Abstract: A resin composition comprising (a) at least one resin selected from polyimides and polyimide precursors, and (b) a solvent, wherein the loss tangent (tan ?), represented by the following formula (I) and determined by a dynamic viscoelasticity measurement under the conditions of a temperature of 22° C. and an angular frequency of 10 rad/s, is 150 or more and less than 550, provides a resin composition which has no defects such as rupture of the film when the coated film is dried under reduced pressure, and has good film thickness uniformity and mechanical properties when formed into a film. tan ?=G?/G???(I) (wherein G? represents the storage elastic modulus of the resin composition, and G? represents the loss elastic modulus of the resin composition.

Abstract: A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25° C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.

Abstract: A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25° C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.

Abstract: A resin composition includes an (a) resin having a structure represented by Chemical Formula (1); and a (b) solvent. The resin composition also includes an amount of a compound represented by Chemical Formula (3) which is 0.1 ppm by mass or more and 40 ppm by mass or less.

Abstract: The present invention provides a light emitting device material containing a compound having a specific pyrene structure, capable of providing an organic thin-film light emitting device which enables high-efficiency light emission and low-voltage driving, and is also excellent in durability; and a light emitting device using the same.

Abstract: The present invention relates to an organic thin-film light emitting device containing an organic compound represented by formula (1) and a donor compound. the light emitting device can achieve both of the low-voltage driving operation and high luminance efficiency. YA1-Ar)n1??(1) (Y represents either substituted or unsubstituted pyrene, or substituted or unsubstituted anthracene. A1 is selected from the group consisting of a single bond, an arylene group, and a hetero arylene group. Ar is selected from the group consisting of a carbazolyl group, a dibenzofuranyl group, and a dibenzothiophenyl group. These groups may be substituted or unsubstituted, and n1 is an integer of 1 to 3.).

Abstract: The present invention relates to an organic thin-film light emitting device containing an organic compound represented by formula (1) and a donor compound. the light emitting device ca achieve both of the low-voltage driving operation and high luminance efficiency. Y?A1-Ar)n1??(1) (Y represents either substituted or unsubstituted pyrene, or substituted or unsubstituted anthracene. A1 is selected from the group consisting of a single bond, an arylene group, and a hetero arylene group. Ar is selected from the group consisting of a carbazolyl group, a dibenzofuranyl group, and a dibenzothiophenyl group. These groups may be substituted or unsubstituted, and n1 is an integer of 1 to 3.

Abstract: A chip type solid electrolytic capacitor of the present invention has a section formed in a step-wise manner on a cathode lead frame that is connected with a capacitor element. An anode lead wire of the capacitor element is resistance welded to the top of a reversed V-letter shaped structure formed by folding part of an anode lead frame into halves. Further, with the chip type solid electrolytic capacitor of the present invention, part of respective cathode and anode lead frames is exposed outside in such a way as being made flush with the periphery of a resin package, thereby each serving as a terminal. Accordingly, a space problem due to the terminals has been eliminated and the anode lead wire can be made short, thus allowing the volume of a capacitor element employed to be increased. As a result, a chip type solid electrolytic capacitor having a large capacity with its outer dimensions is kept the same as a prior art capacitor can be obtained.

Abstract: A chip-type solid electrolytic capacitor includes a cathode conductive layer provided on a whole surface of a cathode layer formed on an outer surface of a capacitor element, which whole surface is opposite to a surface where an anode lead wire is lead out, and on a surface adjacent to the first-mentioned whole surface. With this arrangement, if the capacitor element is obliquely inserted into a mold during the formation of a resin shell, the inner walls of the mold will not come into contact with cathode layer of the capacitor element, but will instead come into contact with the cathode conductive layer to prevent the cathode layer from being exposed to the resin shell. As a result, any possible damage to the cathode layer of the capacitor element when the peripheral surface of the resin shell on a cathode side is subjected to roughening is prevented to eliminate defects in electric characteristics such as leakage of electric current and a tan.delta. value.