (D) a free acid, and (E) an antioxidant. In addition, a content of the tin complexing agent is 0.1 g/L or more and 5 g/L or less, and a concentration of divalent tin ions (Sn2+) is 30 g/L or more.

Abstract: The tin alloy plating solution of the present invention includes (A) a soluble salt including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) an alkane sulfonic acid including 9 to 18 carbon atoms in a molecule or a salt thereof, (D) a non-ionic surfactant including one or more phenyl groups in a molecule, and (E) a leveling agent.

Abstract: The tin alloy plating solution of the present invention includes (A) a soluble salt including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) an alkane sulfonic acid including 9 to 18 carbon atoms in a molecule or a salt thereof, (D) a non-ionic surfactant including one or more phenyl groups in a molecule, and (E) a leveling agent.

Abstract: The plasma-resistant coating film according to the present invention is formed on a substrate, including crystalline Y2O3 particles having an average particle diameter of 0.5 ?m to 5.0 ?m in a SiO2 film, in which a film density of the plasma-resistant coating film is 90% or more, the film density being obtained by performing image analysis of a cross section of the film with an electron scanning microscope and by using the following expression (1), a size of pores in the film is 5 ?m or less in terms of diameter, and a peeling rate of the film from the substrate measured by performing a cross-cut test is 5% or less. Film density (%)=[(S1?S2)/S1]×100 (1). However, in the expression (1), S1 is an area of the film and S2 is an area of a pore portion in the film.

Abstract: The present invention provides a high-concentration tin sulfonate aqueous solution, in which a divalent tin ion (Sn2+) concentration is 360 g/L to 420 g/L, a tetravalent tin ion (Sn4+) concentration is 10 g/L or less, a free methanesulfonic acid concentration is 40 g/L or less, a Hazen unit color number (APHA) is 240 or less, and a turbidity is 25 FTU or less. This aqueous solution is produced such that stannous oxide powder whose temperature is adjusted to a temperature of 10° C. or lower is added to an aqueous methanesulfonic acid solution having a concentration of 60% by mass to 90% by mass when the aqueous solution circulates in a state of being maintained at the temperature of 10° C. or lower, and the stannous oxide powder is dissolved.

Abstract: This tin or tin alloy electroplating solution according to one aspect contains a soluble salt (A) including at least a stannous salt, one or more compounds (B) selected from the group consisting of an organic acid, an inorganic acid, and a salt thereof, a surfactant (C) that is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by the following General Formula (1), and a leveling agent (D). In General Formula (1), m is an integer of 1 to 3, n is an integer of 10 to 30, and X is a cation.

Abstract: The present invention provides a high-concentration tin sulfonate aqueous solution, in which a divalent tin ion (Sn2+) concentration is 360 g/L to 420 g/L, a tetravalent tin ion (Sn4+) concentration is 10 g/L or less, a free methanesulfonic acid concentration is 40 g/L or less, a Hazen unit color number (APHA) is 240 or less, and a turbidity is 25 FTU or less. This aqueous solution is produced such that stannous oxide powder whose temperature is adjusted to a temperature of 10° C. or lower is added to an aqueous methanesulfonic acid solution having a concentration of 60% by mass to 90% by mass when the aqueous solution circulates in a state of being maintained at the temperature of 10° C. or lower, and the stannous oxide powder is dissolved.

Abstract: The present invention provides a high-concentration tin sulfonate aqueous solution, in which a divalent tin ion (Sn2+) concentration is 360 g/L to 420 g/L, a tetravalent tin ion (Sn4+) concentration is 10 g/L or less, a free methanesulfonic acid concentration is 40 g/L or less, a Hazen unit color number (APHA) is 240 or less, and a turbidity is 25 FTU or less. This aqueous solution is produced such that stannous oxide powder whose temperature is adjusted to a temperature of 10° C. or lower is added to an aqueous methanesulfonic acid solution having a concentration of 60% by mass to 90% by mass when the aqueous solution circulates in a state of being maintained at the temperature of 10° C. or lower, and the stannous oxide powder is dissolved.

Abstract: The present invention provides a high-concentration tin sulfonate aqueous solution, in which a divalent tin ion (Sn2+) concentration is 360 g/L to 420 g/L, a tetravalent tin ion (Sn4+) concentration is 10 g/L or less, a free methanesulfonic acid concentration is 40 g/L or less, a Hazen unit color number (APHA) is 240 or less, and a turbidity is 25 FTU or less. This aqueous solution is produced such that stannous oxide powder whose temperature is adjusted to a temperature of 10° C. or lower is added to an aqueous methanesulfonic acid solution having a concentration of 60% by mass to 90% by mass when the aqueous solution circulates in a state of being maintained at the temperature of 10° C. or lower, and the stannous oxide powder is dissolved.

