Patents by Inventor Koji TSUCHIBUCHI

Koji TSUCHIBUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240052206
    Abstract: A high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. The high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. MVR of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature TL to an upper-limit temperature TU is in a range from 1 to 300 cm3/10 min, where the lower-limit temperature TL (unit: degrees C.) is defined by a numerical formula (Numerical Formula 11) below and the upper-limit temperature TU (unit: degrees C.) is defined by a numerical formula (Numerical Formula 12) below, TL=(softening temperature TM of the high-frequency-dielectric-heating adhesive)+10 degrees C.??(Numerical Formula 11) TU=(thermal decomposition temperature TD of the high-frequency-dielectric-heating adhesive)?10 degrees C.??(Numerical Formula 12).
    Type: Application
    Filed: November 30, 2021
    Publication date: February 15, 2024
    Inventors: Koji TSUCHIBUCHI, Naoki TAYA
  • Publication number: 20240002711
    Abstract: A high-frequency-dielectric-heating adhesive for bonding three or more adherends to each other is provided. A dielectric property DP1 of the adhesive and a dielectric property DP2 of each of the adherends satisfy a numerical formula (Numerical Formula 1). The adherends are each an adherend having no flow start temperature or an adherend having the flow start temperature. A flow start temperature TF2 (degrees C.) of the adherends and a flow start temperature TF1 (degrees C.) of the adhesive satisfy a numerical formula (Numerical Formula 2). The dielectric properties DP1, DP2 are defined by values of dielectric properties (tan ?/??r), where tan ? and ??r are respectively a dielectric dissipation factor and a relative permittivity at 23 degrees C. and a frequency of 40.68 MHz, 0<DP1?DP2??(Numerical Formula 1) ?5?TF2?TF1??(Numerical Formula 2).
    Type: Application
    Filed: November 30, 2021
    Publication date: January 4, 2024
    Inventors: Naoki TAYA, Koji TSUCHIBUCHI
  • Publication number: 20230257636
    Abstract: A high-frequency dielectric heating adhesive sheet includes an adhesive layer. The adhesive layer contains a thermoplastic resin having a reactive site, a dielectric filler that generates heat upon application of a high-frequency electric field, and a silane coupling agent.
    Type: Application
    Filed: June 25, 2021
    Publication date: August 17, 2023
    Inventors: Koji TSUCHIBUCHI, Naoki TAYA
  • Publication number: 20230250316
    Abstract: An adhesive agent for high-frequency dielectric heating at least contains a thermoplastic resin and a dielectric filler that generates heat upon application of a high-frequency electric field. The thermoplastic resin at least contains a first thermoplastic resin and a second thermoplastic resin. The thermoplastic resin is a silane-modified thermoplastic resin. The second thermoplastic resin is a thermoplastic resin that is not silane-modified.
    Type: Application
    Filed: June 25, 2021
    Publication date: August 10, 2023
    Inventors: Koji TSUCHIBUCHI, Naoki TAYA
  • Publication number: 20230111471
    Abstract: A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan ?/?'r) of 0.005 or more, where tan ? is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ?'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.
    Type: Application
    Filed: March 31, 2021
    Publication date: April 13, 2023
    Inventors: Koji TSUCHIBUCHI, Naoki TAYA
  • Publication number: 20210008833
    Abstract: The present invention relates to a substrate for release sheet including a support, an adhesion layer (X1), and a resin layer (Y1) containing polyethylene having a density of 930 kg/m3 or more and 960 kg/m3 or less in this order, wherein convex portions are present on the surface of the resin layer (Y1), and a difference in height of the convex portions is 0.5 ?m or more.
