Patents by Inventor Koji Yamabe

Koji Yamabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper foil inspection device copper foil inspection method defect inspection device and defeat inspection method
    Patent number: 7286234
    Abstract: A surface of copper foil wound onto a guide roller 26 is irradiated with light. Specular light from the copper foil surface is received by CCD cameras 14a, and scattered light from the copper foil surface is received by CCD cameras 14b. When, in a region in which the amount of specular light received by the CCD cameras 14a is equal to or larger than a first threshold, a portion having a luminance equal to or larger than a second threshold is present, and when the amount of scattered light received by the CCD cameras 14b is smaller than a luminance average, that region is determined to be a defective copper portion.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: October 23, 2007
    Assignees: Kokusai Gijutsu Kaihatsu Co. Ltd., Mitsui Mining & Smelting Co. Ltd.
    Inventors: Qing Wei Zhou, Jun Fujiwara, Koji Yamabe, Ayumu Inoue
  • Copper foil inspection device copper foil inspection method defect inspection device and defeat inspection method
    Publication number: 20060109466
    Abstract: A surface of copper foil wound onto a guide roller 26 is irradiated with light. Specular light from the copper foil surface is received by CCD cameras 14a, and scattered light from the copper foil surface is received by CCD cameras 14b. When, in a region in which the amount of specular light received by the CCD cameras 14a is equal to or larger than a first threshold, a portion having a luminance equal to or larger than a second threshold is present, and when the amount of scattered light received by the CCD cameras 14b is smaller than a luminance average, that region is determined to be a defective copper portion.
    Type: Application
    Filed: December 12, 2002
    Publication date: May 25, 2006
    Inventors: Qing Zhou, Jun Fujiwara, Koji Yamabe, Ayumu Inoue