Abstract: A tin alloy plating solution includes a soluble tin salt, a soluble salt of a metal more noble than tin, and a sulfide compound represented by General Formula (1). In the General Formula (1), (A) is a hydrocarbon group including no oxygen atom and having 1 to 2 carbon atoms, or (A) is a hydrocarbon group including one or more oxygen atoms and having 2 to 6 carbon atoms. The metal which is more noble than tin is preferably silver, copper, gold or bismuth.

Abstract: This tin or tin alloy plating solution includes a soluble salt including at least a stannous salt (A), an acid selected from an organic acid and an inorganic acid or a salt thereof (B), a surfactant (C), benzalacetone (D), and a solvent (E), wherein the plating solution is used to form a pattern in which bump diameters are different from each other on a base material, an amount of the benzalacetone (D) is 0.05 g/L to 0.2 g/L, a mass ratio (C/D) of the surfactant (C) to the benzalacetone (D) is 10 to 200, and a mass ratio (E/D) of the solvent (E) to the benzalacetone (D) is 10 or more.

Abstract: A tin alloy plating solution includes a soluble tin salt, a soluble salt of a metal more noble than tin, and a sulfide compound represented by General Formula (1). In the General Formula (1), (A) is a hydrocarbon group including no oxygen atom and having 1 to 2 carbon atoms, or (A) is a hydrocarbon group including one or more oxygen atoms and having 2 to 6 carbon atoms. The metal which is more noble than tin is preferably silver, copper, gold or bismuth.

Abstract: This tin or tin alloy plating solution includes a soluble salt including at least a stannous salt (A), an acid selected from an organic acid and an inorganic acid or a salt thereof (B), a surfactant (C), benzalacetone (D), and a solvent (E), wherein the plating solution is used to form a pattern in which bump diameters are different from each other on a base material, an amount of the benzalacetone (D) is 0.05 g/L to 0.2 g/L, a mass ratio (C/D) of the surfactant (C) to the benzalacetone (D) is 10 to 200, and a mass ratio (E/D) of the solvent (E) to the benzalacetone (D) is 10 or more.

Abstract: The SnAg alloy plating solution of the invention is a SnAg alloy plating solution including a water-soluble tin compound, a water-soluble silver compound, and a particular sulfide compound in an amount in the range of 0.25 mol or more and 10 mol or less with respect to 1 mol of silver in the water-soluble silver compound.

Abstract: The SnAg alloy plating solution of the invention is a SnAg alloy plating solution including a water-soluble tin compound, a water-soluble silver compound, and a particular sulfide compound in an amount in the range of 0.25 mol or more and 10 mol or less with respect to 1 mol of silver in the water-soluble silver compound.

Abstract: A method for causing a computer to execute a process for managing health condition, the process includes: detecting a grounding timing of a leg of a quadruped and a timing of weight-shift to a rear side of the quadruped; and determining whether or not the leg of the quadruped has a disease or injury, based on the detected grounding timing of the leg of the quadruped and the detected timing of a weight-shift to the rear side of the quadruped.

Abstract: A method for causing a computer to execute a process for managing health condition, the process includes: detecting a grounding timing of a leg of a quadruped and a timing of weight-shift to a rear side of the quadruped; and determining whether or not the leg of the quadruped has a disease or injury, based on the detected grounding timing of the leg of the quadruped and the detected timing of a weight-shift to the rear side of the quadruped.

Abstract: To provide a process for a lithium-containing composite oxide for a positive electrode for a lithium secondary battery, which has a large volume capacity density and high safety, and is excellent in the charge and discharge cyclic durability and low temperature characteristics. A process for producing a lithium-containing composite oxide represented by the formula LipNxMyOzFa (wherein N is at least one element selected from the group consisting of Co, Mn and Ni, M is at least one element selected from the group consisting of Al, alkaline earth metal elements and transition metal elements other than N, 0.9?p?1.2, 0.95?x?2.00, 0<y?0.05, 1.9?z?4.2 and 0?a?0.

Abstract: A process for producing a lithium-containing composite oxide for a positive electrode active material for use in a lithium secondary battery, the oxide having the formula LipQqNxMyOzFa (wherein Q is at least one element selected from the group consisting of titanium, zirconium, niobium and tantalum, N is at least one element selected from the group consisting of Co, Mn and Ni, M is at least one element selected from the group consisting of Al, alkaline earth metal elements and transition metal elements other than Q and N, 0.9?p?1.1, 0?q<0.03, 0.97?x?1.00, 0?y<0.03, 1.9?z?2.1, q+x+y=1 and 0?a?0.02), which comprises firing a mixture of a lithium, Q element source and N element sources, and an M element source and/or fluorine source when these elements are present, in an oxygen-containing atmosphere, wherein the Q element source is a Q element compound aqueous solution having a pH of from 0.5 to 11.