    Type: Application
    Filed: March 13, 2019
    Publication date: January 14, 2021
    Applicant: LINTEC CORPORATION
    Inventors: Koji TSUCHIBUCHI, Kiichiro KATO
  • Publication number: 20200410902
    Abstract: The present invention relates to a peel detection label that is a laminate including a backing, a pattern layer formed in a part of the surface of the backing, and a pressure sensitive adhesive laminate having at least a pressure sensitive adhesive layer (X) and a substrate layer (Y) laminated in this order thereon, and satisfying the following requirement (1), wherein an elastic modulus of the substrate layer (Y) is 10 MPa or more and 800 MPa or less: Requirement (1): On attaching the peel detection label onto an adherend and then peeling it from the adherend, interfacial peeling occurs between the backing and the pattern layer, whereby the presence or absence of peeling of the peel detection label from the adherend becomes visually detectable.
    Type: Application
    Filed: August 9, 2018
    Publication date: December 31, 2020
    Applicant: LINTEC CORPORATION
    Inventors: Koji TSUCHIBUCHI, Yumiko AMINO, Yasuyuki AMANO, Takashi YAMAMOTO
  • Patent number: 10682657
    Abstract: Provided are a pressure sensitive adhesive sheet including, on a substrate, a resin layer containing a resin which is a resin layer containing a resin part (X) containing a resin as a main component and a particle part (Y) consisting of fine particles, at least a surface (?) of the resin layer on the side opposite to the side thereof on which the substrate is provided, having pressure sensitive adhesiveness, wherein a bending stress coefficient k in the MD direction of the substrate is 20 N·mm or less, a 10% elongation strength in the MD direction thereof is 260 N/15 mm or less, and concave portions satisfying specified requirements are included on the surface (?) of the resin layer; and a method for producing the pressure sensitive adhesive sheet.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: June 16, 2020
    Assignee: LINTEC CORPORATION
    Inventors: Koji Tsuchibuchi, Kazue Uemura, Kiichiro Kato
  • Patent number: 10676649
    Abstract: A pressure sensitive adhesive sheet including, on a substrate or a release material, a resin layer, at least a surface (?) of the resin layer on the opposite to the side on which the substrate or release material is provided having pressure sensitive adhesiveness, wherein a concave portion and a flat face exist on the surface (?) of the resin layer, and a width of the concave portion observed from the side of the surface (?) is non-uniform, and in a region (D) of 8 mm in length×10 mm in width as freely-selected on the surface (?), a concave portion having an area of 70 to 99.99% relative to 100% of a total area of the concave portions existing in the region (D) exists.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: June 9, 2020
    Assignee: LINTEC CORPORATION
    Inventors: Kazue Uemura, Kiichiro Kato, Yumiko Amino, Koji Tsuchibuchi, Takamasa Kase, Yusuke Matsuoka
  • Patent number: 10221339
    Abstract: A pressure sensitive adhesive sheet including, on a substrate or a release material, a resin layer including a resin part (X) containing a resin as a main component, and a particle part (Y) consisting of fine particles and having a surface (?) having pressure sensitive adhesiveness and one or more concave portions. When the surface (?) of the resin layer is adhered to a smooth surface of a light transmissive adherend to give a laminate, the areal ratio (S1) of the attached area adhered to the smooth surface to the surface (?) is 10 to 95% at 23° C. and 50% RH, and the area increase rate {[(S2?S1)/S1]×100} is ?10 to 20% after heating of the smooth surface by statically leaving the laminate at 80° C. for 30 minutes.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: March 5, 2019
    Assignee: LINTEC CORPORATION
    Inventors: Satoshi Kawada, Kiichiro Kato, Kazue Uemura, Yumiko Amino, Shigeru Saito, Koji Tsuchibuchi, Takamasa Kase
  • Publication number: 20180265749
    Abstract: A pressure sensitive adhesive sheet including, on a substrate or a release material, a resin layer, at least a surface (?) of the resin layer on the opposite to the side on which the substrate or release material is provided having pressure sensitive adhesiveness, wherein a concave portion and a flat face exist on the surface (?) of the resin layer, and a width of the concave portion observed from the side of the surface (?) is non-uniform, and in a region (D) of 8 mm in length×10 mm in width as freely-selected on the surface (?), a concave portion having an area of 70 to 99.99% relative to 100% of a total area of the concave portions existing in the region (D) exists.
