Patents by Inventor Koji YOKOSAWA

Koji YOKOSAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11542377
    Abstract: Provided are an expandable or bendable circuit board having good body-contact feel, strong against bending and folding, and an electronic device made therefrom. The bendable circuit board includes: a film comprising a polyurethane synthesized by reacting a long-chain polyol with polyisocyanate and having a storage modulus at 25° C. of 20 to 200 MPa, a tensile strength of 20 to 80 MPa, and an elongation at break of 500 to 900%, and the temperature of which the storage elastic modulus reaches to 1 MPa is at 155° C. or higher; and circuit wiring formed in contact with a surface of the film. Alternatively, an expandable circuit board having the ratio ?/?0 of the specific electrical resistance ? of the circuit wiring when the circuit wiring is expanded to the specific electrical resistance (?·cm) ?0 of the circuit wiring before the circuit wiring is expanded is within a range of 1.05 to 10.0.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: January 3, 2023
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Tadahiro Sunaga, Jun Okabe, Shizuo Tokito, Koji Yokosawa
  • Publication number: 20220002507
    Abstract: Provided are an expandable or bendable circuit board having good body-contact feel, strong against bending and folding, and an electronic device made therefrom. The bendable circuit board includes: a film comprising a polyurethane synthesized by reacting a long-chain polyol with polyisocyanate and having a storage modulus at 25° C. of 20 to 200 MPa, a tensile strength of 20 to 80 MPa, and an elongation at break of 500 to 900%, and the temperature of which the storage elastic modulus reaches to 1 MPa is at 155° C. or higher; and circuit wiring formed in contact with a surface of the film. Alternatively, an expandable circuit board having the ratio ?/?0 of the specific electrical resistance ? of the circuit wiring when the circuit wiring is expanded to the specific electrical resistance (?·cm) ?0 of the circuit wiring before the circuit wiring is expanded is within a range of 1.05 to 10.0.
    Type: Application
    Filed: October 25, 2019
    Publication date: January 6, 2022
    Inventors: Tadahiro SUNAGA, Jun OKABE, Shizuo TOKITO, Koji YOKOSAWA