Patents by Inventor Koji Tsujimura

Koji Tsujimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7988803
    Abstract: A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.
    Type: Grant
    Filed: January 8, 2010
    Date of Patent: August 2, 2011
    Assignee: Fujifilm Corporation
    Inventors: Kosuke Takasaki, Kiyofumi Yamamoto, Kazuo Okutsu, Koji Tsujimura
  • Publication number: 20100108237
    Abstract: A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.
    Type: Application
    Filed: January 8, 2010
    Publication date: May 6, 2010
    Applicant: Fuji Photo Film Co., Ltd.
    Inventors: Kosuke TAKASAKI, Kiyofumi Yamamoto, Kazuo Okutsu, Koji Tsujimura
  • Patent number: 7678211
    Abstract: A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: March 16, 2010
    Assignee: FUJIFILM Corporation
    Inventors: Kosuke Takasaki, Kiyofumi Yamamoto, Kazuo Okutsu, Koji Tsujimura
  • Publication number: 20070194438
    Abstract: A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.
    Type: Application
    Filed: March 23, 2005
    Publication date: August 23, 2007
    Inventors: Kosuke Takasaki, Kiyofumi Yamamoto, Kazuo Okutsu, Koji Tsujimura
  • Patent number: 7032361
    Abstract: A system for automatically packaging photosensitive rolls includes a flanged member installing device for selecting flanged members corresponding to a photosensitive roll and automatically installing the flanged members respectively on opposite ends of the photosensitive roll, a tape member applying device for automatically applying a joint tape to an end of the photosensitive roll, a packaging sheet working device for automatically processing light-shielding leaders to dimensions corresponding to the photosensitive roll, an applying mechanism for automatically applying the processed light-shielding leaders to the photosensitive roll, and a packaging sheet takeup device for automatically winding the light-shielding leaders around the photosensitive roll.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: April 25, 2006
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Norihiro Kadota, Kazuo Okutsu, Koji Tsujimura, Katsumi Tashiro, Kunihiro Sumida
  • Patent number: 7003221
    Abstract: A packaging apparatus has hot air supply mechanisms disposed in association with light-shielding shrinkable films wound on a rolled photosensitive material sheet, for ejecting hot air locally to the light-shielding shrinkable films, and a drive mechanism for relatively rotating the hot air supply mechanisms along an outer circumferential surface of the rolled photosensitive material sheet.
    Type: Grant
    Filed: July 26, 2004
    Date of Patent: February 21, 2006
    Assignee: Fuji Photo Film Co., Ltd.
    Inventor: Koji Tsujimura
  • Patent number: 6860087
    Abstract: A packaging apparatus has hot air supply mechanisms disposed in association with light-shielding shrinkable films wound on a rolled photosensitive material sheet, for ejecting hot air locally to the light-shielding shrinkable films, and a drive mechanism for relatively rotating the hot air supply mechanisms along an outer circumferential surface of the rolled photosensitive material sheet.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: March 1, 2005
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Norihiro Kadota, Koji Tsujimura, Koichi Nakatogawa, Kunihiro Sumida
  • Publication number: 20050008349
    Abstract: A packaging apparatus has hot air supply mechanisms disposed in association with light-shielding shrinkable films wound on a rolled photosensitive material sheet, for ejecting hot air locally to the light-shielding shrinkable films, and a drive mechanism for relatively rotating the hot air supply mechanisms along an outer circumferential surface of the rolled photosensitive material sheet.
    Type: Application
    Filed: July 26, 2004
    Publication date: January 13, 2005
    Inventor: Koji Tsujimura
  • Publication number: 20030115835
    Abstract: A system for automatically packaging photosensitive rolls includes a flanged member installing device for selecting flanged members corresponding to a photosensitive roll and automatically installing the flanged members respectively on opposite ends of the photosensitive roll, a tape member applying device for automatically applying a joint tape to an end of the photosensitive roll, a packaging sheet working device for automatically processing light-shielding leaders to dimensions corresponding to the photosensitive roll, an applying mechanism for automatically applying the processed light-shielding leaders to the photosensitive roll, and a packaging sheet takeup device for automatically winding the light-shielding leaders around the photosensitive roll.
    Type: Application
    Filed: December 26, 2002
    Publication date: June 26, 2003
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Norihiro Kadota, Kazuo Okutsu, Koji Tsujimura, Katsumi Tashiro, Kunihiro Sumida
  • Publication number: 20020059782
    Abstract: A packaging apparatus has hot air supply mechanisms disposed in association with light-shielding shrinkable films wound on a rolled photosensitive material sheet, for ejecting hot air locally to the light-shielding shrinkable films, and a drive mechanism for relatively rotating the hot air supply mechanisms along an outer circumferential surface of the rolled photosensitive material sheet.
    Type: Application
    Filed: August 31, 2001
    Publication date: May 23, 2002
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Norihiro Kadota, Koji Tsujimura, Koichi Nakatogawa, Kunihiro Sumida