    Type: Application
    Filed: September 27, 2016
    Publication date: September 20, 2018
    Applicant: LINTEC CORPORATION
    Inventors: Kazue UEMURA, Kiichiro KATO, Yumiko AMINO, Koji TSUCHIBUCHI, Takamasa KASE, Yusuke MATSUOKA
  • Publication number: 20180264489
    Abstract: Provided are a pressure sensitive adhesive sheet including, on a substrate, a resin layer containing a resin which is a resin layer containing a resin part (X) containing a resin as a main component and a particle part (Y) consisting of fine particles, at least a surface (?) of the resin layer on the side opposite to the side thereof on which the substrate is provided, having pressure sensitive adhesiveness, wherein a bending stress coefficient k in the MD direction of the substrate is 20 N·mm or less, a 10% elongation strength in the MD direction thereof is 260 N/15 mm or less, and concave portions satisfying specified requirements are included on the surface (?) of the resin layer; and a method for producing the pressure sensitive adhesive sheet.
    Type: Application
    Filed: September 27, 2016
    Publication date: September 20, 2018
    Applicant: LINTEC CORPORATION
    Inventors: Koji TSUCHIBUCHI, Kazue UEMURA, Kiichiro KATO
  • Publication number: 20170210949
    Abstract: A pressure sensitive adhesive sheet containing, on a substrate or a release material, a resin layer that includes a resin part (X) containing a resin as a main component, and a particle part (Y) consisting of fine particles, at least a surface (?) of the resin layer being opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein one or more concave portions exist on the surface (?), and when the surface (?) of the resin layer is adhered to a smooth surface of a light transmissive adherend having a smooth surface to give a laminate, the pressure sensitive adhesive sheet satisfies the following requirements (1) and (2). Requirement (1): in an environment at 23° C. and 50% RH, the areal ratio (S1) of the attached area against the smooth surface of the light transmissive adherend to the surface (?) before heating is 10 to 95%. Requirement (2): after the laminate is statically left in an environment at 80° C.
    Type: Application
    Filed: April 2, 2015
    Publication date: July 27, 2017
    Applicant: LINTEC CORPORATION
    Inventors: Satoshi KAWADA, Kiichiro KATO, Kazue UEMURA, Yumiko AMINO, Shigeru SAITO, Koji TSUCHIBUCHI, Takamasa KASE
  • Publication number: 20170174947
    Abstract: Provided is a pressure sensitive adhesive sheet containing, on a substrate or a release material, a resin layer formed of a multilayer structure of three or more layers including a fine particle-containing layer that contains fine particles in an amount of 15% by mass or more, at least a surface (?) of the resin layer being opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein the fine particle-containing layer is formed not as the outermost layer of the resin layer, and one or more concave portions exist on the surface (?) and the shapes of the one or more concave portions have irregular shapes. When attached to an adherend, the pressure sensitive adhesive sheet can exhibit excellent air escape property of readily removing air accumulation which may be formed, good blister resistance and good pressure sensitive adhesion characteristics.
    Type: Application
    Filed: April 2, 2015
    Publication date: June 22, 2017
    Applicant: LINTEC CORPORATION
    Inventors: Kiichiro KATO, Kazue UEMURA, Yumiko AMINO, Shigeru SAITO, Koji TSUCHIBUCHI, Yoshitomo ONO
  • Publication number: 20170174943
    Abstract: Provided is a pressure sensitive adhesive sheet containing a resin layer on a substrate or a release material, at least a surface (?) of the resin layer being opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein one or more concave portions formed not by transferring an emboss pattern exist on the surface (?).
    Type: Application
    Filed: April 2, 2015
    Publication date: June 22, 2017
    Applicant: LINTEC CORPORATION
    Inventors: Kiichiro KATO, Kazue UEMURA, Yumiko AMINO, Shigeru SAITO, Koji TSUCHIBUCHI, Masaru MATSUSHIMA