Abstract: The present invention provides a charge-reversible phospholipid that is not positively charged at a pH of the body fluid (typically in the neutral range) and has low cytotoxicity. The present invention provides a phospholipid represented by formula (1): wherein m represents a natural number of 9 to 25, n represents a natural number of 10 to 15, X1, X2, and X3 are the same or different and each represent H or OH, and R1 represents the following formula (i) or (ii): wherein p represents 1 or 2, q represents 1 or 2, and r represents an integer of 1 to 4; or wherein s represents an integer of 1 to 3, and R2 represents a hydrogen atom or a hydrocarbon group.

Abstract: Provided is a charge-reversible and ethanol-soluble phospholipid suitable for the preparation of lipid particles. A phospholipid represented by formula (1): wherein R1 and R2 are the same or different and each represent a chain hydrocarbon group, R3 represents a hydrogen atom or a hydrocarbon group, and m represents an integer of 1 to 3.

Abstract: An object is to provide a lipid particle that is not positively charged at a pH of the body fluid (typically in the neutral range), and that enables efficient onset of the effect of a medicinal substance encapsulated in the lipid particle; and to provide a lipid for forming the lipid particle. The object is achieved by the phospholipid represented by formula (1), and a lipid particle containing the phospholipid: wherein R1 and R2 are identical or different, and represent a chain hydrocarbon group, m represents 1 or 2, n represents 1 or 2, and p represents an integer of 1 to 4.

Abstract: An object is to provide a lipid particle that is not positively charged at a pH of the body fluid (typically in the neutral range), and that enables efficient onset of the effect of a medicinal substance encapsulated in the lipid particle; and to provide a lipid for forming the lipid particle. The object is achieved by the phospholipid represented by formula (1), and a lipid particle containing the phospholipid: wherein R1 and R2 are identical or different, and represent a chain hydrocarbon group, m represents 1 or 2, n represents 1 or 2, and p represents an integer of 1 to 4.

Abstract: A leaf spring frame member (50) comprises: a plurality of leaf spring product parts (11A) each of which includes an outer frame part (11a), an inner frame part (11b) and spring parts (11c); and a support frame (51) which is arranged around the leaf spring product parts (11A) and supports the leaf spring product parts (11A). Each of the leaf spring product parts (11A) and the support frame (51) are connected to each other by connection parts (52). A breaking region (53), which is breakable, is formed in the connection part (52). An outer edge (53a) of the breaking region (53) is situated on the inside of an outer edge (11h) of the leaf spring product part (11A).

Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.

Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.

Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.

Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.

Abstract: A leaf spring frame member (50) comprises: a plurality of leaf spring product parts (11A) each of which includes an outer frame part (11a), an inner frame part (11b) and spring parts (11c); and a support frame (51) which is arranged around the leaf spring product parts (11A) and supports the leaf spring product parts (11A). Each of the leaf spring product parts (11A) and the support frame (51) are connected to each other by connection parts (52). A breaking region (53), which is breakable, is formed in the connection part (52). An outer edge (53a) of the breaking region (53) is situated on the inside of an outer edge (11h) of the leaf spring product part (11A).

Abstract: A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.

Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.

Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.

Abstract: A pressure-sensitive adhesive composition for PDP front filters includes 100 parts by weight of a high molecular weight acrylic polymer A having a COOH or OH group, a weight average molecular weight (Mw) of 400,000 to less than 800,000, a molecular weight distribution (Mw/Mn) of not more than 5 and a glass transition temperature (Tg-A) of ?40 to ?10° C., and 5 to 20 parts by weight of a low molecular weight acrylic polymer B having a weight average molecular weight (Mw) of 10,000 to 50,000, a molecular weight distribution (Mw/Mn) of not more than 5 and a glass transition temperature (Tg-B) of 40 to 120° C.; and is crosslinked to a gel fraction of 50 to 90% and has a 90° peel strength of 5 to 15 N/25 mm. The pressure-sensitive adhesive composition does not cause bonding failures such as lifting even when exposed to thermal cycles.

Abstract: Provided is a semiconductor device capable of preventing a semiconductor chip from being damaged by any sharp burrs of a metallic shielding plate. The semiconductor device includes a semiconductor chip and a metallic shielding plate provided on a circuit surface of the semiconductor chip. The metallic shielding plate is disposed in such a manner that a second surface of a shielding plate body is directed towards the circuit surface of the semiconductor chip, and burrs are positioned contiguous to the second surface of the shielding plate body. At distal ends of the burrs, cutting burrs are formed in a direction orthogonal to the second surface. The sharp burrs extend in a direction opposite to the semiconductor chip, so that the sharp burrs are prevented from damaging the circuit surface of the semiconductor chip.

Abstract: According to one embodiment, a printer includes a conveying mechanism, a first image forming unit and a coloring conversion mechanism. The conveying mechanism conveys a medium. The first image forming unit forms an image on the medium with a temperature-sensitive ink whose color changes depending on temperature. The coloring conversion mechanism converts a coloring state of the image with the temperature-sensitive ink by heating or cooling the image with the temperature-sensitive ink.

Abstract: An ink jet recording head comprising a discharge port for discharging an ink; and a sealing tape for sealing the discharge port; wherein the sealing tape includes a pressure-sensitive adhesive layer constituted of an acrylic crosslinked polymer formed by crosslinking an alkyl(meth)acrylate ester copolymer with a metal chelate compound, and is peelably adhered, through the pressure-sensitive adhesive layer, to a part where the discharge port is formed.

Abstract: A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.

Abstract: An object is to provide a pressure-sensitive adhesive composition for a polarizer that is excellent in durability and simultaneously is excellent in prevention of leakage of light, without the use of a high-energy light ray. The pressure-sensitive adhesive composition for a polarizer contains components (A) to (C) and having a gel fraction of 91% or more. (A) 100 parts by weight of an acrylic polymer that is obtained by copolymerizing at least the following monomer components (a1) to (a3), and has a weight average molecular weight of 500,000 to 2,000,000 and a ratio (Mw/Mn) of the weight average molecular weight (Mw) to a number average molecular weight (Mn) of 8 or less: (a1) 45 to 94.9% by mass of an alkyl (meth)acrylate ester monomer, (a2) 0.1 to 5% by mass of a carboxyl group-containing monomer, and (a3) 5 to 50% by mass of a benzene ring-containing monomer; (B) 4 to 12 parts by weight of a tolylene diisocyanate crosslinking agent; and (C) 0.

Abstract: A position controller includes a position control part that calculates a speed command on the basis of a difference between a position command and a rotation position of a motor, a PI control part that calculates a torque command on the basis of a speed difference between the speed command and a feedback speed, an observer that generates the feedback speed on the basis of the torque command and a rotation speed of the motor, a phase lead compensator that generates a phase lead compensation signal of the torque command on the basis of the speed command, and an adder that generates a new torque command by adding the phase lead compensation signal of the torque command to the torque command.